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36 条记录 (耗时 0.024 秒)

    Method for dicing semiconductor wafer into chips
    24.
    发明授权
    Method for dicing semiconductor wafer into chips 失效

    公开(公告)号：US07121925B2

    公开(公告)日：2006-10-17

    申请号：US10240251

    申请日：2001-03-14

    申请人： Masaki Hashimura ,  Takao Sato ,  Koichi Ota

    发明人： Masaki Hashimura ,  Takao Sato ,  Koichi Ota

    IPC分类号： H01L21/00

    CPC分类号： H01L21/3046 ,  H01L21/3043 ,  H01L21/3081 ,  H01L21/78

    摘要： A method for dividing a semiconductor wafer into chips according to the present invention is a method for dividing a semiconductor wafer into a large number of semiconductor chips, the semiconductor wafer having a semiconductor layer formed on a substrate. A first method includes the step of forming a blast-resistant mask on a surface of the semiconductor wafer, the blast-resistant mask having a pattern for leaving a grid-like exposed portion as it is and the step of blasting a fine particular blast material to thereby form dividing grooves reaching a predetermined depth of the substrate in the grid-like exposed portion. A second method includes the step of forming first dividing grooves in a surface of the semiconductor wafer in which the semiconductor layer is formed, by dicing, etching or blasting, so that the first dividing grooves have a relatively narrow groove width, and the step of forming second dividing grooves in a surface of the semiconductor wafer in which the semiconductor layer is not formed by dicing, and in positions corresponding to the first dividing grooves, so that the second dividing grooves have a relatively wide groove width.

    Full-color light source unit
    25.
    发明授权
    Full-color light source unit 失效
    全彩光源单元

    公开(公告)号：US06540377B1

    公开(公告)日：2003-04-01

    申请号：US09709313

    申请日：2000-11-13

    申请人： Koichi Ota ,  Koichi Kaga ,  Yuji Takahashi ,  Yoshinobu Suehiro

    发明人： Koichi Ota ,  Koichi Kaga ,  Yuji Takahashi ,  Yoshinobu Suehiro

    IPC分类号： F21V900

    CPC分类号： G02B6/0018 ,  G02B6/0068 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light-emitting system has a base, and LEDs disposed on a front surface of the base. The alignment of the LEDs includes a first group of LEDs each having first and second electrodes on a light-emitting surface side, and a second group of LEDs each having a first electrode on the light-emitting surface side and a second electrode on the base side. The first group of LEDs and the second group of LEDs are arranged alternately in a line on the front surface of the base. The first group of LEDs includes at least one blue LED and green LEDs larger in number than the blue LED. The second group of LEDs includes red LEDs larger in number than the blue LED. A full-color light source unit is provided that includes the first and second groups of LEDS.

    摘要翻译： 发光系统具有基座，并且LED设置在基座的前表面上。 LED的对准包括在发光表面侧具有第一和第二电极的第一组LED，以及在发光表面侧具有第一电极的第二组LED和基板上的第二电极 侧。 第一组LED和第二组LED交替地布置在基座的前表面上的一行中。 第一组LED包括至少一个蓝色LED和比蓝色LED更大数量的绿色LED。 第二组LED包括数量大于蓝色LED的红色LED。 提供了包括第一组和第二组LED的全色光源单元。

    Group III nitride compound semiconductor light-emitting device
    27.
    发明授权
    Group III nitride compound semiconductor light-emitting device 有权
    III族氮化物化合物半导体发光器件

    公开(公告)号：US07304325B2

    公开(公告)日：2007-12-04

    申请号：US09845336

    申请日：2001-05-01

    申请人： Toshiya Uemura ,  Koichi Ota

    发明人： Toshiya Uemura ,  Koichi Ota

    IPC分类号： H01L21/00

    CPC分类号： H01L33/20 ,  H01L33/46

    摘要： A semiconductor laminate containing a light-emitting layer is etched to reveal a side surface. A reflection surface opposite to the side surface of the semiconductor laminate is provided in one and the same chip as the semiconductor laminate. A groove may be formed in the laminate by a dicing saw, and an outer side surface of the groove may be provided as the reflection surface.

    摘要翻译： 蚀刻含有发光层的半导体层叠体，以露出侧面。 与半导体层叠体的侧面相反的反射面设置在与半导体层叠体同一芯片中。 可以通过切割锯在层叠体中形成凹槽，并且可以设置凹槽的外侧表面作为反射表面。