Backlight module and display device having the same
    24.
    发明授权
    Backlight module and display device having the same 有权
    背光模块和具有相同功能的显示设备

    公开(公告)号:US09304241B2

    公开(公告)日:2016-04-05

    申请号:US14095380

    申请日:2013-12-03

    Abstract: A backlight module includes: a frame; a backboard configured to support the frame; a radiator provided in the backboard and connected to an inner wall of the frame; a light source fixed to an inner wall of the radiator; a light guide plate relatively slidably mounted on the radiator and configured to guide light emitted by the light source; and at least one buffer mounted on the radiator and configured so that the radiator is moveable relative to the backboard against an elastic force of the buffer. The backlight module can effectively eliminate the phenomenon in which a shadow of the light source is present in pictures coming from the backlight module since the light guide plate presses against the light source after it is heated to expand. The present invention further provides a display device including the above backlight module.

    Abstract translation: 背光模块包括:框架; 配置为支撑框架的背板; 设置在所述背板中并连接到所述框架的内壁的散热器; 固定在散热器的内壁上的光源; 相对可滑动地安装在所述散热器上并被配置为引导由所述光源发射的光的导光板; 以及至少一个缓冲器,其安装在所述散热器上并且构造成使得所述散热器抵抗所述缓冲器的弹性力相对于所述背板运动。 背光模块能够有效地消除由于在导热板被加热膨胀之后压在光源上的情况下,来自背光模块的图像中存在光源阴影的现象。 本发明还提供一种包括上述背光模块的显示装置。

    Semiconductor apparatus having expansion wires for electrically connecting chips

    公开(公告)号:US12278243B2

    公开(公告)日:2025-04-15

    申请号:US17529969

    申请日:2021-11-18

    Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.

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