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    Film deposition method and apparatus
    11.
    发明授权
    Film deposition method and apparatus 失效
    薄膜沉积方法和装置

    公开(公告)号：US06852626B1

    公开(公告)日：2005-02-08

    申请号：US09830611

    申请日：1999-10-29

    Applicant: Yuichi Wada ,  Hiroyuki Yarita ,  Hisashi Aida ,  Naomi Yoshida

    Inventor： Yuichi Wada ,  Hiroyuki Yarita ,  Hisashi Aida ,  Naomi Yoshida

    IPC: H01L21/3205 ,  C23C18/02 ,  H01L21/00 ,  H01L21/288 ,  H01L23/52 ,  H01L21/44

    CPC classification number: H01L21/6715 ,  H01L21/288

    Abstract: In the film deposition method of the present invention, an organometallic fluid, which has an organic metal such as a copper diketonate as its main component, and which precipitates film deposition material through a pyrolytic decomposed reaction, is first prepared; and the organometallic fluid is then applied onto a semiconductor wafer at a certain temperature within the non-reactive range of the organic metal. Afterwards, the wafer is heated to a predetermined temperature, the organic metal within the organometallic fluid that is applied onto the wafer is pyrolytically decomposed, and film is formed on the wafer. With this method, since application is performed at a temperature within the non-reactive range of the organic metal, deposition of the film does not occur, allowing uniform and homogenous application to be performed. Also, since pyrolytic decomposition is performed separately in a later process, a stable reaction may be assured, so that a film of uniform thickness and quality may be deposited.

    Abstract translation: 在本发明的膜沉积方法中，首先制备具有二硫酸铜铜等有机金属作为主要成分的有机金属液，并通过热分解反应析出析出材料。 然后将有机金属液体以有机金属的非反应性范围内的一定温度施加到半导体晶片上。 然后将晶片加热到预定温度，施加到晶片上的有机金属液中的有机金属被热分解，并且在晶片上形成膜。 利用该方法，由于在有机金属的非反应性范围内的温度下进行施加，所以不会发生膜的沉积，从而能够进行均匀且均匀的涂布。 此外，由于在后续工艺中分开进行热分解，因此可以确保稳定的反应，从而可以沉积均匀的厚度和质量的膜。

    Water-repellent metal oxide film coated on glass substrate and method of forming same
    13.
    发明授权
    Water-repellent metal oxide film coated on glass substrate and method of forming same 失效
    涂覆在玻璃基板上的防水金属氧化物膜及其形成方法

    公开(公告)号：US5250322A

    公开(公告)日：1993-10-05

    申请号：US990995

    申请日：1992-12-16

    Applicant: Osamu Takahashi ,  Hiroaki Arai

    Inventor： Osamu Takahashi ,  Hiroaki Arai

    IPC: C03C17/28 ,  C03C17/00 ,  C03C17/30 ,  C09K3/18 ,  C23C18/02 ,  B05D3/02

    CPC classification number: C03C17/30 ,  C03C17/009 ,  Y10T428/31612

    Abstract: The disclosure relates to a metal oxide film formed on a glass substrate by the so-gel process with using a solution of a metal alkoxide. To afford water repellency to the oxide film, a fluoroalkylsilane is mixed with an alkoxysilane solution in the molar ratio of the alkoxysilane to the fluoroalkylsilane ranging from 1:10 to 10:1. Then, the mixed solution is diluted with a solvent such that the total concentration of the alkoxysilane and the fluoroalkylsilane is from 1 to 10 wt % in a diluted solution. Then, water in the amount of 100 mol % to 1000 mol % of the total amounts of the fluoroalkylsilane and the alkoxysilane is added to the diluted solution so as to partially hydrolyze the fluoroalkylsilane and the alkoxysilane, thereby forming a sol. Then, the sol is applied to the glass substrate, and the coated glass substrate is heated so as to form the metal oxide film thereon.

    Abstract translation: 本公开涉及通过使用金属醇盐溶液的凝胶法在玻璃基板上形成的金属氧化物膜。 为了提供对氧化膜的拒水性，将氟烷基硅烷与烷氧基硅烷溶液以1:10至10:1的摩尔比与烷氧基硅烷与氟代烷基硅烷的摩尔比混合。 然后，用溶剂稀释混合溶液，使稀释溶液中烷氧基硅烷和氟烷基硅烷的总浓度为1〜10重量％。 然后，向稀释溶液中加入氟烷基硅烷和烷氧基硅烷总量的100摩尔％至1000摩尔％的水，以使氟烷基硅烷和烷氧基硅烷部分水解，从而形成溶胶。 然后，将该溶胶涂布在玻璃基板上，对该被覆玻璃基板进行加热，在其上形成金属氧化膜。

    Aluminum plating process
    15.
    再颁专利
    Aluminum plating process 失效

    公开(公告)号：USRE27606E

    公开(公告)日：1973-04-03

    申请号：US27606D

    申请日：1971-08-16

    IPC: C07D207/27 ,  C23C18/02

    CPC classification number: C23C18/02

    Abstract: ALUMINUM IS PLATED ON A SUBSTRATE BY CONTACTING THE SUBSTRATE WITH ALUMINUM HYDRIDE AND A DECOMPOSITION CATALYST. THE DECOMPOSITION CATALYST IS A COMPOUND OF A METAL OF GROUP IVB OR VB OF THE PERIODIC TABLE OR MICTURES THEREOF.

    Method of forming corrosion resistant films on steel plates
    16.
    发明授权
    Method of forming corrosion resistant films on steel plates 失效
    在钢板上形成耐腐蚀膜的方法

    公开(公告)号：US3677797A

    公开(公告)日：1972-07-18

    申请号：US3677797D

    申请日：1970-04-27

    Applicant: NIPPON STEEL CORP

    Inventor： ASANO HIDEJIRO ,  OUYAGI YASHICHI

    IPC: B05D7/14 ,  C23C8/10 ,  C23C18/02 ,  C23C3/04 ,  C23F17/00

    CPC classification number: C23C8/10 ,  C23C18/02 ,  Y10T428/12944 ,  Y10T428/12972

    Abstract: A PROCESS FOR PRODUCING A SURFACE-TREATED STEEL PLATE HIGH IN THE ANTICORROSIVENESS, PARTICULARLY ADAPTED AS A MATERIAL FOR MAKING CANS, ON THE PRINCIPLE OF THE THERMODECOMPOSING PLATING, WHEREIN THE STEEL PLATE IS COATED WITH AN AQUEOUS SOLUTION CONTAINING NITRATE AND/OR ACETATE OF NI AS THE MAIN COMPONENT THEREOF AND OF OTHER METALS SUCH AS CR, MN, ZN AND AL AS SELECTIVE COMPONENTS AND THEN HEATED AT A CERTAIN RANGE OF TEMPERATURE SO AS TO CAUSE THE THERMODECOMPOSING REACTION TO CAUSE THEREBY A STRONG FILM CONTAINING METALLIC NICKEL AND AT LEAST ONE METAL OXIDE TO FORM ON THE SURFACE OF THE STEEL PLATE.

    Process of forming a metallic copper layer on the surface of workpiece of aluminum or aluminum base alloy
    17.
    发明授权
    Process of forming a metallic copper layer on the surface of workpiece of aluminum or aluminum base alloy 失效
    在铝或铝基合金工件表面形成金属铜层的工艺

    公开(公告)号：US3666520A

    公开(公告)日：1972-05-30

    申请号：US3666520D

    申请日：1970-08-31

    Applicant: SUMITOMO LIGHT METAL IND

    Inventor： TERAI SHIRO ,  SUGIYAMA YOSHIHIKO ,  SUZUKI TOSHIO ,  IRIE HIROSHI

    IPC: C23C18/02 ,  C23C3/04

    CPC classification number: C23C18/02

    Abstract: THIS NVENTION RELATES TO A PROCESS OF FORMING A METALLIC COPPER LAYER OF A UNIFORM THICKNESS ON THE SURFACE OF WORKPIECE MADE OF ALUMINUM OR ALUMINUM BASE ALLOY BY APPLYING FINELY DIVIDED COPPER HALIDE PARTICLES ON SAID SURFACE UNIFORMLY WITH AID OF A HIGHER ALIPHTIC MONOHYDRIC ALCOHOL CONTAINING 6-12 CARBON ATOMS OR A CYCLOALIPHATIC MONO-HYDRIC ALCOHOL CONTAINING 6-8 CARBON ATOMS AS THE ADHESIVE MEDIUM, AND THEN HEATING SAID SURFACE TO A SUFFICIENT TEMPERATURE TO REACT THE COPPER HALIDE WITH THE ALUMINUM MATERIAL OF THE WORKPIECE AT THE SURFACE OF THE WORKPIECE, WHEREBY METALLIC COPPER IS LIBERATED, DEPOSITED ON AND PARTLY DIFFUSED INTO THE SURFACE OF THE WORKPIECE AND A FIRMLY ADHERED COPPER LAYER OF A UNIFORM THICKNESS MAY BE FORMED ON THE SURFACE OF THE ALUMINUM OR ALUMINUM BASE ALLOY MATERIAL AND, IF DESIRED, WITHIN A SHARPLY LIMITED AREA OF THE SURFACE OF THE WORKPIECE.

    Aluminum plating process
    18.
    发明授权
    Aluminum plating process 失效
    铝镀层工艺

    公开(公告)号：US3639139A

    公开(公告)日：1972-02-01

    申请号：US3639139D

    申请日：1968-10-07

    Applicant: DOW CHEMICAL CO

    Inventor： SCHNEGGENBURGER ROGER G ,  HELLMANN REINHOLD

    IPC: C23C18/02 ,  C23C3/04

    CPC classification number: C23C18/02

    Abstract: A process for depositing a metallic aluminum film on a substrate material which comprises: depositing a transition metal catalyst on said substrate; depositing an aluminum hydride compound on said substrate in contact with said catalyst; contacting said treated substrate in a heated bath consisting of an inert liquid, thereby decomposing said aluminum hydride material and providing a metallic aluminum coating on said substrate; removing said aluminum coated substrate from said bath and removing said inert liquid to provide said metallic aluminum coating on the substrate.

    Abstract translation: 一种在基材上沉积金属铝膜的方法，包括：在所述基材上沉积过渡金属催化剂; 在与所述催化剂接触的所述衬底上沉积氢化铝化合物; 在由惰性液体组成的加热浴中使所述经处理的基材接触，从而分解所述氢化铝材料并在所述基材上提供金属铝涂层; 从所述浴中除去所述铝涂覆的基底并除去所述惰性液体，以在基底上提供所述金属铝涂层。

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