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公开(公告)号：US10003087B1
公开(公告)日：2018-06-19
申请号：US14563885
申请日：2014-12-08
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Dick Tak Shing Pang , Anwar Mohammed , Murad Kurwa
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: A stretchable battery and the method of manufacturing the same. The stretchable battery can be manufactured by using a printing process. The construction of the stretchable battery can comprise a first layer of an elastomer film, a first current collector layer, a layer of cathode, a separating layer, a layer of anode, and a second current collector layer. Metal traces can be used to couple with the first and/or the second current collector layers.
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公开(公告)号：US09839125B1
公开(公告)日：2017-12-05
申请号：US14266723
申请日：2014-04-30
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: An electronics assembly includes multiple electronic components coupled to a fabric. Each of the multiple electronic components includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. One of the electrically conductive wire braids interconnects two electronic components, thereby providing an electrical connection between the two electronic components. The electrically conductive wire braid can be attached to the fabric by an adhesive, a stitched thread, which can be either electrically insulated or electrically conductive, or both adhesive and stitched thread. The fabric can be a wearable fabric, such as a shirt or pants, or other form to be worn by a user, such as an armband, waistband, hat or shoes.
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公开(公告)号：US09521738B1
公开(公告)日：2016-12-13
申请号：US14560898
申请日：2014-12-04
Applicant: Flextronics AP, LLC
Inventor： Dennis Willie , Richard Loi , David Geiger , Anwar Mohammed , Murad Kurwa , Hector Rene Marin Hernandez
IPC: H05K7/20 , H05K1/02 , H01L23/473
CPC classification number: H05K1/0201 , H01L23/373 , H05K1/0203 , H05K1/0204 , H05K1/115 , H05K1/181 , H05K3/3494 , H05K7/20209 , H05K7/2039 , H05K2201/0323 , H05K2201/06 , H05K2201/062 , H05K2201/10371 , H05K2203/304
Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology.
Abstract translation: 形成的石墨片的形状和尺寸被设计为位于耦合到PCB的电子部件上方的保护屏蔽。 形成的石墨片用于保护电子部件的主体免受在电子部件组装到PCB期间所施加的热，例如在SMT和通孔技术中使用的加热步骤。
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24.发明授权公开(公告)号：US09398714B1
公开(公告)日：2016-07-19
申请号：US14229671
申请日：2014-03-28
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more metal foils, each metal foil electrically coupled at one end to an electrical connection point of the electrical module and at another end to an electrically conductive wire. The electrically conductive wire is stitched to the metal foil and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board. The metal foils can be formed from interconnects on the printed circuit board or the metal foils can be separate elements coupled to the printed circuit board.
Abstract translation: 可穿戴电子组件包括耦合到可穿戴电子织物的一个或多个电子模块。 所述一个或多个电子模块中的每一个包括一个或多个金属箔，每个金属箔在一端电连接到电气模块的电连接点，另一端电连接到导电线。 导电线被缝合到金属箔和连接到电子模块的织物上。 电子模块可以包括耦合到印刷电路板的一个或多个电子部件。 金属箔可以由印刷电路板上的互连形成，或者金属箔可以是与印刷电路板耦合的分离元件。
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25.发明申请INTEGRATED SYSTEM OF AN ELECTRONIC MODULE AND CONDUCTIVE FABRIC AND METHOD OF MAKING THE SAME 审中-公开电子模块和导电织物的集成系统及其制造方法公开(公告)号：US20160183367A1
公开(公告)日：2016-06-23
申请号：US14574944
申请日：2014-12-18
Applicant: FLEXTRONICS AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Murad Kurwa
CPC classification number: H05K1/038 , H05K1/0283 , H05K1/0366 , H05K1/0373 , H05K1/09 , H05K1/113 , H05K1/115 , H05K1/181 , H05K3/10 , H05K3/32 , H05K3/42 , H05K9/009 , H05K2201/05 , H05K2201/0959 , H05K2201/10242 , H05K2201/10295 , H05K2201/10303
Abstract: An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.
Abstract translation: 提供了一种将电子模块组装到导电织物上的电子模块组件和方法。 电子模块组件包括非导电织物和覆盖非导电织物的第一侧的至少一部分的导电织物。 电子模块设置在导电织物上，电子模块的一部分包括限定通孔的壁。 穿过通孔并穿过导电织物的紧固件构造成将电子模块电连接到导电织物上。
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Patent Agency Ranking
26.发明申请公开(公告)号：US20160157363A1
公开(公告)日：2016-06-02
申请号：US14558357
申请日：2014-12-02
Applicant: FLEXTRONICS AP, LLC
Inventor： Anwar Mohammed , Weifeng Liu , Murad Kurwa
CPC classification number: H05K1/0283 , B29C65/72 , B29L2031/3425 , H05K1/028 , H05K1/0284 , H05K1/0296 , H05K1/092 , H05K3/0058 , H05K3/125 , H05K3/20 , H05K2201/0133 , H05K2201/0323
Abstract: A method and apparatus for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface is described. An amount of conductive material needed to form a conductor between two points on a surface of an object is determined. The determined amount of conductive material is deposited on a substrate. The substrate with the deposited conductive material is applied to the object to form a conductor between the two points on the surface of the object. The conductive material and substrate may be stretchable. The conductive material may be deposited by an inkjet printer or an embedded 3-D printer. The substrate with the deposited conductive material may be applied to the object by laminating the substrate with the deposited conductive material to the object.
Abstract translation: 描述了在不均匀的二维（2-D）或三维（3-D）表面上形成导体的方法和装置。 确定在物体表面上的两个点之间形成导体所需的导电材料的量。 将确定量的导电材料沉积在基底上。 将具有沉积的导电材料的基板施加到物体上以在物体的表面上的两个点之间形成导体。 导电材料和基底可以是可拉伸的。 导电材料可以由喷墨打印机或嵌入式三维打印机进行沉积。 具有沉积的导电材料的衬底可以通过将衬底与沉积的导电材料层压到物体上而被施加到物体。
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公开(公告)号：US10231333B1
公开(公告)日：2019-03-12
申请号：US14307201
申请日：2014-06-17
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed , David Geiger , Murad Kurwa
Abstract: Methods of making a copper interconnect plated through hole assembly are disclosed. Nano copper ink dispersed in an organic solvent is able to be filled in the plated through hole and forming the copper interconnect by sintering at a temperature below the melting of the copper.
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公开(公告)号：US09736932B1
公开(公告)日：2017-08-15
申请号：US14601072
申请日：2015-01-20
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Murad Kurwa
CPC classification number: H05K1/0284 , H01L24/00 , H05K3/103 , H05K2201/10356 , H05K2203/107 , H05K2203/1469 , Y10T29/49162
Abstract: A method of and device for making a three dimensional electronic circuit. The method comprises coupling one or more magnet wires with a substrate along a surface contour of the substrate, immobilizing the one or more magnet wires on the substrate, and forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.
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公开(公告)号：US09674950B1
公开(公告)日：2017-06-06
申请号：US14268775
申请日：2014-05-02
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more metal foils, one metal foil coupled to one electrical connection point on an electronic component. The metal foil is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the metal foil.
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公开(公告)号：US09659359B1
公开(公告)日：2017-05-23
申请号：US14704822
申请日：2015-05-05
Applicant: Flextronics AP, LLC
Inventor： Zhen Feng , Weifeng Liu , David Geiger , Anwar Mohammed , Murad Kurwa
CPC classification number: G06T7/0004 , G01N21/9501 , G01N21/956 , G01N2021/95646 , G06T11/206 , G06T2207/30152
Abstract: Methods of and Devices for quality control that can be used with automated optical inspection (AOI), solder paste inspection (SPI), and automated x-ray inspection (AXI) are disclosed. Plurality of threshold settings are entered in a testing process. Multiple testing results are obtained from the testing process. A graphic presentation is generated showing the numerical relationship among the data points, such that a quality control person is able to fine-tune the testing process to have a predetermined ratio of Defect Escaped % to False Call ppm.
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