公开(公告)号：US06978905B2

公开(公告)日：2005-12-27

申请号：US10452503

申请日：2003-06-03

Applicant: Feng Yao Chen

Inventor： Feng Yao Chen

IPC: A47B88/48 ,  A47B43/00

CPC classification number: A47B88/48

Abstract: A supporting frame with a casing has a frame body and a casing. The frame body has two inclined lower lateral rods at the lower end and two stopping posts at the upper front ends thereof. Two studs serve to fix the casing so that the casing is rotatable to protrude out of the frame body and can be drawn back into the frame body to be placed on the lower supporting rods. An upper side of the two opposite sides of the casing has a respective inclined edge. A rear lower end of each inclined edge has a protrusion. As the casing protrudes out of the frame body. The protrusion will resist against the stopping posts so that the casing will not leave from the frame body.

Abstract translation: 具有壳体的支撑框架具有框体和壳体。 框架主体在下端具有两个倾斜的下横向杆，在其上前端具有两个止动柱。 两个螺栓用于固定壳体，使得壳体可旋转以突出到框架体内并且可以被拉回到框架体中以放置在下支撑杆上。 壳体的两个相对侧的上侧具有相应的倾斜边缘。 每个倾斜边缘的后下端具有突起。 当外壳从框体突出时。 该突起将抵抗止动柱，使得外壳不会从框体离开。

公开(公告)号：USD494334S1

公开(公告)日：2004-08-10

申请号：US29186178

申请日：2003-07-11

Applicant: Feng Yao Chen

Designer： Feng Yao Chen

公开(公告)号：US08681137B2

公开(公告)日：2014-03-25

申请号：US13108985

申请日：2011-05-17

Applicant: Chee Heng Wong ,  Yu Feng Yao ,  Sze Ping Ong

Inventor： Chee Heng Wong ,  Yu Feng Yao ,  Sze Ping Ong

IPC: G06F3/038

CPC classification number: G01J1/4257 ,  G01J1/0219 ,  G01J1/0228 ,  G01J1/0437 ,  G01J1/06 ,  G01J1/4204 ,  G01J1/4228 ,  G09G3/3406 ,  G09G2360/144

Abstract: Various embodiments of an ambient light sensor configured to determine the direction of a beam of light incident thereon are disclosed. In one embodiment, an ambient light sensor is provided that comprises a plurality of light detectors arranged in a spatial array upon a light sensing surface. Each of the light detectors in the array is configured to generate an analog output voltage in response to the beam of ambient light falling thereon. The amount of light incident on the individual light detectors in the spatial array varies according to the position of each such sensor with respect to direction of the beam of ambient light. An analog-to-digital converter (ADC) is operably coupled to the plurality of light detectors and is configured to receive the analog output signals generated thereby as inputs thereto, and to provide digital output values representative of the analog signals. Control logic circuitry is operably coupled to the ADC and configured to receive the digital output values therefrom, and is further configured to process such digital output values to determine the direction of the beam of light incident upon the spatial array.

Abstract translation: 公开了配置成确定入射在其上的光束的方向的环境光传感器的各种实施例。 在一个实施例中，提供环境光传感器，其包括在光感测表面上以空间阵列布置的多个光检测器。 阵列中的每个光检测器被配置成响应于其上的环境光束而产生模拟输出电压。 入射到空间阵列中的各个光检测器的光量根据每个这样的传感器相对于环境光束的方向的位置而变化。 模数转换器（ADC）可操作地耦合到多个光检测器，并且被配置为接收由此产生的模拟输出信号作为其输入，并且提供表示模拟信号的数字输出值。 控制逻辑电路可操作地耦合到ADC并被配置为从其接收数字输出值，并且还被配置为处理这样​​的数字输出值以确定入射在空间阵列上的光束的方向。

公开(公告)号：US20130256650A1

公开(公告)日：2013-10-03

申请号：US13481856

申请日：2012-05-27

Applicant: Chih-Chung Yang ,  Horng-Shyang Chen ,  Shao-Ying Ting ,  Che-Hao Liao ,  Chih-Yen Chen ,  Chieh Hsieh ,  Hao-Tsung Chen ,  Yu-Feng Yao ,  Dong-Ming Yeh

Inventor： Chih-Chung Yang ,  Horng-Shyang Chen ,  Shao-Ying Ting ,  Che-Hao Liao ,  Chih-Yen Chen ,  Chieh Hsieh ,  Hao-Tsung Chen ,  Yu-Feng Yao ,  Dong-Ming Yeh

IPC: H01L33/28 ,  H01L33/34 ,  H01L33/32 ,  H01L33/26

CPC classification number: H01L33/025 ,  H01L33/22 ,  H01L33/382 ,  H01L2933/0091

Abstract: A semiconductor device and fabrication method thereof are provided, wherein the fabrication method of the semiconductor device includes the following steps. Forming a semiconductor layer on a substrate, wherein the semiconductor layer has a top surface and a bottom surface that is opposite to the top surface. The bottom surface is in contact with the substrate, and the top surface has a plurality of pits, the pits are extended from the top surface toward the bottom surface. Preparing a solution, wherein the solution includes a plurality of nanoparticles. Filling the nanoparticles into the pits. Forming a conducting layer on the semiconductor layer after filling the nanoparticles into the pits.

Abstract translation: 提供了半导体器件及其制造方法，其中半导体器件的制造方法包括以下步骤。 在基板上形成半导体层，其中半导体层具有与顶表面相对的顶表面和底表面。 底表面与基底接触，并且顶表面具有多个凹坑，凹坑从顶表面向底表面延伸。 制备溶液，其中溶液包括多个纳米颗粒。 将纳米颗粒填充到凹坑中。 在将纳米颗粒填充到凹坑中之后，在半导体层上形成导电层。

公开(公告)号：US20120263752A1

公开(公告)日：2012-10-18

申请号：US13517232

申请日：2010-12-20

Applicant: Feng Yao

Inventor： Feng Yao

IPC: A61K39/245 ,  A61P31/22 ,  C12N7/01

CPC classification number: A61K39/245 ,  A61K35/763 ,  A61K39/12 ,  A61K2039/5254 ,  A61K2039/5256 ,  A61K2039/545 ,  A61K2039/57 ,  C12N7/00 ,  C12N15/869 ,  C12N15/8695 ,  C12N2710/16011 ,  C12N2710/16021 ,  C12N2710/16034 ,  C12N2710/16062 ,  C12N2710/16071 ,  C12N2710/16611 ,  C12N2710/16621 ,  C12N2710/16622 ,  C12N2710/16634 ,  C12N2710/16661 ,  C12N2710/16662 ,  C12N2830/003 ,  C12N2830/006 ,  G01N33/56994

Abstract: The present invention is directed to Herpes simplex-2 viruses that may be used in vaccines to immunize patients against genital herpes.

Abstract translation: 本发明涉及可用于免疫患者的生殖器疱疹疫苗的单纯疱疹病毒2型病毒。

公开(公告)号：US20120177927A1

公开(公告)日：2012-07-12

申请号：US13287610

申请日：2011-11-02

Applicant: FENG-YAO CHENG

Inventor： FENG-YAO CHENG

IPC: B32B5/02 ,  B32B9/04 ,  B32B27/04 ,  B29C45/14

CPC classification number: B29C69/02 ,  B29C70/086 ,  B29K2021/003 ,  B29K2067/003 ,  B29K2075/00 ,  B29K2105/0872 ,  B29K2307/04 ,  Y10T428/30

Abstract: A method for making a molded carbon fiber prepreg includes the steps of: (a) thermocompressing a pristine carbon fiber prepreg that includes a carbon fiber substrate and a matrix resin impregnated into the carbon fiber substrate, and a thermoplastic material at an elevated temperature such that the thermoplastic material and the matrix resin of the pristine carbon fiber prepreg are subjected to a crosslinking reaction so as to form a crosslinked thermoplastic layer on the pristine carbon fiber prepreg; and (b) injection molding a thermoplastic elastomer onto the crosslinked thermoplastic layer. A molded carbon fiber prepreg obtained from the aforesaid method is also provided.

Abstract translation: 制造模制碳纤维预浸料的方法包括以下步骤：（a）将包含碳纤维基材和浸渍在碳纤维基材中的基质树脂的原始碳纤维预浸料热压缩，并且在高温下热塑成型热塑性材料，使得 将原始碳纤维预浸料坯的热塑性材料和基体树脂进行交联反应，以在原始碳纤维预浸料坯上形成交联的热塑性层; 和（b）将热塑性弹性体注射到交联的热塑性层上。 还提供了由上述方法得到的模制碳纤维预浸料。

公开(公告)号：US20110316776A1

公开(公告)日：2011-12-29

申请号：US12822352

申请日：2010-06-24

Applicant: Chi-Boon Ong ,  Yu-Feng Yao ,  Sze-Ping Ong

Inventor： Chi-Boon Ong ,  Yu-Feng Yao ,  Sze-Ping Ong

IPC: G06F3/033

CPC classification number: G06F3/033 ,  G06F3/0304 ,  G06F3/042

Abstract: Input devices configured to provide user interface by detecting three dimensional movement of an external object are disclosed. The input device comprises at least two photodetector pairs, a radiation source and a circuit configurable to detect differential and common mode signals generated in the photodetector pairs. By detecting the common mode and differential signals, movement of an external object may be determined and used to control a pointer, or a cursor.

Abstract translation: 公开了通过检测外部对象的三维运动来配置为提供用户界面的输入设备。 输入装置包括至少两个光电检测器对，辐射源和可配置为检测在光电检测器对中产生的差模和共模信号的电路。 通过检测共模和差分信号，可以确定外部对象的移动并用于控制指针或光标。

公开(公告)号：US20080251938A1

公开(公告)日：2008-10-16

申请号：US12098511

申请日：2008-04-07

Applicant: Chuen Khiang Wang ,  Hien Boon Tan ,  Anthony Yi Sheng Sun ,  Sin Nee Song ,  Steven Yu Feng Yao ,  Hua Hong Tan

Inventor： Chuen Khiang Wang ,  Hien Boon Tan ,  Anthony Yi Sheng Sun ,  Sin Nee Song ,  Steven Yu Feng Yao ,  Hua Hong Tan

IPC: H01L23/00

CPC classification number: H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip package and method of making the same. A first chip unit includes a first substrate and a first IC chip electrically connected to the first substrate. A second chip unit includes a second substrate and a second IC chip electronically connected to the second substrate. An adhesive material is provided on a surface of the first IC chip and the second chip unit is mounted onto the surface of the first chip unit including the adhesive material so that at least a portion of the second structure is encapsulated by the adhesive material, thereby providing some encapsulation in the same step as mounting. The first chip unit and the second chip unit may be separated by a spacer which may also provide an electrical connection.

Abstract translation: 一种半导体芯片封装及其制造方法。 第一芯片单元包括电连接到第一基板的第一基板和第一IC芯片。 第二芯片单元包括电子连接到第二基板的第二基板和第二IC芯片。 粘合材料设置在第一IC芯片的表面上，第二芯片单元安装在包括粘合材料的第一芯片单元的表面上，使得第二结构的至少一部分被粘合材料封装，从而 在与安装相同的步骤中提供一些封装。 第一芯片单元和第二芯片单元可以由也可以提供电连接的间隔件分开。

公开(公告)号：US20070190474A1

公开(公告)日：2007-08-16

申请号：US11345067

申请日：2006-02-01

Applicant: Chao Su ,  Jen-Feng Yao ,  Yang Fan

Inventor： Chao Su ,  Jen-Feng Yao ,  Yang Fan

IPC: F27D19/00

CPC classification number: F27D19/00 ,  F27D21/00 ,  H01L21/67017 ,  H01L21/67253

Abstract: A system comprises at least one semiconductor fabrication process apparatus with a fan for providing a downflow. A sensor is disposed on or in a conduit that is fluidly coupled to the semiconductor fabrication process apparatus for releasing an exhaust fluid of a process. The sensor is capable of detecting a characteristic of the exhaust fluid flowing within the conduit and producing a signal indicating the characteristic. A processor is coupled to the sensor. A venting apparatus is coupled to the processor. The processor compares the characteristic of the exhaust fluid with at least one predetermined value to control the venting apparatus.

Abstract translation: 系统包括具有用于提供下流的风扇的至少一个半导体制造处理装置。 传感器设置在流体耦合到半导体制造处理装置的导管中或导管中，用于释放过程的排出流体。 该传感器能够检测在管道内流动的排出流体的特性并产生表示该特征的信号。 处理器耦合到传感器。 排气装置连接到处理器。 处理器将排气流体的特性与至少一个预定值进行比较以控制排气装置。

公开(公告)号：US20060200837A1

公开(公告)日：2006-09-07

申请号：US11188359

申请日：2005-07-25

Applicant: Yun-Lung Chen ,  Jin-Feng Yao

Inventor： Yun-Lung Chen ,  Jin-Feng Yao

IPC: G11B33/02

CPC classification number: G06F1/181 ,  G11B33/027

Abstract: A keystroke apparatus for an optical disk drive includes a computer bezel (40), an optical disk drive (10) having a keystroke (12), a pressing member (20) movably attached to the computer bezel (40) and at least one spring (30) causing the pressing member (20) to come back to an original position. The pressing member (20) has a slanted resisting portion (25) for abutting against the keystroke (12). When the pressing member (20) is pressed, the resisting portion (25) drives the keystroke (12) to open or close the optical disk drive (10).

Abstract translation: 用于光盘驱动器的击键装置包括计算机挡板（40），具有击键（12）的光盘驱动器（10），可移动地附接到计算机框架（40）的按压构件（20）和至少一个弹簧 （30）使得按压构件（20）回到原始位置。 按压构件（20）具有用于抵靠击键（12）的倾斜阻力部分（25）。 当挤压构件（20）被按压时，抵抗部分（25）驱动击键（12）打开或关闭光盘驱动器（10）。