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公开(公告)号：US20200110231A1
公开(公告)日：2020-04-09
申请号：US16486411
申请日：2017-12-28
Applicant: FUJIKURA LTD.
Inventor： Yohei Kasai
Abstract: An optical module including: a plurality of light emitting elements disposed on a same plane; a plurality of mirrors that reflect each light emitted from each of the plurality of light emitting elements; and a condenser lens into which each of the lights reflected by the plurality of mirrors enters. The plurality of mirrors reflects each of the lights emitted from each of the plurality of light emitting elements in a direction inclined with respect to a plane and aligns the light in a fast axis direction. Each of the lights emitted from the plurality of light emitting elements is reflected by the plurality of mirrors away from one another in the fast axis direction and is condensed at one point to reduce an aberration of light compared to a case where each of the lights enters into the condenser lens while propagating parallel to one another.
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公开(公告)号：US09158078B2
公开(公告)日：2015-10-13
申请号：US14104507
申请日：2013-12-12
Applicant: Fujikura Ltd.
Inventor： Nozomu Toyohara , Akira Sakamoto , Yohei Kasai
CPC classification number: G02B6/4272 , G02B6/4207 , G02B6/4219 , G02B6/4236 , G02B6/4238 , G02B6/4246 , G02B6/4248 , G02B6/4257 , G02B6/426 , G02B6/4265 , G02B6/4267 , H01L2224/48091 , H01L2224/49175 , H01S5/02208 , H01S5/02236 , H01S5/02272 , H01S5/02284 , H01S5/02476 , H01L2924/00014
Abstract: The semiconductor laser module (1) includes: a laser mount (31) having thereon a semiconductor laser chip (32); a fiber mount (40) having thereon an optical fiber (2); a submount (20) on which the laser mount (31) and the fiber mount (40) are placed; and a substrate (10) on which the submount 20 is placed, the substrate (10) having protrusions (11a to 11d) on a top surface thereof, the submount 20 being joined to the substrate (10) with a soft solder (61) spread between the submount (20) and the substrate (10).
Abstract translation: 半导体激光器模块（1）包括：激光器安装件（31），其上具有半导体激光器芯片（32）; 具有光纤（2）的光纤安装座（40）; 激光装置（31）和光纤支架（40）放置在其上的基座（20） 和基板（10），基板（10）在基板（10）上放置有基板（10），基板（10）在其顶面上具有突起（11a〜11d），基座（20）用软焊料（61）接合到基板（10） 分布在基座（20）和基板（10）之间。
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公开(公告)号：US20140105538A1
公开(公告)日：2014-04-17
申请号：US14104507
申请日：2013-12-12
Applicant: Fujikura Ltd.
Inventor： Nozomu Toyohara , Akira Sakamoto , Yohei Kasai
IPC: G02B6/42
CPC classification number: G02B6/4272 , G02B6/4207 , G02B6/4219 , G02B6/4236 , G02B6/4238 , G02B6/4246 , G02B6/4248 , G02B6/4257 , G02B6/426 , G02B6/4265 , G02B6/4267 , H01L2224/48091 , H01L2224/49175 , H01S5/02208 , H01S5/02236 , H01S5/02272 , H01S5/02284 , H01S5/02476 , H01L2924/00014
Abstract: The semiconductor laser module (1) includes: a laser mount (31) having thereon a semiconductor laser chip (32); a fiber mount (40) having thereon an optical fiber (2); a submount (20) on which the laser mount (31) and the fiber mount (40) are placed; and a substrate (10) on which the submount 20 is placed, the substrate (10) having protrusions (11a to 11d) on a top surface thereof, the submount 20 being joined to the substrate (10) with a soft solder (61) spread between the submount (20) and the substrate (10).
Abstract translation: 半导体激光器模块（1）包括：激光器安装件（31），其上具有半导体激光器芯片（32）; 具有光纤（2）的光纤安装座（40）; 激光装置（31）和光纤支架（40）放置在其上的基座（20） 和基板（10），基板（10）在基板（10）上放置有基板（10），基板（10）在其顶面上具有突起（11a〜11d），基座（20）用软焊料（61）接合到基板（10） 分布在基座（20）和基板（10）之间。
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公开(公告)号：US20140097232A1
公开(公告)日：2014-04-10
申请号：US14103050
申请日：2013-12-11
Applicant: Fujikura Ltd.
Inventor： Nozomu Toyohara , Akira Sakamoto , Yohei Kasai
IPC: B23K1/00
CPC classification number: B23K1/00 , B23K35/26 , B23K35/262 , B23K35/30 , B23K35/3013 , C22C5/02 , C22C13/00 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/03444 , H01L2224/0346 , H01L2224/04026 , H01L2224/05568 , H01L2224/05644 , H01L2224/29111 , H01L2224/32225 , H01L2224/75251 , H01L2224/83101 , H01L2224/83193 , H01L2224/83805 , H01L2224/83825 , H01L2924/00014 , H01L2924/01322 , H01L2924/12042 , H01L2924/351 , H01S5/02208 , H01S5/02272 , H01S5/02284 , H01S5/02476 , H05K3/3463 , H01L2924/01079 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
Abstract: A bonding method of the present invention is a method of bonding two members (A and B) to each other with use of an Au—Sn solder. According to the bonding method of the present invention, after the bonding, an Au—Sn solder (S′) has weight percent of Sn which is not less than 38.0 wt % but not more than 82.3 wt %.
Abstract translation: 本发明的接合方法是使用Au-Sn焊料将两个部件（A和B）彼此接合的方法。 根据本发明的接合方法，接合后，Au-Sn焊料（S'）的重量百分比为不小于38.0重量％但不大于82.3重量％的Sn。
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公开(公告)号：US12191629B2
公开(公告)日：2025-01-07
申请号：US17601615
申请日：2020-03-16
Applicant: FUJIKURA LTD.
Inventor： Yoshihiro Tabata , Yohei Kasai
IPC: H01S5/0239 , H01S5/02251
Abstract: A laser module includes an optical fiber, a laser device, an optical system, a housing, a lead terminal, a conductive wire, and an insulation member. The laser device emits a laser beam. The optical system couples the laser beam, emitted from the laser device, to the optical fiber. The housing includes a base plate on which the laser device is fixed and a side wall that includes an opening. The lead terminal extends from an outside of the housing through the opening of the side wall into the housing. The conductive wire electrically connects a connecting portion of the lead terminal, located within the housing, to the laser device. The insulation member includes a seal portion and an extension portion.
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Patent Agency Ranking
公开(公告)号：US20220181842A1
公开(公告)日：2022-06-09
申请号：US17601615
申请日：2020-03-16
Applicant: FUJIKURA LTD.
Inventor： Yoshihiro Tabata , Yohei Kasai
IPC: H01S5/0239 , H01S5/02251
Abstract: A laser module includes an optical fiber, a laser device, an optical system, a housing, a lead terminal, a conductive wire, and an insulation member. The laser device emits a laser beam. The optical system couples the laser beam, emitted from the laser device, to the optical fiber. The housing includes a base plate on which the laser device is fixed and a side wall that includes an opening. The lead terminal extends from an outside of the housing through the opening of the side wall into the housing. The conductive wire electrically connects a connecting portion of the lead terminal, located within the housing, to the laser device. The insulation member includes a seal portion and an extension portion.
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公开(公告)号：US20210066891A1
公开(公告)日：2021-03-04
申请号：US16958355
申请日：2018-12-26
Applicant: FUJIKURA LTD.
Inventor： Ken Katagiri , Yohei Kasai
Abstract: A semiconductor laser module includes: an optical fiber that outputs a first laser beam to an exterior of the semiconductor laser module; semiconductor laser devices each including an emission portion that emits a second laser beam, an electrically conductive portion that supplies electric power to the emission portion, and a mount on which the emission portion and the electrically conductive portion are disposed; a mount base including mount surfaces that form steps; and an optical system that optically couples the second laser beams from the emission portions to an incident end face of the optical fiber. The mounts of the semiconductor laser devices are disposed on the mount surfaces. The semiconductor laser devices include an upper semiconductor laser device and a lower semiconductor laser device adjacent to each other in a step direction of the mount base.
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公开(公告)号：US20190049676A1
公开(公告)日：2019-02-14
申请号：US16079684
申请日：2016-12-01
Applicant: FUJIKURA LTD.
Inventor： Yohei Kasai
IPC: G02B6/42
CPC classification number: G02B6/4213 , G02B6/27 , G02B6/42 , G02B6/4206 , G02B27/0905 , G02B27/106 , G02B27/143 , G02B27/283 , H01S5/005 , H01S5/0071 , H01S5/02284 , H01S5/4012
Abstract: To increase the reliability of an LD module without decreasing the efficiency of coupling between the laser diode and the optical fiber, an LD module (1) includes a light-guiding device mounted therein that includes (i) a dividing optical system (DM) configured to divide a laser beam so as to generate a partial beam group and (ii) a compositing optical system (RM1, RM2, PRE, PBC) configured to composite the partial beam group so as to generate a partial beam bundle including a plurality of partial beams each having an S axis parallel to a particular spatial axis.
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公开(公告)号：US09774171B2
公开(公告)日：2017-09-26
申请号：US14435226
申请日：2013-09-25
Applicant: FUJIKURA LTD.
Inventor： Yohei Kasai , Susumu Nakaya , Shinichi Sakamoto
CPC classification number: H01S5/4012 , G02B5/10 , G02B6/4214 , G02B6/425 , G02B6/4296 , G02B27/10 , G02B27/106 , G02B27/12 , H01S5/005 , H01S5/0071 , H01S5/02252 , H01S5/02284 , H01S5/4031 , H01S5/4075
Abstract: A multiplexer includes: an output section outputting a beam bundle made of a plurality of laser beams whose F-axis directions are aligned; and an F-axis converging lens causing the beam bundle outputted from the output section to be converged in the F-axis direction. Optical axes of the plurality of laser beams constituting the beam bundle outputted from the output section intersect with each other at a single point without relying on the F-axis converging lens.
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公开(公告)号：US20170153400A1
公开(公告)日：2017-06-01
申请号：US15432070
申请日：2017-02-14
Applicant: Fujikura Ltd.
Inventor： Yohei Kasai
CPC classification number: G02B6/42 , G02B6/32 , G02B6/4269 , H01S5/0071 , H01S5/02216 , H01S5/02236 , H01S5/02284 , H01S5/02438 , H01S5/02469
Abstract: An optical fiber module has a package housing having an internal space defined by a base plate, a side wall, and a cover member, a laser device disposed on the base plate within the internal space, an optical fiber that transmits a laser beam emitted from the laser device to an outside of the package housing, a light scattering member that scatters light having a wavelength of the laser beam and covers an outer circumferential surface of the projecting end of the optical fiber, and a heat dissipation portion disposed on the base plate. The optical fiber has a projecting end projecting from an inner surface of the side wall toward the internal space. The heat dissipation portion covers a portion of an outer circumferential surface of the light scattering member and exposes another portion of the outer circumferential surface of the light scattering member to the internal space.
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