Abstract:
A system for sharing a power delivery controller is described herein. The system includes a plurality of ports and a power delivery controller communicatively coupled to the plurality of ports. The power delivery controller is to send a first message to a particular port of the plurality of ports and remain connected to the particular port and enable power delivery to the particular port in response to a particular return message from the port.
Abstract:
A bi-directional charger may be provided that includes a logic, at least a portion of which is hardware, to determine an operational mode based at least on a characteristic at a battery port or at a charge port, and to control power flow between the charge port and the battery port based on the determined operational mode.
Abstract:
A master mould is made by wire cutting a plate in two or more directions to provide a base with an array of master mould needles protruding therefrom. The size and shape of the master mould needles can readily be varied by varying the angles of upward and downward cuts in the two or more directions. The master mould is used to make a secondary mould by hot embossing a secondary mould plate onto the master mould. This forms through-holes in the secondary mould. The secondary mould is plated with a layer of metal, which forms a microneedle array.
Abstract:
Systems and methods may provide for a charger that includes a converter with a battery port, a first bypass switch coupled to a first bus port and the battery port, and a second bypass switch coupled to a second bus port and the battery port. Additionally, a charge controller may use one or more control signals to manage power to be delivered from the first bus port through the first bypass switch to the battery port, and power to be delivered from the second bus port through the second bypass switch to the battery port.
Abstract:
An integrated circuit package includes: an integrated circuit having a surface at least partially covered by a metal layer; at least one connection point; at least one connector electrically connecting the integrated circuit with the at least one connection point; and encapsulating material encapsulating the at least one connector, at least some of the integrated circuit and at least some of the at least one connection point, such that a contact surface of the at least one connection point and the metal layer on the integrated circuit are exposed outside the encapsulating material.
Abstract:
A transducer is provided that comprises a horn having a longitudinal axis, a bonding tool attached to the horn, and an ultrasonic generator attached to the horn and spaced from the bonding tool along the longitudinal axis of the horn. A flexure is attached to the horn between the bonding tool and the ultrasonic generator for supporting the horn whereby to increase its dynamic rigidity in directions transverse to the longitudinal axis. (FIG. 3A)