公开(公告)号：US20200089643A1

公开(公告)日：2020-03-19

申请号：US16134811

申请日：2018-09-18

Applicant: Apple Inc.

Inventor： Hao Shi ,  Gary S. Thomason ,  Abhilash Rajagopal ,  Jason W. Leung ,  Koussalya Balasubramanian ,  Venus Kumar

IPC: G06F13/40 ,  H01R13/646 ,  H04L25/02

Abstract: A data network may include a data bus and network nodes. The data bus may be a differential data bus having first and second differential signal lines that convey differential signals between the nodes. A bimodal impedance terminator may be coupled to the first and second differential signal lines at one or both ends of the data bus. The bimodal impedance terminator may include a first resistor coupled between the first differential signal line and a circuit node and a second resistor coupled between the second differential signal line and the circuit node. A capacitor may be coupled between the circuit node and ground. A third resistor may be coupled between the circuit node and ground in series with the capacitor. The bimodal impedance terminator may terminate both the differential-mode impedance and the common-mode impedance of the data bus to reduce signal reflections at the ends of the data bus.

公开(公告)号：US12035466B2

公开(公告)日：2024-07-09

申请号：US17236883

申请日：2021-04-21

Applicant: Apple Inc.

Inventor： Mark J. Beesley ,  Meng Chi Lee ,  Nima Shahidi ,  Hao Shi ,  Quan Qi

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/0313 ,  H05K1/05 ,  H05K1/09 ,  H05K1/11

Abstract: Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.

公开(公告)号：US20220104346A1

公开(公告)日：2022-03-31

申请号：US17236883

申请日：2021-04-21

Applicant: Apple Inc.

Inventor： Mark J. Beesley ,  Meng Chi Lee ,  Nima Shahidi ,  Hao Shi ,  Quan Qi

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/05 ,  H05K1/03

Abstract: Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.

公开(公告)号：US10592458B1

公开(公告)日：2020-03-17

申请号：US16134811

申请日：2018-09-18

Applicant: Apple Inc.

Inventor： Hao Shi ,  Gary S. Thomason ,  Abhilash Rajagopal ,  Jason W. Leung ,  Koussalya Balasubramanian ,  Venus Kumar

IPC: H03K17/16 ,  H03K19/003 ,  G06F13/40 ,  H04L25/02 ,  H01R13/646

Abstract: A data network may include a data bus and network nodes. The data bus may be a differential data bus having first and second differential signal lines that convey differential signals between the nodes. A bimodal impedance terminator may be coupled to the first and second differential signal lines at one or both ends of the data bus. The bimodal impedance terminator may include a first resistor coupled between the first differential signal line and a circuit node and a second resistor coupled between the second differential signal line and the circuit node. A capacitor may be coupled between the circuit node and ground. A third resistor may be coupled between the circuit node and ground in series with the capacitor. The bimodal impedance terminator may terminate both the differential-mode impedance and the common-mode impedance of the data bus to reduce signal reflections at the ends of the data bus.