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公开(公告)号：US20190154820A1
公开(公告)日：2019-05-23
申请号：US16252382
申请日：2019-01-18
CPC分类号： G01S7/5208 , A61B5/7257 , A61B8/4483 , A61B8/5207 , G01S7/5202 , G01S7/52025 , G01S7/52026 , G01S7/52033 , G01S7/52034 , G01S7/52047 , G01S15/8915
摘要： Ultrasound signal processing circuitry and related apparatus and methods are described. Signal samples received from an ultrasound transducer array in an ultrasound transducer based imaging system may be processed, or conditioned, by application of one or more weighting functions. In some embodiments, one or more weighting functions may be applied to the signal samples in the time domain. In other embodiments, the signal samples may be converted to the frequency domain and one or more weighting functions may be applied in the frequency domain. In further embodiments, one or more weighting functions may be applied in the time domain and one or more weighting functions may be applied in the frequency domain. The weighting functions may be channel dependent and/or channel independent. The processed data can be provided to an image formation processor.
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公开(公告)号：US20190149110A1
公开(公告)日：2019-05-16
申请号：US16245202
申请日：2019-01-10
发明人： Amandeep Singh , Kailiang Chen , Tyler S. Ralston
CPC分类号： H03F3/45179 , B06B1/0223 , G01H17/00 , G01N29/2406 , G01N29/36 , G01N29/4463 , G01S7/52033 , G01S7/523 , G01S7/526 , G01S15/89 , H03F3/30 , H03F2200/129 , H03F2200/294 , H03F2203/45524 , H03M1/12 , H03M1/124
摘要： An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.
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公开(公告)号：US10272470B2
公开(公告)日：2019-04-30
申请号：US15581511
申请日：2017-04-28
发明人： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要： CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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公开(公告)号：USD846269S1
公开(公告)日：2019-04-23
申请号：US29631757
申请日：2018-01-02
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25.发明授权公开(公告)号：US10266401B2
公开(公告)日：2019-04-23
申请号：US15910776
申请日：2018-03-02
发明人： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要： Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
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公开(公告)号：USD846128S1
公开(公告)日：2019-04-16
申请号：US29633383
申请日：2018-01-12
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公开(公告)号：US20190069842A1
公开(公告)日：2019-03-07
申请号：US16122956
申请日：2018-09-06
发明人： Jonathan M. Rothberg , Gregg Fergus , Keith G. Fife , Tyler S. Ralston , Nevada J. Sanchez , Jaime Scott Zahorian , Kailiang Chen , Christopher Thomas McNulty
摘要： Aspects of the technology described herein relate to an apparatus including an ultrasound-on-a-chip device configured to be bound to a user's wrist. The ultrasound-on-a-chip device may include a two-dimensional array of ultrasonic transducers. The transducers may be capacitive micromachined ultrasonic transducers (CMUTs) and may be configured to emit ultrasound waves having a frequency between approximately 5-20 MHz. A coupling strip may be coupled to the ultrasound-on-a-chip device to reduce the air gap between the ultrasound-on-a-chip device and the user's wrist. The ultrasound-on-a-chip device may be waterproof and may be able to perform both transverse and longitudinal ultrasound scanning without being rotated. The ultrasound-on-a-chip device may be configured to calculate pulse wave velocity through a blood vessel in a user's wrist.
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公开(公告)号：US10196261B2
公开(公告)日：2019-02-05
申请号：US15453846
申请日：2017-03-08
发明人： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Jaime Scott Zahorian
摘要： Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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公开(公告)号：US20190000418A1
公开(公告)日：2019-01-03
申请号：US16112436
申请日：2018-08-24
发明人： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife
摘要： A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.
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公开(公告)号：US20180364201A1
公开(公告)日：2018-12-20
申请号：US16109703
申请日：2018-08-22
摘要： Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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