公开(公告)号：US12035466B2

公开(公告)日：2024-07-09

申请号：US17236883

申请日：2021-04-21

Applicant: Apple Inc.

Inventor： Mark J. Beesley ,  Meng Chi Lee ,  Nima Shahidi ,  Hao Shi ,  Quan Qi

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/0313 ,  H05K1/05 ,  H05K1/09 ,  H05K1/11

Abstract: Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.

公开(公告)号：US20220104346A1

公开(公告)日：2022-03-31

申请号：US17236883

申请日：2021-04-21

Applicant: Apple Inc.

Inventor： Mark J. Beesley ,  Meng Chi Lee ,  Nima Shahidi ,  Hao Shi ,  Quan Qi

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/05 ,  H05K1/03

Abstract: Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.

公开(公告)号：US20230063808A1

公开(公告)日：2023-03-02

申请号：US17465596

申请日：2021-09-02

Applicant: Apple Inc.

Inventor： Nima Shahidi ,  Meng Chi Lee

IPC: H05K1/02 ,  H01L23/498 ,  H05K1/14 ,  H05K3/00 ,  H05K3/42 ,  H01L21/48

Abstract: A coaxial interposer may shield certain signals (e.g., noisy signals, high speed signals, radio frequency (RF) signals) transmitted through an electronic device. The coaxial interposer may include a coaxial via that includes an outer barrel of non-conductive material and an inner barrel of non-conductive material separated by a conductive barrel. Further, the outer barrel of non-conductive material may be enclosed by an outer metal coating. The coaxial via serves to internally shield each signals transmitted between layers of a printed circuit board (PCB) within the electronic device.