公开(公告)号：US07382385B2

公开(公告)日：2008-06-03

申请号：US11187069

申请日：2005-07-22

申请人： Craig Breen ,  Haim Livne ,  Michael Plotkin

发明人： Craig Breen ,  Haim Livne ,  Michael Plotkin

IPC分类号： B41J2/435

CPC分类号： B41J2/473 ,  G03G15/04072 ,  G03G15/55 ,  G03G2215/0404

摘要： Skew compensation apparatus for compensating for skew of a multi-beam scanning source, comprises: delay commencement detector(s) for detecting the start of a beam scanner position, position detectors for detecting the position of the multiple beams at a predefined interval following the commencement, so that the position indicates skew of the respective beam, and compensating electronics for automatically inserting a compensation for the skew by altering a delay into a timing signal for switching the respective beam. The commencement detector can be an existing start of scan detector and the apparatus can be built into the writing head, particularly at the conjugate location to the focal plane or at the focal plane of a laser printer or the like to provide a self-calibrating printer.

摘要翻译： 用于补偿多光束扫描源的偏斜的偏斜补偿装置包括：用于检测光束扫描器位置的起始的延迟启动检测器，用于在开始之后的预定间隔检测多个光束的位置的位置检测器 ，使得该位置指示相应波束的偏斜，以及补偿电子装置，用于通过将延迟改变为用于切换相应波束的定时信号来自动插入对于偏斜的补偿。 启动检测器可以是扫描检测器的现有开始，并且该装置可以内置在写入头中，特别是在激光打印机等的焦平面或焦平面的共轭位置处，以提供自校准打印机 。

公开(公告)号：US20050211682A1

公开(公告)日：2005-09-29

申请号：US11130232

申请日：2005-05-17

申请人： William Lauer ,  Pierre Trepagnier ,  Donald Smart ,  James Cordingley ,  Michael Plotkin

发明人： William Lauer ,  Pierre Trepagnier ,  Donald Smart ,  James Cordingley ,  Michael Plotkin

IPC分类号： H01L21/3205 ,  B23K26/02 ,  B23K26/06 ,  B23K26/08 ,  B23K26/10 ,  B23K26/36 ,  B23K26/40 ,  H01L21/304 ,  H01L21/768 ,  H01L23/52 ,  H01L23/525 ,  H01L27/10 ,  H01S3/00

CPC分类号： H01L21/76888 ,  B23K26/042 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/10 ,  B23K26/361 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/50 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate. The laser output is directed at the target structure on the substrate at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate, in order to vaporize the target structure.

公开(公告)号：US06911622B2

公开(公告)日：2005-06-28

申请号：US10428938

申请日：2003-05-05

申请人： William Lauer ,  Pierre Trepagnier ,  Donald Victor Smart ,  James Cordingley ,  Michael Plotkin

发明人： William Lauer ,  Pierre Trepagnier ,  Donald Victor Smart ,  James Cordingley ,  Michael Plotkin

IPC分类号： H01L21/3205 ,  B23K26/02 ,  B23K26/06 ,  B23K26/08 ,  B23K26/10 ,  B23K26/36 ,  B23K26/40 ,  H01L21/304 ,  H01L21/768 ,  H01L23/52 ,  H01L23/525 ,  H01L27/10 ,  H01S3/00 ,  B23K26/00

CPC分类号： H01L21/76888 ,  B23K26/042 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/10 ,  B23K26/361 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/50 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate. The laser output is directed at the target structure on the substrate at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate, in order to vaporize the target structure.

摘要翻译： 本发明提供了一种用于在衬底上蒸发靶结构的系统和方法。 根据本发明，对目标结构中存储单元能量所需的入射光束能量进行与波长有关的计算。 然后，对于入射光束能量，计算预期沉积在衬底中作为波长的函数的能量。 识别出对应于预期沉积在衬底中的能量的较低值的波长，该低值基本上小于预期在较高波长下沉积在衬底中的能量的值。 提供的激光系统被配置为产生在预期沉积在衬底中的能量的相对较低值的波长处的激光输出。 激光输出以对应于期望沉积在衬底中的能量的相对较低值的波长指向衬底上的靶结构，以便蒸发靶结构。

公开(公告)号：US06559412B2

公开(公告)日：2003-05-06

申请号：US09968541

申请日：2001-10-02

申请人： William Lauer ,  Pierre Trepagnier ,  Donald Victor Smart ,  James Cordingley ,  Michael Plotkin

发明人： William Lauer ,  Pierre Trepagnier ,  Donald Victor Smart ,  James Cordingley ,  Michael Plotkin

IPC分类号： B23K2600

CPC分类号： H01L21/76888 ,  B23K26/042 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/10 ,  B23K26/361 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/50 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate. The laser output is directed at the target structure on the substrate at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate, in order to vaporize the target structure.

公开(公告)号：US06483071B1

公开(公告)日：2002-11-19

申请号：US09572925

申请日：2000-05-16

申请人： Bradley L. Hunter ,  Steven P. Cahill ,  Jonathan S. Ehrmann ,  Michael Plotkin

发明人： Bradley L. Hunter ,  Steven P. Cahill ,  Jonathan S. Ehrmann ,  Michael Plotkin

IPC分类号： B23K2602

CPC分类号： B23K26/046 ,  B23K26/02 ,  B23K26/04 ,  B23K26/043 ,  B23K26/0853 ,  B23K2101/40 ,  G03F7/70041 ,  G03F7/70725

摘要： A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis. The reference data is generated by the system which includes a modulator for reducing power of the material-processing laser beam to obtain a probe laser beam to measure height of the semiconductor wafer at a plurality of locations about the site to obtain reference height data. A computer computes a reference surface based on the reference height data. A trajectory planner generates trajectories for the wafer and the waist of the laser beam based on the reference surface.

摘要翻译： 提供了一种用于精确定位材料处理激光束的腰部以动态地补偿位于激光加工部位内间隔开的多个物体上的微结构的局部高度变化的高速方法和系统。 在优选实施例中，微结构是形成在半导体晶片的多个存储芯片上的多条导线。 该系统包括聚焦透镜子系统，用于沿着基本上垂直于平面的光轴聚焦激光束，用于在平面中移动晶片的x-y级，以及用于沿着光轴移动聚焦透镜子系统的第一空气轴承滑座。 参考数据由包括用于降低材料处理激光束的功率的调制器的系统产生，以获得探针激光束，以测量位于该位置的多个位置处的半导体晶片的高度，以获得参考高度数据。 计算机基于参考高度数据计算参考曲面。 轨迹计划器基于参考表面产生晶片和激光束的腰部的轨迹。

公开(公告)号：US06381259B2

公开(公告)日：2002-04-30

申请号：US09770275

申请日：2001-01-29

申请人： James J. Cordingley ,  Donald V. Smart ,  Michael Plotkin ,  William Lauer

发明人： James J. Cordingley ,  Donald V. Smart ,  Michael Plotkin ,  William Lauer

IPC分类号： H01S310

CPC分类号： B23K26/0736 ,  B23K26/0624 ,  B23K26/0643 ,  B23K26/0665 ,  B23K2101/38 ,  B23K2103/12

摘要： A laser polarization control apparatus includes a polarization modifying device and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam. An analyzer tool receives the laser beam modified by the polarization modification device and measures the modification of the polarization of the laser beam by the polarization modification device. A plurality of inputs are applied to the polarization modifying device to control modification of the polarization of the laser beam, and the laser beam modified by the polarization modification device is analyzed using the analyzer tool in order to measure modification of the polarization of the laser beam by the polarization modification device. The relationship between the inputs to the polarization control device and the modification of the polarization of the laser beam is stored.

摘要翻译： 激光偏振控制装置包括偏振修正装置和控制器。 偏振改变装置接收激光束并修改激光束的偏振。 控制器调整偏振修正装置的输入，以便基于由激光束处理的结构的对准来控制激光束的偏振的修改。 偏振修改装置被配置成结合到激光处理系统中，该激光处理系统产生由偏振修改装置接收的激光束，并且将由偏振修正装置修改的激光束聚焦在工件上，该工件包括要被激光束处理的结构 。 分析器工具接收由偏振修正装置修改的激光束并且通过偏振修正装置测量激光束的偏振的修改。 多个输入被施加到偏振修改装置以控制激光束的偏振的修改，并且使用分析器工具分析由偏振修正装置修改的激光束，以便测量激光束的偏振的修改 通过偏振改性装置。 存储偏振控制装置的输入与激光束的偏振的修正之间的关系。

公开(公告)号：US06181728B2

公开(公告)日：2001-01-30

申请号：US09109482

申请日：1998-07-02

申请人： James J. Cordingley ,  Donald V. Smart ,  Michael Plotkin ,  William Lauer

发明人： James J. Cordingley ,  Donald V. Smart ,  Michael Plotkin ,  William Lauer

IPC分类号： H01S310

CPC分类号： B23K26/0736 ,  B23K26/0624 ,  B23K26/0643 ,  B23K26/0665 ,  B23K2101/38 ,  B23K2103/12

摘要： A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam. An analyzer tool receives the laser beam modified by the polarization modification device and measures the modification of the polarization of the laser beam by the polarization modification device.

摘要翻译： 激光偏振控制装置包括诸如液晶可变延迟器的偏振修正装置和控制器。 偏振改变装置接收激光束并修改激光束的偏振。 连接到偏振修正装置的控制器调整偏振修正装置的输入，以便基于由激光束处理的结构的对准来控制激光束的偏振的改变。 例如，激光束的偏振可以旋转以对应于要被激光束切割的半导体器件中的连接件的对准。 偏振修改装置被配置成结合到激光处理系统中，该激光处理系统产生由偏振修改装置接收的激光束，并且将由偏振修正装置修改的激光束聚焦在工件上，该工件包括要被激光束处理的结构 。 分析器工具接收由偏振修正装置修改的激光束并且通过偏振修正装置测量激光束的偏振的修改。

公开(公告)号：US20130200050A1

公开(公告)日：2013-08-08

申请号：US13608454

申请日：2012-09-10

申请人： Jonathan S. Ehrmann ,  Joseph J. Griffiths ,  James J. Cordingley ,  Donald J. Svetkoff ,  Shepard D. Johnson ,  Michael Plotkin

发明人： Jonathan S. Ehrmann ,  Joseph J. Griffiths ,  James J. Cordingley ,  Donald J. Svetkoff ,  Shepard D. Johnson ,  Michael Plotkin

IPC分类号： B23K26/08 ,  B23K26/36

CPC分类号： B23K26/0869 ,  B23K26/0344 ,  B23K26/06 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/16 ,  B23K2103/50 ,  H01L21/76894 ,  H01L23/5258 ,  H01L27/10844 ,  H01L2924/0002 ,  Y10T29/49156 ,  H01L2924/00

摘要： The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.

公开(公告)号：US08269137B2

公开(公告)日：2012-09-18

申请号：US12233476

申请日：2008-09-18

申请人： Jonathan S. Ehrmann ,  Joseph J. Griffiths ,  James J. Cordingley ,  Donald J. Svetkoff ,  Shepard D. Johnson ,  Michael Plotkin

发明人： Jonathan S. Ehrmann ,  Joseph J. Griffiths ,  James J. Cordingley ,  Donald J. Svetkoff ,  Shepard D. Johnson ,  Michael Plotkin

IPC分类号： B23K26/36

CPC分类号： B23K26/0869 ,  B23K26/0344 ,  B23K26/06 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/16 ,  B23K2103/50 ,  H01L21/76894 ,  H01L23/5258 ,  H01L27/10844 ,  H01L2924/0002 ,  Y10T29/49156 ,  H01L2924/00

摘要： The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.

摘要翻译： 本发明涉及激光加工方法和系统的领域，具体涉及用于激光加工多材料装置的激光加工方法和系统。 系统和方法可以利用高速偏转器来改善处理能量窗口和/或提高处理速度。 在一些实施例中，偏转器用于束斑的非正交扫描。 在一些实施例中，偏转器用于实现目标结构的非同步处理。

公开(公告)号：US08243998B2

公开(公告)日：2012-08-14

申请号：US12749739

申请日：2010-03-30

申请人： Alexander Berkovich ,  Hila Nachlieli ,  Shai Emanueli ,  Haim Vladomirski ,  Michael Plotkin

发明人： Alexander Berkovich ,  Hila Nachlieli ,  Shai Emanueli ,  Haim Vladomirski ,  Michael Plotkin

IPC分类号： G06K9/00 ,  B41J2/45

CPC分类号： G06T7/0004 ,  G06T2207/20056 ,  G06T2207/30144

摘要： A method and apparatus are provided for evaluating the severity in a printed image of a repeating band print artifact. After electronically capturing the printed image, each of a plurality of patches taken from captured image is analysed to produce an artifact severity measure for the patch; an overall artifact severity value is then determined for the printed image from the patch severity measures. The analysis of each patch involves producing a spatial intensity profile across the patch substantially at right angles to an expected direction of extent of any repeating band print artifact present; a Fourier-related transform is then applied to the spatial intensity profile and the patch artifact severity measure generated by summing the resultant spatial frequency coefficients in a limited range about a frequency of interest.

摘要翻译： 提供了一种用于评估重复带打印伪像的打印图像中的严重性的方法和装置。 在电子捕获打印图像之后，分析从拍摄图像中取出的多个贴片中的每一个，以产生贴片的伪影强度测量; 然后根据补丁严重性度量确定打印图像的整体工件严重性值。 每个贴片的分析涉及产生跨越贴片的空间强度分布，其基本上与存在的任何重复带状印刷伪影的预期的程度方向成直角; 然后将傅里叶相关变换应用于空间强度分布和通过在关于感兴趣频率的有限范围内对所得到的空间频率系数进行求和而产生的斑块伪影强度测度。