公开(公告)号：US12035466B2

公开(公告)日：2024-07-09

申请号：US17236883

申请日：2021-04-21

Applicant: Apple Inc.

Inventor： Mark J. Beesley ,  Meng Chi Lee ,  Nima Shahidi ,  Hao Shi ,  Quan Qi

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/0313 ,  H05K1/05 ,  H05K1/09 ,  H05K1/11

Abstract: Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.

公开(公告)号：US20220104346A1

公开(公告)日：2022-03-31

申请号：US17236883

申请日：2021-04-21

Applicant: Apple Inc.

Inventor： Mark J. Beesley ,  Meng Chi Lee ,  Nima Shahidi ,  Hao Shi ,  Quan Qi

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/05 ,  H05K1/03

Abstract: Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.