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公开(公告)号：US20230264198A1
公开(公告)日：2023-08-24
申请号：US18170765
申请日：2023-02-17
Inventor： Alan J. O'Donnell , Jan Kubík , Jochen Schmitt , Stanislav Jolondcovschi , Shaun Bradley , Gavin Patrick Cosgrave , Alfonso Berduque , Javier Calpe Maravilla , Padraig L. Fitzgerald , Eoin Edward English , Michael P. Lynch
IPC: B01L3/00
CPC classification number: B01L3/502761 , B01L3/50851 , B01L2200/0647 , B01L2300/023 , B01L2300/0663 , B01L2300/0861 , B01L2300/18 , B01L2400/043 , B01L2400/08
Abstract: Aspects of this disclosure relate to systems that include a channel with at least one fluid in particle in fluid. The at least one particle can move along a defined path of the channel in response to a magnetic field. At least one structure is integrated with the channel, such as a sensor to generate an output signal related to the magnetic field or a magnetic structure to apply the magnetic field. Relates methods are also disclosed.
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22.发明授权公开(公告)号：US11649157B2
公开(公告)日：2023-05-16
申请号：US17344687
申请日：2021-06-10
Inventor： Alan J. O'Donnell , Robert Guyol , Maria Jose Martinez , Jan Kubik , Padraig L. Fitzgerald , Javier Calpe Maravilla , Michael P. Lynch , Eoin E. English
CPC classification number: B81B3/00 , B81B3/0091 , G01R33/09 , H01F17/0006 , H01F17/0033 , H01L43/08 , H01F2017/0066
Abstract: A magnetic device may include a magnetic structure, a device structure, and an associated circuit. The magnetic structure may include a patterned layer of material having a predetermined magnetic property. The patterned layer may be configured to, e.g., provide a magnetic field, sense a magnetic field, channel or concentrate magnetic flux, shield a component from a magnetic field, or provide magnetically actuated motion, etc. The device structure may be another structure of the device that is physically connected to or arranged relative to the magnetic structure to, e.g., structurally support, enable operation of, or otherwise incorporate the magnetic structure into the magnetic device, etc. The associated circuit may be electrically connected to the magnetic structure to receive, provide, condition or process of signals of the magnetic device.
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公开(公告)号：US20220252664A1
公开(公告)日：2022-08-11
申请号：US17652857
申请日：2022-02-28
Inventor： Edward John Coyne , Alan J. O'Donnell , Shaun Bradley , David Aherne , David Boland , Thomas G. O'Dwyer , Colm Patrick Heffernan , Kevin B. Manning , Mark Forde , David J. Clarke , Michael A. Looby
Abstract: The disclosed technology generally relates to integrated circuit devices with wear out monitoring capability. An integrated circuit device includes a wear-out monitor device configured to record an indication of wear-out of a core circuit separated from the wear-out monitor device, wherein the indication is associated with localized diffusion of a diffusant within the wear-out monitor device in response to a wear-out stress that causes the wear-out of the core circuit.
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公开(公告)号：US11269006B2
公开(公告)日：2022-03-08
申请号：US17062225
申请日：2020-10-02
Inventor： Edward John Coyne , Alan J. O'Donnell , Shaun Bradley , David Aherne , David Boland , Thomas G. O'Dwyer , Colm Patrick Heffernan , Kevin B. Manning , Mark Forde , David J. Clarke , Michael A. Looby
Abstract: The disclosed technology generally relates to integrated circuit devices with wear out monitoring capability. An integrated circuit device includes a wear-out monitor device configured to record an indication of wear-out of a core circuit separated from the wear-out monitor device, wherein the indication is associated with localized diffusion of a diffusant within the wear-out monitor device in response to a wear-out stress that causes the wear-out of the core circuit.
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公开(公告)号：US11127716B2
公开(公告)日：2021-09-21
申请号：US16366476
申请日：2019-03-27
Inventor： Rigan McGeehan , Cillian Burke , Alan J. O'Donnell
IPC: H01L25/065 , H01L21/304 , H01L21/78 , H01L23/00 , H01L25/00 , B81B7/00 , H01L23/495 , H01L23/538
Abstract: An integrated device package is disclosed. The package can include a carrier and an integrated device die having a front side and a back side. A mounting structure can serve to mount the back side of the integrated device die to the carrier. The mounting structure can comprise a first layer over the carrier and a second element between the back side of the integrated device die and the first layer. The first layer can comprise a first insulating material that adheres to the carrier, and the second element can comprise a second insulating material.
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Patent Agency Ranking
26.发明申请公开(公告)号：US20250030237A1
公开(公告)日：2025-01-23
申请号：US18679379
申请日：2024-05-30
Inventor： David J. Clarke , Alan J. O'Donnell , Shaun Stephen Bradley , Stephen Denis Heffernan , Patrick Martin McGuinness , Padraig L. Fitzgerald , Edward John Coyne , Michael P. Lynch , John Anthony Cleary , John Ross Wallrabenstein , Paul Joseph Maher , Andrew Christopher Linehan , Gavin Patrick Cosgrave , Michael James Twohig , Jan Kubik , Jochen Schmitt , David Aherne , Mary McSherry , Anne M. McMahon , Stanislav Jolondcovschi , Cillian Burke
Abstract: Apparatuses including spark gap structures for electrical overstress (EOS) monitoring or protection, and associated methods, are disclosed. In an aspect, a vertical spark gap device includes a substrate having a horizontal main surface and a plurality of pairs of conductive layers over the horizontal main surface. Different ones of the pairs are separated by different vertical distances such that each pair serves as an arcing electrode pair and different ones of the arcing electrode pairs are configured to arc discharge at different voltages.
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公开(公告)号：US20240405519A1
公开(公告)日：2024-12-05
申请号：US18679364
申请日：2024-05-30
Inventor： David J. Clarke , Alan J. O'Donnell , Shaun Bradley , Stephen Denis Heffernan , Patrick Martin McGuinness , Padraig L. Fitzgerald , Edward John Coyne , Michael P. Lynch , John Anthony Cleary , John Ross Wallrabenstein , Paul Joseph Maher , Andrew Christopher Linehan , Gavin Patrick Cosgrave , Michael James Twohig , Jan Kubik , Jochen Schmitt , David Aherne , Mary McSherry , Anne M. McMahon , Stanislav Jolondcovschi , Cillian Burke
Abstract: Apparatuses including spark gap structures for electrical overstress (EOS) monitoring or protection, and associated methods, are disclosed. In an aspect, a vertical spark gap device includes a substrate having a horizontal main surface, a first conductive layer and a second conductive layer each extending over the substrate and substantially parallel to the horizontal main surface while being separated in a vertical direction crossing the horizontal main surface. One of the first and second conductive layers is electrically connected to a first voltage node and the other of the first and second conductive layers is electrically connected to a second voltage node. The first and second conductive layers serve as one or more arcing electrode pairs and have overlapping portions configured to generate one or more arc discharges extending generally in the vertical direction in response to an EOS voltage signal received between the first and second voltage nodes.
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公开(公告)号：US20230383855A1
公开(公告)日：2023-11-30
申请号：US18323798
申请日：2023-05-25
Inventor： Alan J. O'Donnell , Jan Kubík , Alfonso Berduque , Jochen Schmitt , Javier Calpe Maravilla , Shaun Bradley , Padraig L. Fitzgerald , Stanislav Jolondcovschi , Gavin Patrick Cosgrave , Michael P. Lynch , Eoin Edward English
CPC classification number: F16K13/10 , F16K31/06 , B08B9/08 , B08B2209/08
Abstract: Aspects of this disclosure relate to adjusting fluid flow using magnetically sensitive particles. Fluid can flow through an opening in a container. Magnetically sensitive particles can be confined within the container. A magnetic field can be applied to move the magnetically sensitive particles in the container to adjust flow of the fluid through the opening.
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29.发明公开公开(公告)号：US20230375600A1
公开(公告)日：2023-11-23
申请号：US18317806
申请日：2023-05-15
Inventor： David J. Clarke , Stephen Denis Heffernan , Nijun Wei , Alan J. O'Donnell , Patrick Martin McGuinness , Shaun Bradley , Edward John Coyne , David Aherne , David M. Boland
IPC: G01R19/165 , G01R31/00 , G01R31/28 , H02H9/04 , H01L27/02 , H01L23/60 , H01L23/62 , H01L23/525 , H02H9/00
CPC classification number: G01R19/16504 , G01R31/002 , G01R31/2832 , G01R31/2856 , H02H9/042 , H01L27/0288 , H01L23/60 , H01L23/62 , H01L23/5256 , H02H9/00
Abstract: The disclosed technology generally relates to electrical overstress protection devices, and more particularly to electrical overstress monitoring devices for detecting electrical overstress events in semiconductor devices. In one aspect, an electrical overstress monitor and/or protection device includes a two different conductive structures configured to electrically arc in response to an EOS event and a sensing circuit configured to detect a change in a physical property of the two conductive structures caused by the EOS event. The two conductive structures have facing surfaces that have different shapes;
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公开(公告)号：US20230221360A1
公开(公告)日：2023-07-13
申请号：US18188363
申请日：2023-03-22
Inventor： Alan J. O'Donnell , David Aherne , Javier Alejandro Salcedo , David J. Clarke , John A. Cleary , Patrick Martin McGuinness , Albert C. O'Grady
CPC classification number: H02J7/00712 , H02J7/0048 , H02J7/00032 , H02J7/0013 , H02J7/0029 , G08B21/185
Abstract: Aspects of this disclosure relate to detecting and recording information associated with electrical overstress (EOS) events, such as electrostatic discharge (ESD) events. For example, in one embodiment, an apparatus includes an electrical overstress protection device, a detection circuit configured to detect an occurrence of the EOS event, and a memory configured to store information indicative of the EOS event.
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