摘要:
Provided is a film adhesive that has a high flexibility and a high adhesion strength and is easy to prepare by mixing. The film adhesive contains, as essential components, a bisphenol A phenoxy resin having a molecular weight of 30,000 or more, an epoxy resin having a molecular weight of 500 or less, a glycidyl methacrylate copolymer, a rubber-modified epoxy resin, and a latent hardener. Preferably, the weight of the glycidyl methacrylate copolymer per epoxy equivalent is 1000 or less.
摘要:
An object is to obtain a module in which an optical fiber can be inserted after a ferrule has been mounted on a circuit board. There is provided an optical module (100) in which at least a ferrule (33) and an electric component (57) are mounted on a circuit board (35) on which external electrodes (63) have been mounted; a fiber through-hole is formed in the ferrule (33) in a position in which the optoelectric conversion device (31) is mounted on one end surface and that corresponds to an active layer of an optoelectric conversion device (31); and the optoelectric conversion device (31) of the ferrule (33) is electrically connected to the electric component (57). In the ferrule (33), an opening in the one end face of the fiber through-hole that faces the optoelectric conversion device (31) is blocked by a transparent substance (61), and a portion that excludes the fiber through-hole at the other end surface is are monolithically covered with a molding resin (55).
摘要:
In order to easily control the laser pulse width and perform high-precision processing, the method for processing a material by laser ablation according to the present invention is characterized in that the material having a region of which a double logarithmic chart shows a linearly-shaped line with a gradient of not more than 0.5, when a relationship between laser pulse width and ablation threshold is represented in the logarithmic chart with a laser pulse width in picosecond plotted along the horizontal axis and an ablation threshold in J/cm2 plotted along the vertical axis, is processed by the pulsed laser beam having the laser pulse width within the region.
摘要翻译:为了容易地控制激光脉冲宽度并执行高精度处理,根据本发明的通过激光烧蚀处理材料的方法的特征在于,具有双对数图的区域的材料呈直线状 以激光脉冲宽度和消融阈值之间的关系在对数图中以沿着水平轴绘制的皮秒的激光脉冲宽度表示,并且以纵向绘制的消光阈值(J / cm 2)绘制在不大于0.5的梯度上 由具有该区域内的激光脉冲宽度的脉冲激光束进行处理。
摘要:
In a composite porous resin base material, a porous resin film is provided with a functional section whereupon an electrode and/or a circuit is formed. On the periphery surrounding the functional section, a step having a height different from that of the functional section is formed, and a frame plate is arranged on a plane of the step. Provided is the composite porous resin base material which has a structure wherein the frame plate having rigidity is attached to the porous resin base material whereupon the electrode and/or a circuit is formed without deteriorating characteristics such as elasticity and conductivity of the porous resin base material.
摘要:
A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.
摘要:
An anisotropic conductive film 2 contains electrically conductive particles 6 dispersed in an adhesive agent 30 for electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100° C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90° C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 μm or less, when electrodes are connected with the anisotropic conductive film.
摘要:
The invention offers an anisotropic electroconductive sheet suitable for connecting with pin electrodes of a through-hole-mounting type. The sheet has electrical conductivity in the direction of thickness. The sheet comprises a base film formed using a porous film (1) that is made of synthetic resin and that has electrically insulating property. The porous film (1) is provided with a plurality of holes (3) that are formed in the direction of thickness so that pin electrodes (2) can be through-hole-mounted. The inner walls of the holes (3) are coated with metals (4). The inserted pin electrodes (2) become electrically continuous, through the metals (4), with the surface opposite to the surface from which the pin electrodes (2) are inserted. It is desirable that a porous film have, at the side from which the electrodes are through-hole-mounted, a nonporous film that is made of synthetic resin and that has electrically insulating property and the nonporous film be provided with a plurality of holes that are formed in the direction of thickness so that the pin electrodes can be through-hole-mounted.
摘要:
A porous resin substrate and a manufacturing method thereof. The substrate comprises a porous resin film having at least one functional part including electrodes or circuits, or both of them, and the porous resin film has a height-altered part, the height of which is different from the height of the functional part.
摘要:
Provided is an anisotropic conductive sheet (8) having heat resistance and cold resistance and suitable for connection of electrodes. The anisotropic conductive sheet of the present invention has conductivity in the thickness direction, wherein the base film (1), which is a film made of synthetic resin having an electrical insulation property, has a plurality of holes (3) formed in the thickness direction, and the holes (3) are open to one main surface of the base film and closed to the other main surface, wherein a metal is adhered to the closed parts (2a) and the inner walls (2b) of the holes (3) so that by contacting electrodes (7) with the closed parts (2a) respectively from the outside, the electrodes (7) can electrically be connected through the adhered metal to the main surface where the holes (3) are open.