LIQUID COOLED DATA CENTER DESIGN SELECTION
    21.
    发明申请
    LIQUID COOLED DATA CENTER DESIGN SELECTION 有权
    液体冷却数据中心设计选择

    公开(公告)号:US20130317785A1

    公开(公告)日:2013-11-28

    申请号:US13479265

    申请日:2012-05-23

    IPC分类号: G06F1/20 G06F17/50

    CPC分类号: H05K7/2079 H05K7/20836

    摘要: Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.

    摘要翻译: 获得了指定液冷数据中心的热设计方面的输入数据。 输入数据包括指示数据中心位置的环境室外温度的数据; 和/或表示数据中心的工作负载功耗的数据。 评估输入数据以获得数据中心热设计的性能。 性能包括冷却能量的使用; 和/或与数据中心相关联的一个相关温度。 输出数据中心散热设计的性能。

    USING IN SITU CAPACITANCE MEASUREMENTS TO MONITOR THE STABILITY OF INTERFACE MATERIALS IN COMPLEX PCB ASSEMBLIES AND OTHER STRUCTURES
    25.
    发明申请
    USING IN SITU CAPACITANCE MEASUREMENTS TO MONITOR THE STABILITY OF INTERFACE MATERIALS IN COMPLEX PCB ASSEMBLIES AND OTHER STRUCTURES 失效
    使用现场电容测量来监测接口材料在复合PCB组件和其他结构中的稳定性

    公开(公告)号:US20120053874A1

    公开(公告)日:2012-03-01

    申请号:US13010854

    申请日:2011-01-21

    摘要: An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes. The technique may be employed for monitoring physical changes in electronic devices and other structures having interfaces between components.

    摘要翻译: 在电子部件和散热器之间的间隙的相对侧上的第一和第二电极上施加电位。 间隙中的热界面材料,电子部件和散热器中的至少一个受到变化的物理条件的影响。 在变化的物理条件期间监测电极之间的电容。 可以使用共享共用散热器的部件阵列来实施这种方法。 用于测试热界面的组件包括印刷电路板,安装到印刷电路板并且与印刷电路板可操作地相关联的多个电子部件,定位成用于吸收由电子部件产生的热量的散热器,与散热器相关联的第一电极, 分别与电子部件相关联的多个第二电极和用于监测第一和第二电极之间的电容的装置。 该技术可以用于监测电子设备中的物理变化以及具有组件之间的接口的其他结构。

    Heat Sink with Thermally Compliant Beams

    公开(公告)号:US20090302459A1

    公开(公告)日:2009-12-10

    申请号:US12537861

    申请日:2009-08-07

    IPC分类号: H01L23/367

    摘要: A heat dissipating structure includes: a heat spreader; and a plurality of compliant beams attached to the heat spreader. The beams are formed of a high-conductive material such that a maximum stress of each beam is less than a fatigue stress of the high-conductive material; said beams are placed at an angle relative to a chip surface such that the beams are able to exert bending compliance in response to x, y, and z forces exerted upon them. The structure also includes a thermal material interface for bonding said structure to the chip surface. Both the heat spreader and the compliant beams can be machined from a copper block. An alternative heat dissipating structure includes compliant beams soldered to the chip surface.

    AIR BEARING GAP CONTROL FOR INJECTION MOLDED SOLDER HEADS
    27.
    发明申请
    AIR BEARING GAP CONTROL FOR INJECTION MOLDED SOLDER HEADS 失效
    注射成型焊枪头的空气轴承挡板控制

    公开(公告)号:US20080302860A1

    公开(公告)日:2008-12-11

    申请号:US11760813

    申请日:2007-06-11

    IPC分类号: B23K31/02

    CPC分类号: B23K3/0623

    摘要: An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.

    摘要翻译: 用于注射成型焊料填充头的空气轴承间隙控制装置。 还提供了一种利用空气轴承装置为注射成型的焊料填充头提供间隙控制的方法。 提供了在焊料填充头结构的下部或分配区域处的C形环密封件,其中C形在其前缘处是敞开的。 因此,为了形成空气轴承,通过加压空气严格控制流行的前缘间隙。 该前沿的下游是熔融焊料,其被包含在焊料填充头和模具之间的非常窄的间隙高度内。 当焊料填充形成在模具表面中的凹坑或凹槽时,空气将从凹坑向空气轴承移出或移出,然后排出,同时沉积的焊料保持在适当的位置。

    Pervasive Network for Environmental Sensing
    28.
    发明申请
    Pervasive Network for Environmental Sensing 有权
    普及环境感知网络

    公开(公告)号:US20080183389A1

    公开(公告)日:2008-07-31

    申请号:US11668604

    申请日:2007-01-30

    IPC分类号: G06F19/00 G01W1/00

    CPC分类号: G01V3/00 G01W1/00

    摘要: Data pertaining to environmental information is acquired using sensors on a multiplicity of networked pervasive devices, and analyzed to determine occurrence of at least one environmental event. Such data can be obtained, for example, from an inventive wireless communications device including an antenna, transmit circuitry coupled to the antenna for transmission of radio frequency radiation therefrom, at least one environmental sensor configured to obtain environmental data, and a communications module coupled to the at least one environmental sensor and configured to cause transmission of a representation of the data via the antenna and the transmit circuitry.

    摘要翻译: 关于环境信息的数据是使用多个网络普及设备上的传感器来获取的,并被分析以确定至少一个环境事件的发生。 这样的数据可以例如从包括天线的发明的无线通信设备获得,耦合到天线的发射电路用于从其发射射频辐射,至少一个被配置为获得环境数据的环境传感器,以及耦合到 所述至少一个环境传感器并且被配置为经由所述天线和所述发射电路来发送所述数据的表示。

    Method and apparatus for correcting for systematic errors in timing pattern generation
    29.
    发明授权
    Method and apparatus for correcting for systematic errors in timing pattern generation 失效
    用于校正定时模式生成中的系统误差的方法和装置

    公开(公告)号:US07136243B2

    公开(公告)日:2006-11-14

    申请号:US11015130

    申请日:2004-12-17

    IPC分类号: G11B5/09 G11B21/02

    摘要: Improvements in placement of timing patterns in self-servowriting include correcting for systematic errors due to geometric effects. A correction is made for varying systematic errors, such as when the recording head has spatially separate read and write elements. Further, servopattern rotation due to residual or unmeasured systematic errors is reduced by using a once per revolution clock index derived from the motor drive current waveform or any other sensor. In one aspect of correcting for systematic errors in the writing of timing patterns on a storage medium of a storage device, a time interval between a trigger pattern written at a first radial position of the storage medium and a rotational index is measured. The rotational index is related to the rotational orientation of the storage medium with respect to a fixed frame of the storage device. The location of another trigger pattern to be written is shifted, using the measured time interval to determine the shift in location for the another trigger pattern.

    摘要翻译: 自我维护中定时模式布局的改进包括纠正由于几何效应引起的系统误差。 对变化的系统误差进行校正,例如当记录头具有空间上分离的读和写元件时。 此外,通过使用从电动机驱动电流波形或任何其他传感器导出的每转一次的时钟指数来减少由于残余或未测量的系统误差引起的伺服模式旋转。 在对存储装置的存储介质上的定时模式的写入进行校正系统错误的一个方面,测量在存储介质的第一径向位置上写入的触发模式与旋转指标之间的时间间隔。 旋转指数与存储介质相对于存储装置的固定框架的旋转取向有关。 使用测量的时间间隔来移动要写入的另一个触发模式的位置,以确定另一个触发模式的位置偏移。

    Timing mark position error correction in self-servo write
    30.
    发明授权
    Timing mark position error correction in self-servo write 失效
    自伺服写入中的定时标记位置误差校正

    公开(公告)号:US07016140B1

    公开(公告)日:2006-03-21

    申请号:US10990913

    申请日:2004-11-16

    IPC分类号: G11B21/10

    CPC分类号: G11B5/59633 G11B5/59666

    摘要: Embodiments of the present invention provide a technique to correct timing mark position error in self-servo write (SSW). In one embodiment, a method of correcting a timing mark position error of a SSW pattern of a disk drive comprises writing a plurality of timing mark bursts over a plurality of steps on a disk, the plurality of timing mark bursts including at least one misaligned burst having an intentional misalignment in a first step with respect to a corresponding burst in a neighboring second step; reading the misaligned burst and the corresponding burst at a seam between the first step and the second step to obtain a measured burst amplitude; and using the measure burst amplitude to obtain a timing mark position error, which may involve comparing the measured burst amplitude and an expected burst amplitude computed based on the intentional misalignment between the misaligned burst and the corresponding burst to obtain a timing mark position error.

    摘要翻译: 本发明的实施例提供了一种校正自伺服写入(SSW)中的定时标记位置误差的技术。 在一个实施例中,校正磁盘驱动器的SSW模式的定时标记位置误差的方法包括在盘上的多个步骤上写入多个定时标记脉冲串,所述多个定时标记脉冲串包括至少一个未对准脉冲串 在相邻的第二步骤中相对于相应的突发在第一步骤中有意的未对准; 在第一步骤和第二步骤之间的接缝处读取不对齐的突发和相应的突发,以获得测量的突发幅度; 并且使用测量脉冲串幅度来获得定时标记位置误差,其可以涉及比较所测量的脉冲串幅度和基于未对准脉冲串与对应脉冲串之间的有意错位而计算出的预期脉冲串幅度,以获得定时标记位置误差。