Abstract:
An electron beam exposure apparatus which exposes a wafer (118) by using a plurality of electron beams corrects the positional error of the electron beams by using multi-deflector arrays (105, 106) capable of independently deflecting the positions of the electron beams, and pattern data to be projected onto the wafer (118). More specifically, when each of the electron beams is deflected to a predetermined exposure position on the basis of the pattern data, a static positional error independent of the deflection position is corrected by the multi-deflector arrays (105, 106), and a dynamic positional error depending on the deflection position is corrected on the basis of the pattern data.
Abstract:
The present invention is generally directed to various reticle writing methodologies to reduce write time, and a system for performing same. In one illustrative embodiment, the method comprises exposing a layer of photoresist in accordance with a first writing pattern in a first area of the layer of photoresist and exposing the layer of photoresist in accordance with a second writing pattern in a second area of the layer of photoresist, the first and second areas of the layer of photoresist overlapping one another in at least one region. In another illustrative embodiment, the method comprises creating a collection of digital data corresponding to a desired pattern for a reticle and separating the collection of digital data into at least two separate groups of data, a first of the data groups being used to define a first writing pattern for the reticle, a second of the data groups being used to define a second writing pattern for the reticle, wherein the first and second writing patterns overlap one another in at least one region. In yet another illustrative embodiment, the method comprises forming a layer of photoresist above at least one of a semiconducting substrate and a process layer, exposing the layer of photoresist in accordance with a first writing pattern in a first area of the layer of photoresist, and exposing the layer of photoresist in accordance with a second writing pattern in a second area of the layer of photoresist, wherein the first and second areas overlap one another in at least one region.
Abstract:
A signal component for scanning a processing range and a signal component for synchronizing to movement of a moving stage are superimposed on an ion beam scanning signal. Using such a scanning signal, processing is carried out while moving a sample stage. In this way, it is possible to carry out processing using a focused ion beam device in a reduced amount of time for a plurality of samples.
Abstract:
A beam direct-writing apparatus for writing a pattern on a semiconductor substrate is provided with a head part for emitting an electron beam for direct writing and a computer for performing a computation. A program is installed in the computer in advance to obtain a path passing through a plurality of writing points on the substrate. The program divides a region (6) dotted with writing points (60) into a plurality of divided regions on the basis of the density of the points contained therein and sets a passing order among a plurality of divided regions by using an algorithm for generating the Hilbert Curve. Subsequently, the program sets a path in each of the divided regions by using a path setting algorithm and subsequently connects the path in one divided region to the path in another divided region according to the passing order, to obtain a final path (74). This allows an efficient beam direct-writing on a substrate (9).
Abstract:
Charged-particle-beam (CPB) microlithography systems are disclosed that include a device for measuring the distribution of charged-particle density in a patterned beam. By providing feedback to the CPB microlithography apparatus, the distribution of charged-particle density can be optimized for high-quality exposures. An embodiment of the device includes a pinhole diaphragm defining an aperture having a small cross-dimension compared to the transverse width of the patterned beam produced by the system. The device also desirably includes a downstream scattering-contrast diaphragm defining an aperture having a larger cross dimension than that of the pinhole aperture. A photodiode or the like is downstream of the pinhole aperture and is used for detecting charged particles transmitted by the pinhole diaphragm. A patterned beam is scanned across the pinhole aperture, and charged particles not scattered during passage through the pinhole aperture propagate to the photodiode. The distribution of charged particle density is obtained from the photodiode signal, which can be fed back to components of the CPB microlithography system.
Abstract:
An electron beam lithography apparatus includes a control device in which, for each column stripe in each drawing time of multiple drawing, optional conditions of dividing a pattern to be drawn on the sample can be set; and a time obtained by dividing a total irradiation time by the number of total drawing times is set to an electron beam-irradiation time. Further, the control device controls a deflection device so as to deflect the electron beam in accordance with the set conditions of pattern-division and the set electron beam-irradiation time.
Abstract:
Two or more-staged masks are prepared for a charged beam generating source. One mask has first aperture sections having rectangular apertures arranged into a lattice form, and electrodes which deflects a beam at respective first aperture sections. The other mask has a second aperture section having basic figure apertures for shaping the beam which passes or passed through the first aperture sections. Layout data of a semiconductor apparatus are divided into sizes of the basic figures which take reduction in exposure into consideration so as to be classified according to the basic figures. The beam which is shaped into a form of an overlapped portion of the divided layouts and the classified basic figure is emitted onto a sample.
Abstract:
An electron beam exposure apparatus for exposing a wafer by an electron beam, including: an electron beam generating section for generating the electron beam; a deflector for deflecting the electron beam; a deflection control section for outputting a deflection control signal for causing the deflector to deflect the electron beam; and a control signal storage section for storing a value of the deflection control signal output from the deflection control section. The control signal storage section and the deflector may be monolithically integrated on a semiconductor substrate.
Abstract:
The present invention intends to improve the writing accuracy in an electron beam writing system using discrete multi beams in which the interval of the beams is larger than the size of the beams. In electron beam writing equipment which uses means generating multi electron beams; means on/off controlling each of the multi electron beams according to pattern data that should be written; and means deflecting the multi electron beams together, thereby performing writing on a wafer, one side of a unit writing area of the multi electron beams is larger than substantially twice the interval of the electron beams or substantially an integral multiple thereof.
Abstract:
The present invention provides a high-precision and high-speed electron beam exposure technique which corrects the position of each beam in a multi-beam exposure method without using a deflection array and a huge and high-precision driving circuit. In an electron beam exposure method for forming a desired pattern onto a specimen by independently controlling emission and scanning of a plurality of electron beams, a deviation between a pattern formed by each of the plurality of electron beams and the desired pattern is controlled by shifting the position of pattern data of the pattern formed by each of the plurality of electron beams.