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公开(公告)号：US08492720B2
公开(公告)日：2013-07-23
申请号：US12796528
申请日：2010-06-08
Applicant: Yufeng Yao , Chi Boon Ong , Rani Saravanan
Inventor： Yufeng Yao , Chi Boon Ong , Rani Saravanan
IPC: G01J5/20
CPC classification number: H01L25/167 , G01S7/4813 , G01S17/026 , H01L24/97 , H01L2224/48247 , H01L2224/48465 , H01L2224/4917 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H03K17/941 , H03K2017/9455 , H01L2924/00
Abstract: In an embodiment, the invention provides a proximity sensor including a transmitter die, a receiver die, an ASIC die, a lead frame, wire bonds, a first transparent encapsulant, a second transparent encapsulant, and an opaque encapsulant. The transmitter die, the receiver die and the ASIC die are attached to portions of the lead frame. Wire bonds electrically connect the transmitter die, the receiver die, the ASIC die, and the lead frame. The first transparent encapsulant covers the receiver die, the ASIC die, the wire bonds, and a portion of the lead frame. The second transparent encapsulant covers the transmitter die, the wire bonds, and a portion of the lead frame. The opaque encapsulant covers portions of the first and second encapsulants and a portion of the lead frame.
Abstract translation: 在一个实施例中，本发明提供了一种接近传感器，其包括发射器管芯，接收器管芯，ASIC管芯，引线框架，引线接合，第一透明密封剂，第二透明密封剂和不透明密封剂。 发射器管芯，接收器管芯和ASIC管芯附接到引线框架的部分。 导线键合电连接发射器管芯，接收器管芯，ASIC管芯和引线框架。 第一透明密封剂覆盖接收器管芯，ASIC管芯，引线接合以及引线框架的一部分。 第二透明密封剂覆盖发射器模具，引线键合和引线框架的一部分。 不透明密封剂覆盖第一和第二密封剂的部分和引线框架的一部分。
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公开(公告)号：US20110297831A1
公开(公告)日：2011-12-08
申请号：US12796528
申请日：2010-06-08
Applicant: Yufeng Yao , Chi Boon Ong , Rani Saravanan
Inventor： Yufeng Yao , Chi Boon Ong , Rani Saravanan
IPC: H01L31/167 , H01L33/62 , H01L33/48
CPC classification number: H01L25/167 , G01S7/4813 , G01S17/026 , H01L24/97 , H01L2224/48247 , H01L2224/48465 , H01L2224/4917 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H03K17/941 , H03K2017/9455 , H01L2924/00
Abstract: In an embodiment, the invention provides a proximity sensor including a transmitter die, a receiver die, an ASIC die, a lead frame, wire bonds, a first transparent encapsulant, a second transparent encapsulant, and an opaque encapsulant. The transmitter die, the receiver die and the ASIC die are attached to portions of the lead frame. Wire bonds electrically connect the transmitter die, the receiver die, the ASIC die, and the lead frame. The first transparent encapsulant covers the receiver die, the ASIC die, the wire bonds, and a portion of the lead frame. The second transparent encapsulant covers the transmitter die, the wire bonds, and a portion of the lead frame. The opaque encapsulant covers portions of the first and second encapsulants and a portion of the lead frame.
Abstract translation: 在一个实施例中，本发明提供了一种接近传感器，其包括发射器管芯，接收器管芯，ASIC管芯，引线框架，引线接合，第一透明密封剂，第二透明密封剂和不透明密封剂。 发射器管芯，接收器管芯和ASIC管芯附接到引线框架的部分。 导线键合电连接发射器管芯，接收器管芯，ASIC管芯和引线框架。 第一透明密封剂覆盖接收器管芯，ASIC管芯，引线接合以及引线框架的一部分。 第二透明密封剂覆盖发射器模具，引线键合和引线框架的一部分。 不透明密封剂覆盖第一和第二密封剂的部分和引线框架的一部分。
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3.发明申请Compact Optical Proximity Sensor with Ball Grid Array and Windowed Substrate 有权紧凑型光学接近传感器，具有球栅阵列和窗形基板公开(公告)号：US20110057108A1
公开(公告)日：2011-03-10
申请号：US12557438
申请日：2009-09-10
Applicant: Yufeng Yao , Chi Boon Ong , Wee Sin Tan
Inventor： Yufeng Yao , Chi Boon Ong , Wee Sin Tan
IPC: H01L27/14 , H01L31/167
CPC classification number: H01L31/173 , G01S7/4813 , G01S17/026 , G01S17/48 , H01L25/167 , H01L31/0203 , H01L2224/48091 , H01L2924/3025 , H03K17/941 , H03K2017/9455 , H01L2924/00014 , H01L2924/00
Abstract: Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board (“PCB”) substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components.
Abstract translation: 公开了具有球栅阵列和窗口或有孔基板的紧凑型光学接近传感器的各种实施例。 在一个实施例中，光学接近传感器包括印刷电路板（“PCB”）基板，其包括孔和设置在其上的电触点的下表面，安装在基板的上表面上的红外光发射器和红外光检测器， 至少部分位于孔内的集成电路，设置在集成电路和衬底的部分之间的模制化合物，安装在集成电路的上表面上的环境光检测器，设置在其上的第一和第二模制红外光通过部件， 分别覆盖红外光发射器和红外光检测器，以及设置在第一和第二红外光通过部件的部分之间的模制的红外光切割部件。
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公开(公告)号：US20110057104A1
公开(公告)日：2011-03-10
申请号：US12631804
申请日：2009-12-04
Applicant: Yufeng Yao , Chi Boon Ong , Wee Sin Tan
Inventor： Yufeng Yao , Chi Boon Ong , Wee Sin Tan
CPC classification number: G01J1/32 , G01J1/44 , H01L2224/48465 , H01L2924/3025 , Y10T29/49126 , H01L2924/00
Abstract: Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, alight emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded to over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.
Abstract translation: 公开了一种小型化光学接近传感器的各种实施例。 在一个实施例中，环境光传感器和光检测器安装在第一和第二间隔件上，第一和第二间隔件依次安装到附接到基板的集成电路芯片的顶表面。 在环境光传感器，光检测器，集成电路，发射器和衬底的周边部分上模制透光的红外线通过化合物。 接下来，将光学上不透光的红外线切割化合物模制到透光性红外线通过化合物上方，以提供不具有金属屏蔽但呈现非常低串扰特性的小型化光学接近传感器。
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5.发明申请公开(公告)号：US20080158548A1
公开(公告)日：2008-07-03
申请号：US11618420
申请日：2006-12-29
Applicant: Dengpeng Chen , Chi Boon Ong , Chee Heng Wong
Inventor： Dengpeng Chen , Chi Boon Ong , Chee Heng Wong
IPC: G01N21/00
CPC classification number: G01J5/602 , G01J1/0488 , G01J1/1626 , G01J1/4228 , G01J2001/4247 , H04N9/735
Abstract: A sensor for measuring the properties of light from a light source is disclosed. The sensor includes first and second photodetectors that are illuminated by the light. The first and second photodetectors generate first and second photodetector signals indicative of the first and second weighted averages of the intensity of light in a wavelength band between 400 nm and 700 nm. The first photodiode is more sensitive to light having wavelengths between 400 nm and 500 nm than the second photodetector. The sensor also includes a color temperature processing circuit that generates a first processed signal that is related to a ratio of the first and second signals. The color temperature processing circuit could include first and second logarithmic amplifiers that generate first and second logarithmic signals, respectively, from the first and second photodetector signals and a subtraction circuit that forms a signal indicative of the difference between the first and second logarithmic signals.
Abstract translation: 公开了一种用于测量来自光源的光的性质的传感器。 传感器包括由光照射的第一和第二光电检测器。 第一和第二光电检测器产生指示在400nm和700nm之间的波长带中的光强度的第一和第二加权平均值的第一和第二光电检测器信号。 第一光电二极管对波长在400nm和500nm之间的光比第二光电检测器更敏感。 传感器还包括色温处理电路，其生成与第一和第二信号的比率有关的第一处理信号。 色温处理电路可以包括分别从第一和第二光电检测器信号产生第一和第二对数信号的第一和第二对数放大器，以及形成表示第一和第二对数信号之间的差的信号的减法电路。
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Patent Agency Ranking
公开(公告)号：US08711093B2
公开(公告)日：2014-04-29
申请号：US12822352
申请日：2010-06-24
Applicant: Chi-Boon Ong , Yu-Feng Yao , Sze-Ping Ong
Inventor： Chi-Boon Ong , Yu-Feng Yao , Sze-Ping Ong
IPC: G06F3/033
CPC classification number: G06F3/033 , G06F3/0304 , G06F3/042
Abstract: Input devices configured to provide user interface by detecting three dimensional movement of an external object are disclosed. The input device comprises at least two photodetector pairs, a radiation source and a circuit configurable to detect differential and common mode signals generated in the photodetector pairs. By detecting the common mode and differential signals, movement of an external object may be determined and used to control a pointer, or a cursor.
Abstract translation: 公开了通过检测外部对象的三维运动来配置为提供用户界面的输入设备。 输入装置包括至少两个光电检测器对，辐射源和可配置为检测在光电检测器对中产生的差模和共模信号的电路。 通过检测共模和差分信号，可以确定外部对象的移动并用于控制指针或光标。
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公开(公告)号：US08143608B2
公开(公告)日：2012-03-27
申请号：US12557516
申请日：2009-09-10
Applicant: Yufeng Yao , Chi Boon Ong
Inventor： Yufeng Yao , Chi Boon Ong
CPC classification number: G01S17/026 , G01S7/4813 , G01S17/48 , H01L25/167 , H01L31/0203 , H01L31/173 , H01L2224/48465 , H01L2924/3025 , H03K17/941 , H03K2217/94108 , H01L2924/00
Abstract: Various embodiments of a package-on-package optical sensor comprising three distinct different packages are disclosed. The three different packages are combined to form the optical proximity sensor, where the first package is a light emitter package, the second package is a light detector package, and the third package is an integrated circuit package. First and second infrared light pass components are molded or casted atop the light emitter package and the light detector package after they have been mounted atop the integrated circuit package. An infrared light cut component is then molded or casted between and over portions of the light emitter package and the light detector package.
Abstract translation: 公开了包括三个不同的封装的封装封装的光学传感器的各种实施例。 三个不同的组合被组合以形成光学接近传感器，其中第一封装是光发射器封装，第二封装是光检测器封装，第三封装是集成电路封装。 第一和第二红外光通过部件在它们被安装在集成电路封装之上之后被模制或铸造在光发射器封装和光检测器封装之上。 然后将红外光切割部件模制或铸造在光发射器封装和光检测器封装的部分之间。
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公开(公告)号：US20100283394A1
公开(公告)日：2010-11-11
申请号：US12463373
申请日：2009-05-08
Applicant: Chi Boon Ong
Inventor： Chi Boon Ong
CPC classification number: G01J1/16 , G01J1/04 , G01J1/0425 , G01J1/4204 , G02B6/0006 , G02B6/0008
Abstract: Disclosed are various embodiments of a light guide and corresponding ambient light sensor, computing device and backlit display for use in a portable electronic device. The various embodiments of the light guide are configured to permit ambient light to be collected efficiently and accurately over wide angles of incidence, even under low-ambient-light conditions. The efficient and accurate collection of ambient light by the various embodiments of the light guide disclosed herein may be employed to more accurately control the amount and degree of backlighting provided to a backlit display, which in turn can be used to conserve valuable battery power in a portable electronic device.
Abstract translation: 公开了用于便携式电子设备的光导和相应的环境光传感器，计算设备和背光显示器的各种实施例。 光导的各种实施例被配置为即使在低环境光条件下也能够在宽的入射角下有效且准确地收集环境光。 可以采用本文公开的光导的各种实施例来有效和精确地收集环境光，以更精确地控制提供给背光显示器的背光的数量和程度，反过来又可以用来节省有价值的电池功率 便携式电子设备。
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9.发明授权公开(公告)号：US07604360B2
公开(公告)日：2009-10-20
申请号：US11618420
申请日：2006-12-29
Applicant: Dengpeng chen , Chi Boon Ong , Chee Heng Wong
Inventor： Dengpeng chen , Chi Boon Ong , Chee Heng Wong
CPC classification number: G01J5/602 , G01J1/0488 , G01J1/1626 , G01J1/4228 , G01J2001/4247 , H04N9/735
Abstract: A sensor for measuring the properties of light from a light source is disclosed. The sensor includes first and second photodetectors that are illuminated by the light. The first and second photodetectors generate first and second photodetector signals indicative of the first and second weighted averages of the intensity of light in a wavelength band between 400 nm and 700 nm. The first photodiode is more sensitive to light having wavelengths between 400 nm and 500 nm than the second photodetector. The sensor also includes a color temperature processing circuit that generates a first processed signal that is related to a ratio of the first and second signals. The color temperature processing circuit could include first and second logarithmic amplifiers that generate first and second logarithmic signals, respectively, from the first and second photodetector signals and a subtraction circuit that forms a signal indicative of the difference between the first and second logarithmic signals.
Abstract translation: 公开了一种用于测量来自光源的光的性质的传感器。 传感器包括由光照射的第一和第二光电检测器。 第一和第二光电检测器产生指示在400nm和700nm之间的波长带中的光强度的第一和第二加权平均值的第一和第二光电检测器信号。 第一光电二极管对波长在400nm和500nm之间的光比第二光电检测器更敏感。 传感器还包括色温处理电路，其生成与第一和第二信号的比率有关的第一处理信号。 色温处理电路可以包括分别从第一和第二光电检测器信号产生第一和第二对数信号的第一和第二对数放大器，以及形成表示第一和第二对数信号之间的差的信号的减法电路。
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公开(公告)号：US20060060762A1
公开(公告)日：2006-03-23
申请号：US10947088
申请日：2004-09-22
Applicant: Serene Chan , Chee Lim , Tammy Ho , Wee Tan , Freddy Ho , Peng Ng , Josephine Quek , Chi-Boon Ong , Sin Lim , Kuldeep Saxena
Inventor： Serene Chan , Chee Lim , Tammy Ho , Wee Tan , Freddy Ho , Peng Ng , Josephine Quek , Chi-Boon Ong , Sin Lim , Kuldeep Saxena
CPC classification number: H04M1/605 , H04M1/0245 , H04M2250/12
Abstract: An electronic device having a first piece, a second piece moveable with respect to the first piece, and a position sensor operable to sense the position of the second piece relative to the first piece. The electronic device is operated in a first mode or a second mode dependent upon the position of the second piece relative to the first piece. Optionally, a proximity sensor is provided to detect the presence of a body in close proximity to the device when the second piece is in an open position relative to the first piece.
Abstract translation: 一种电子设备，具有第一部件，可相对于第一部件移动的第二部件以及可操作以感测第二部件相对于第一部件的位置的位置传感器。 取决于第二件相对于第一件的位置，电子装置以第一模式或第二模式操作。 可选地，提供接近传感器以当第二部件相对于第一部件处于打开位置时检测紧邻装置的身体的存在。
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