公开(公告)号：USD763207S1

公开(公告)日：2016-08-09

申请号：US29523790

申请日：2015-04-14

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Designer： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

公开(公告)号：US09048408B2

公开(公告)日：2015-06-02

申请号：US14077219

申请日：2013-11-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/13 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.

Abstract translation: 发光二极管（LED）封装包括衬底，第一电极和嵌入在衬底中并彼此间隔开的第二电极，安装在衬底的顶表面上并电连接到第一和第二电极的LED管芯 。 第一和第二电极都包括顶面和底面，其中第一和第二电极中的每一个的顶面和底面分别暴露在基板的顶表面和底表面处。 第一电极的顶面限定对应于LED管芯的正焊盘（p焊盘）的第一槽。 p焊盘部分地插入第一凹槽中。 在p垫的插入部分和第一槽的内表面之间填充抗氧化金属涂层。

公开(公告)号：US10510931B2

公开(公告)日：2019-12-17

申请号：US15972240

申请日：2018-05-07

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Yi-Sen Lin ,  Chin-Fu Cheng ,  Wen-Liang Tseng ,  Pin-Chuan Chen

IPC: H01L33/48 ,  H01L33/64 ,  H01L33/54 ,  H01L33/56 ,  F21V8/00 ,  H01L33/36

Abstract: A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.

公开(公告)号：US09842968B2

公开(公告)日：2017-12-12

申请号：US15482975

申请日：2017-04-10

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Chao-Hsiung Chang ,  Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng

IPC: H01L21/00 ,  H01L33/38 ,  H01L33/44 ,  H01L33/48

CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/44 ,  H01L33/486 ,  H01L2933/0016

Abstract: A method for manufacturing a light emitting diode (LED) die includes providing an LED die including a substrate, an N type semiconductor layer, an active layer, and a P type semiconductor layer grown on the substrate in sequence. The N type semiconductor layer, the active layer, and the P type semiconductor layer are etched to define a plurality of recesses and a groove. An insulating layer to cover side surfaces of the recesses and the P type semiconductor layer is formed and a portion of the insulating layer is etched to define an opening to expose a top portion of the P type semiconductor layer. A pair of electrodes is formed and the LED die is cut along the groove to obtain an individual LED die.

公开(公告)号：US09666568B2

公开(公告)日：2017-05-30

申请号：US15222978

申请日：2016-07-29

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/60 ,  H01L33/52 ,  H01L23/60 ,  H01L33/48 ,  H01L29/866

CPC classification number: H01L25/167 ,  H01L23/60 ,  H01L25/165 ,  H01L29/866 ,  H01L33/483 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.

公开(公告)号：US09437585B2

公开(公告)日：2016-09-06

申请号：US14524415

申请日：2014-10-27

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/60 ,  H01L33/52

CPC classification number: H01L25/167 ,  H01L23/60 ,  H01L25/165 ,  H01L29/866 ,  H01L33/483 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.

Abstract translation: 光电器件包括电极结构，LED（发光二极管）元件，齐纳二极管和反射杯。 LED元件，齐纳二极管和反射杯布置在电极结构上。 LED元件和齐纳二极管彼此反并联地电连接。 反射杯包括限定在其中的内表面和限定在反射杯外侧的切口。 LED元件被反射杯的内表面包围，并且齐纳二极管被布置在刻痕中。

公开(公告)号：US09324702B2

公开(公告)日：2016-04-26

申请号：US14525466

申请日：2014-10-28

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

IPC: H01L33/62 ,  H01L27/02 ,  H01L25/16 ,  H01L33/48

CPC classification number: H01L27/0248 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A photoelectric device includes a base, an LED (light emitting diode) element and a zener diode. The base includes a first electrode and a second electrode. The LED element and the zener diode are electrically connected with the first electrode and the second electrode. A recess structure is defined in the base. The zener diode is arranged in the recess structure. The zener diode is electrically connected in anti-parallel with the LED element.

Abstract translation: 光电装置包括基座，LED（发光二极管）元件和齐纳二极管。 基座包括第一电极和第二电极。 LED元件和齐纳二极管与第一电极和第二电极电连接。 在基座中限定了凹陷结构。 齐纳二极管布置在凹槽结构中。 齐纳二极管与LED元件反并联电连接。

公开(公告)号：US09048394B2

公开(公告)日：2015-06-02

申请号：US14077218

申请日：2013-11-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An exemplary light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, and an LED die mounted on a top surface of the substrate. The substrate also includes a bottom surface. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. An oxidation-resistant metal coating layer is formed on a top face of each of the first and second electrodes. The LED die is electrically connected to the first and second electrodes via the two oxidation-resistant metal coating layers.

Abstract translation: 示例性的发光二极管（LED）封装包括衬底，第一电极和嵌入在衬底中并彼此间隔开的第二电极以及安装在衬底顶表面上的LED管芯。 衬底还包括底面。 第一电极和第二电极的顶端在基板的顶表面露出，第一和第二电极的底端在基板的底表面露出。 在第一和第二电极中的每一个的顶面上形成抗氧化金属涂层。 LED管芯通过两个耐氧化金属涂层电连接到第一和第二电极。

公开(公告)号：US09040325B2

公开(公告)日：2015-05-26

申请号：US14248340

申请日：2014-04-09

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Chao-Hsiung Chang

IPC: H01L21/00 ,  H01L27/15 ,  H01L25/16 ,  H01L33/08

CPC classification number: H01L27/153 ,  H01L25/167 ,  H01L33/08 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A method for manufacturing an LED (light emitting diode) package comprises following steps: providing an electrically insulated base, the base having a first surface and a second surface opposite thereto; an annular voltage stabilizing module is formed on the first surface; a first electrode is formed on the first surface, wherein the first electrode is attached to and encircled by the voltage stabilizing module; a second electrode is formed on the first surface, wherein the second electrode is attached to and encircles the voltage stabilizing module; an LED chip is mounted on the first electrode, wherein the LED chip is electrically connected to the first and second electrodes, and the LED chip and the voltage stabilizing module are connected in reverse parallel. Finally, an encapsulative layer is brought to encapsulate the LED chip.

Abstract translation: 一种制造LED（发光二极管）封装的方法包括以下步骤：提供电绝缘基底，该基底具有第一表面和与其相对的第二表面; 环形电压稳定模块形成在第一表面上; 第一电极形成在第一表面上，其中第一电极附接并由电压稳定模块环绕; 在所述第一表面上形成第二电极，其中所述第二电极附接到所述电压稳定模块并且环绕所述稳压模块; LED芯片安装在第一电极上，其中LED芯片电连接到第一和第二电极，并且LED芯片和稳压模块反向并联连接。 最后，将封装层封装在LED芯片中。

公开(公告)号：US08981387B2

公开(公告)日：2015-03-17

申请号：US13717708

申请日：2012-12-18

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： Hou-Te Lin ,  Chao-Hsiung Chang

IPC: H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L29/267 ,  H01L29/16 ,  H01L29/205 ,  H01L21/00 ,  H01L33/58

CPC classification number: H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode assembly includes a base, a light emitting chip mounted on the base, an elastic lens covering the light emitting chip, two rotation members rotatably arranged on the base, and two stopper poles fixed on the base. The two rotation members are capable of driving the elastic lens to rotate with respect to the two stopper poles. The stopper poles compress the elastic lens to cause the elastic lens to deform resiliently when the elastic lens is rotated by the rotation members to engage with the stopper poles.

Abstract translation: 一种发光二极管组件，包括基座，安装在基座上的发光芯片，覆盖发光芯片的弹性透镜，可旋转地布置在基座上的两个旋转构件和固定在基座上的两个止动杆。 两个旋转构件能够驱动弹性透镜相对于两个止动杆旋转。 当弹性透镜被旋转构件旋转以与止动杆接合时，止动杆压缩弹性透镜以使弹性透镜弹性变形。