Abstract:
The embodiment provides a solar cell and a manufacturing process thereof. The solar cell is equipped with an electrode on the light incident surface side; and the electrode has both low resistivity and high transparency, can efficiently utilize solar light for excitation of carriers, and can be made of inexpensive materials. The solar cell comprises a photoelectric conversion layer, a first electrode layer arranged on the light incident surface side, and a second electrode layer arranged opposed to the first electrode layer. The first electrode layer has a thickness in the range of 10 to 200 nm, and has plural penetrating openings. Each of the individual openings occupies an area in the range of 80 nm2 to 0.8 μm2, and the aperture ratio thereof is in the range 10 to 66%. The first electrode layer in the cell can be produced by etching procedure using an etching mask obtained by use of a single particle layer of fine particles, by use of a dot pattern formed by self-assembly of a block copolymer, or by use of a stamper.
Abstract:
The present invention provides a semiconductor light-emitting element comprising an electrode part excellent in ohmic contact and capable of emitting light from the whole surface. An electrode layer placed on the light-extraction side comprises a metal part and plural openings. The metal part is so continuous that any pair of point-positions in the part is continuously connected without breaks, and the metal part in 95% or more of the whole area continues linearly without breaks by the openings in a straight distance of not more than ⅓ of the wavelength of light emitted from an active layer. The average opening diameter is of 10 nm to ⅓ of the wavelength of emitted light. The electrode layer has a thickness of 10 nm to 200 nm, and is in good ohmic contact with a semiconductor layer.
Abstract:
The present invention provides a light transmission type solar cell excellent in both power generation efficiency and light transparency, and also provides a method for producing that solar cell. The solar cell of the present invention comprises a photoelectric conversion layer, a light-incident side electrode layer, and a counter electrode layer. The incident side electrode layer is provided with plural openings bored through the layer, and has a thickness of 10 nm to 200 nm. Each of the openings occupies an area of 80 nm2 to 0.8 μm2, and the opening ratio is in the range of 10% to 66%. The transmittance of the whole cell is 5% or more at 700 nm wavelength. The incident side electrode layer can be formed by etching fabrication with a stamper. In the etching fabrication, a mono-particle layer of fine particles or a dot pattern formed by self-assembled block copolymer can be used as a mask.
Abstract:
The present invention provides a semiconductor light-emitting element comprising an electrode part excellent in ohmic contact and capable of emitting light from the whole surface. An electrode layer placed on the light-extraction side comprises a metal part and plural openings. The metal part is so continuous that any pair of point-positions in the part is continuously connected without breaks, and the metal part in 95% or more of the whole area continues linearly without breaks by the openings in a straight distance of not more than ⅓ of the wavelength of light emitted from an active layer. The average opening diameter is of 10 nm to ⅓ of the wavelength of emitted light. The electrode layer has a thickness of 10 nm to 200 nm, and is in good ohmic contact with a semiconductor layer.
Abstract:
It is made possible to provide a three-dimensional structure having a band-gap function as a three-dimensional photonic crystal. A three-dimensional structure includes: a plurality of basic elements provided at regular intervals on a substrate, each of the basic elements including a stack structure. The stack structure includes first members made of a dielectric material and second members made of the same dielectric material as the first members. The first and second members are alternately stacked, the second members each having a smaller diameter than each of the first members.
Abstract:
An angular velocity sensor includes a tuning-fork-shaped substrate (1), drivers (110) that are provided on the arms forming a tuning fork and vibrate the arms; monitors (150) for detecting vibrations generated by the drivers (110); and detectors (120) for detecting displacement of vibrations made in application of an angular velocity. The drivers (110), the monitors (150), and the detectors (120) are made of a lower electrode layer, a piezoelectric thin film, and an upper electrode layer formed on the arms. The outer peripheral edge of the piezoelectric thin film is shaped like a step having at least one flat portion. The flat portion along the outer peripheral edge has no upper electrode layer formed thereon. This structure prevents short circuits between the lower electrode layer and the upper electrode layer.
Abstract:
The present invention relates to an infrared detector element to detect infrared rays by means of a pyroelectric material, and an infrared sensor unit and an infrared detecting device using the infrared detector element and has an object of realizing an omnidirectional infrared detector element that can gain an output against an object to be detected moving in whatever directions. In order to accomplish this object, the present invention proposes a setup comprising a pair of first electrodes (12, 13), which have a function of absorbing infrared rays, are close to trapezoidal in shape, respectively, and are disposed on one of the surfaces of a pyroelectric material (11) with electrical connections made in such a way that the first electrodes are opposite to each other in polarity, and a pair of second electrodes (14, 15) disposed on the other surface of the pyroelectric material (11) and electrically connected with each other, in which the lower side of the close to trapezoidal shape of the first electrodes (12, 13) of one hand is aligned in the same direction as the lower side of the close to trapezoidal shape of the second electrodes (14, 15) of the other hand, thereby producing an effect of gaining an output against an object to be detected making a movement from whatever directions.
Abstract:
There are provided on a substrate a block layer having an electron affinity smaller than that of the substrate, a p-type strained superlattice structure having no lattice relaxation and operating as a generation region of spin polarized electrons and a surface layer for accommodating a bending portion of the energy band. The superlattice structure is formed of a multilayer in which a strained well layer and a barrier layer are alternately laminated plural times. The strained well layer has a lattice constant greater than that of the substrate and a thickness equal to or less than a wavelength of electron wave, and the barrier layer has a conduction band lower in energy than that of the strained well layer and a thickness such that an electron in the conduction band can transmit based on tunnel effect. A difference in energy between the band for heavy holes and the band for light holes is further widened in the valence band of the superlattice structure due to compressive stress in the strained well layer.
Abstract:
An LC element, semiconductor device and a manufacturing method thereof whereby a channel 22 is formed by applying a voltage to a gate electrode 10 having a predetermined shape formed on a p-Si substrate 30 via an insulation layer 26, whereby a connection is formed between a first diffusion region 12 and a second diffusion region 14 formed at separated positions near the surface of the p-Si substrate 30; both the channel 22 and gate electrode 10 function as inductors, and between these a distributed constant type capacitor is formed, and possessing excellent attenuation characteristics over a wide band. This LC element and semiconductor device can be easily manufactured by using MOS manufacturing technology; in the case of manufacturing as a portion of a semiconductor substrate, component assembly work in subsequent processing can be omitted. Also these can be formed as a portion of an IC or LSI device.
Abstract:
The present invention provides such a formation method that an antireflection structure having excellent antireflection functions can be formed in a large area and at small cost. Further, the present invention also provides an antireflection structure formed by that method. In the formation method, a base layer and particles placed thereon are subjected to an etching process. The particles on the base layer serve as an etching mask in the process, and hence they are more durable against etching than the base layer. The etching rate ratio of the base layer to the particles is more than 1 but not more than 5. The etching process is stopped before the particles disappear. It is also possible to produce an antireflection structure by nanoimprinting method employing a stamper. The stamper is formed by use of a master plate produced according to the above formation method.