Abstract:
High density primary wiring patterns are formed on printed wiring boards with far less than 0.005 inch spacings and wiring conductor widths, which surprisingly permit wider conductors of at least three times the wiring spacing thus less likely to have open circuit or substrate adherance defects. This is achieved by depositing on an irregular surface of a conventional "flat" panel insulator a thick liquid photopolymer layer of paste-like consistency, such as 0.006 inch thickness, flattening it with the image bearing side of a glass plate phototransparency to produce high resolution wiring patterns comprising ridge tops defining insulating spacing between channel conductor areas therebetween by means of uncollimated actinic radiation, forming thin conductive layers 0.0014 inch thick on the channel bottoms and sidewalls to produce wider conductors, and sanding off the flat ridge tops to assure that there are no short circuits between adjacent conductors.
Abstract:
A mounter capable of curtailing interference between a mounting head that has a component holding section, and an exchange-use component holding section and a storage section that holds the exchange-use component holding section. A controller of the mounter reads head identification information for identifying the mounting head from the mounting head. Also, different quantities of protruding sections are formed on nozzle tray in accordance with the height in the Z-axis direction. Also, pressure switches that are pressed by protruding sections so as to turn on and off are provided on loading plate on which nozzle tray is loaded. By this, the controller is able to determine whether interference will occur between the mounting head and nozzle tray based on the detection signal of the pressure switches before the mounting head is moved.
Abstract:
A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.
Abstract:
A resistor/capacitor identification detection (RCID) circuit may provide system level identification of hardware (e.g. circuit board ID) through a single pin interface, by identifying up to a specified number of more than two quantized RC time constant states by measuring the discharge and charge times of an external RC circuit coupled to the single pin. The RCID circuit may initiate the discharge followed by a charging of the external RC circuit. The signal developed at the signal pin may be provided to the input of a threshold detector, with the threshold set at a specified percentage of a supply voltage used for operating the RCID circuit. The digitized output of the threshold detector may be used to gate a counter, after having been filtered through an input glitch rejection filter. A resolution of the counter may be determined by a high frequency clock used for clocking the counter. The numeric values of the charge and discharge times may be stored in data registers comprised in the RCID circuit.
Abstract:
A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.
Abstract:
A lot traceable printed circuit board (PCB) includes a substrate having thereon a patterned circuit layer and a working zone carrying production information related to the PCB itself. The working zone includes a plurality of code boxes, wherein each of the code boxes has a first probe region and second probe region. A single set of resistance test loop is disposed within the first probe region. Four sets of resistance test loops are disposed within the second probe region. A frying probe tester is used to probe the set of resistance test loops respectively for abstracting the production information recorded in the working zone.
Abstract:
An in-circuit testing and repairing system for printed circuit boards includes an in-circuit testing device for testing printed circuit boards, a shop floor control system connected to the in-circuit testing device via a network for collecting and processing the test data produced by the testing device, and a repair station including an electronic device for displaying information of a faulty printed circuit board. The electronic device connected to the shop floor control system. The test data from the in-circuit testing device is automatically transferred to the shop floor via the network for processing, and the processed test data is sent back to the in-circuit testing device, the test data of the faulty printed circuit board is sent from the shop floor controlling system to the repair station.
Abstract:
A circuit board inspection apparatus aims to inspect a circuit board panel which contains a plurality of sub-panels. The panel is bonded with a panel barcode and each sub-panel is bonded with a different sub-panel barcode. The circuit board inspection apparatus includes an automatic optic inspection (AOI) system to inspect the circuit board panel and read the panel barcode and the sub-panel barcode, a data link module to link data contained in the panel barcode and the sub-panel barcode and generate linkage data, and a database to store the linkage data. The relationship of the panel and the sub-panel may still be maintained through the linkage data provided by the data link module even after the panel and the sub-panel have been separated.
Abstract:
A communication system is provided that includes both an electromagnetic (“EM”) communication device and an optical communication device including at least a machine readable symbol where at least a portion of the EM communication device and at least a portion of the machine readable symbol are formed from the same material. This material may be, for example, a conductable ink or a conductable foil. If desired, the EM communication device may include an antenna where at least a portion of the antenna includes at least a portion of the machine readable symbol.
Abstract:
An electric-circuit fabricating system for fabricating an electric circuit, by performing a working operation on a circuit substrate, including a substrate holding device to hold the substrate, an imaging device to image a surface of the substrate on which the working operation is to be performed, an imaging control device to control the imaging device to take an image of a substrate-position fiducial mark provided on the substrate, and obtaining substrate-position information on the basis of the image, and a working device to perform the working operation on the substrate, on the basis of the substrate-position information, and wherein the imaging control device is operable to control the imaging device to take an image of a substrate ID mark provided on the substrate as held by the substrate holding device, for obtaining substrate identifying information identifying the substrate, on the basis of the image of the substrate ID mark. Also disclosed are a method and a control program for fabricating an electric circuit by performing the working operation on the substrate.