公开(公告)号：US20170025361A1

公开(公告)日：2017-01-26

申请号：US14947353

申请日：2015-11-20

Applicant: Apple Inc.

Inventor： Meng Chi Lee ,  Shakti S. Chauhan ,  Flynn P. Carson ,  Jun Chung Hsu ,  Tha-An Lin

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49816 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed over the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The substrate of the SiP may include at least some metallization along vertical walls in the end portions of the substrate. The metallization may provide a large contact area for coupling the metal shield to a ground ring coupled to the ground layer in the PCB. The metallization along the vertical walls in the end portions of the substrate may be formed as through-metal vias in a common substrate before singulation to form the SiP.

Abstract translation: 公开了一种封装系统（SiP），其使用EMI屏蔽来抑制SiP内的元件上的EMI或其他电干扰。 可以在SiP上形成金属屏蔽。 金属屏蔽可以电耦合到印刷电路板（PCB）中的接地层，以在SiP周围形成EMI屏蔽。 SiP的衬底可以包括在衬底的端部中沿垂直壁的至少一些金属化。 金属化可以提供用于将金属屏蔽件耦合到耦合到PCB中的接地层的接地环的大的接触面积。 沿着衬底的端部的垂直壁的金属化可以在共形衬底之前形成为通孔金属孔，以形成SiP。

公开(公告)号：US12041728B2

公开(公告)日：2024-07-16

申请号：US17160909

申请日：2021-01-28

Applicant: Apple Inc.

Inventor： Maryam Rahimi ,  Meng Chi Lee ,  Wyeman Chen ,  Leilei Zhang ,  Jason P. Marsh ,  Lan Hoang ,  Yashar Abdollahian

IPC: H05K3/34 ,  H05K1/11 ,  H05K3/36

CPC classification number: H05K3/3457 ,  H05K1/113 ,  H05K3/36 ,  H05K2203/10

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

公开(公告)号：US20230063808A1

公开(公告)日：2023-03-02

申请号：US17465596

申请日：2021-09-02

Applicant: Apple Inc.

Inventor： Nima Shahidi ,  Meng Chi Lee

IPC: H05K1/02 ,  H01L23/498 ,  H05K1/14 ,  H05K3/00 ,  H05K3/42 ,  H01L21/48

Abstract: A coaxial interposer may shield certain signals (e.g., noisy signals, high speed signals, radio frequency (RF) signals) transmitted through an electronic device. The coaxial interposer may include a coaxial via that includes an outer barrel of non-conductive material and an inner barrel of non-conductive material separated by a conductive barrel. Further, the outer barrel of non-conductive material may be enclosed by an outer metal coating. The coaxial via serves to internally shield each signals transmitted between layers of a printed circuit board (PCB) within the electronic device.

公开(公告)号：US20200375033A1

公开(公告)日：2020-11-26

申请号：US16894463

申请日：2020-06-05

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  H01L25/11

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US20200066457A1

公开(公告)日：2020-02-27

申请号：US16112500

申请日：2018-08-24

Applicant: Apple Inc.

Inventor： Ching Yu John Tam ,  James John Ashe ,  Gang Ning ,  Won Seop Choi ,  Meng Chi Lee ,  Parin Patel ,  Samuel Benjamin Schaevitz ,  Derek J. DiCarlo

IPC: H01G4/40 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30

Abstract: Capacitors, including multilayer ceramic capacitors, may be subject to faults and failures that create short circuits between their dielectrics. Capacitors having fuses that protect the capacitors or the electrical devices using the capacitors when such faults occur are described herein. Embodiments include the presence of monolithic and non-monolithic structures including the fuse. Embodiments also include capacitors with multiple fuses that may prevent or mitigate capacitor failure. Methods for manufacturing and using the capacitors are also described.

公开(公告)号：US10455707B1

公开(公告)日：2019-10-22

申请号：US16100456

申请日：2018-08-10

Applicant: Apple Inc.

Inventor： Kenneth Leland Kiplinger ,  Mark J. Beesley ,  Shawn Xavier Arnold ,  Shyam Harindralal Ratnayake ,  Meng Chi Lee

IPC: H05K3/34 ,  H05K3/46 ,  H05K1/11 ,  H05K1/18 ,  H01L23/498

Abstract: Described herein are printed circuit boards (PCBs), PCB assemblies, and methods of manufacture thereof, which allow free placement of electrical components. The PCBs may have electrical pads that may couple to components through via-based connections and without the use of solder. The electrical components may be physically attached to the PCBs through tight fitting, lamination, and/or the use of adhesives. The distance between adjacent vias may be reduced, as accidental short-circuit risks due to solder bridging and similar effects are mitigated when the soldering process is bypassed. The PCB design and component placement may be flexible as to allow the use of electrical components with custom shape and/or customized terminal placement.

公开(公告)号：US20190306979A1

公开(公告)日：2019-10-03

申请号：US16426443

申请日：2019-05-30

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/14 ,  H05K3/46 ,  H05K3/00 ,  H05K3/28 ,  H05K1/18

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US10109593B2

公开(公告)日：2018-10-23

申请号：US14947353

申请日：2015-11-20

Applicant: Apple Inc.

Inventor： Meng Chi Lee ,  Shakti S. Chauhan ,  Flynn P. Carson ,  Jun Chung Hsu ,  Tha-An Lin

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L23/31

Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed over the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The substrate of the SiP may include at least some metallization along vertical walls in the end portions of the substrate. The metallization may provide a large contact area for coupling the metal shield to a ground ring coupled to the ground layer in the PCB. The metallization along the vertical walls in the end portions of the substrate may be formed as through-metal vias in a common substrate before singulation to form the SiP.

公开(公告)号：US09721903B2

公开(公告)日：2017-08-01

申请号：US14976199

申请日：2015-12-21

Applicant: Apple Inc.

Inventor： Meng Chi Lee ,  Shakti S. Chauhan ,  Flynn P. Carson ,  Jun Chung Hsu ,  Tha-An Lin

IPC: H01L29/00 ,  H01L23/552 ,  H01L23/528 ,  H01L23/31 ,  H01L23/522 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81

Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.

公开(公告)号：US20170148744A1

公开(公告)日：2017-05-25

申请号：US15042817

申请日：2016-02-12

Applicant: Apple Inc.

Inventor： Flynn P. Carson ,  Jun Chung Hsu ,  Meng Chi Lee ,  Shakti S. Chauhan

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/78 ,  H01L21/56

Abstract: Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.