公开(公告)号：US20010040225A1

公开(公告)日：2001-11-15

申请号：US09838222

申请日：2001-04-20

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Seigo Kodama ,  Yasushi Okada

IPC: G01N021/86

CPC classification number: G01B11/028

Abstract: A method of detecting an edge of an object, including the steps of lighting, in each one of a plurality of different directions, at least a portion of the object, taking an image of the portion of the object and a vicinity of the portion which are lighted in the each one of the different directions, synthesizing the respective images of the portion of the object taken by lighting the portion in the different directions, and detecting, based on the synthesized images, an edge of the portion of the object.

Abstract translation: 一种检测物体的边缘的方法，包括以下步骤：在多个不同方向中的每个方向上照亮物体的至少一部分，拍摄物体的该部分的图像和该部分的附近 在不同方向中的每一个被点亮，通过点亮不同方向上的部分来合成所拍摄对象的部分的各个图像，并且基于合成图像检测对象的该部分的边缘。

公开(公告)号：US20030059964A1

公开(公告)日：2003-03-27

申请号：US10245371

申请日：2002-09-18

Applicant: Fuji Machine Mfg. Co., Ltd.

Inventor： Takayoshi Kawai ,  Kazuo Mitsui ,  Seigo Kodama

IPC: H01L021/66 ,  G01R031/26 ,  H01L021/76 ,  H01L021/00

CPC classification number: H01L22/20 ,  G05B19/4183 ,  G05B2219/32049 ,  G05B2219/45031 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/014 ,  H05K1/0269 ,  H05K3/00 ,  Y02P90/10 ,  Y10T29/41 ,  H01L2924/00

Abstract: A method of fabricating an electric circuit, including first and second working processes of performing respective first and second working operations on a circuit substrate, wherein the first working process includes a first substrate-identifying step of obtaining substrate identifying information identifying the substrate on which the first working operation is to be performed, a specific-information obtaining step of recognizing a specific-information providing portion of the substrate, to obtain specific information indicating at least one specific characteristic of the substrate, a first working step of performing the first working operation on the basis of the obtained specific information, and a specific-information storing step of storing the specific information in relation to the substrate identifying information, and the second working process includes a second substrate-identifying step of obtaining the substrate identifying information identifying the substrate on which the second working operation is to be performed, and a second working step of performing the second working operation on the basis of the specific information stored in relation to the substrate identifying information. Also disclosed are electric-circuit fabricating system and control program suitable to practice the method.

Abstract translation: 一种制造电路的方法，包括在电路基板上执行各自的第一和第二工作操作的第一和第二工作过程，其中所述第一工作过程包括第一衬底识别步骤，用于获得标识衬底的衬底识别信息， 要执行第一工作操作，特定信息获取步骤，识别衬底的特定信息提供部分，以获得指示衬底的至少一个特定特性的特定信息;执行第一工作操作的第一工作步骤 基于所获得的具体信息，以及特定信息存储步骤，用于存储关于衬底识别信息的特定信息，并且第二工作过程包括第二衬底识别步骤，获得识别衬底的衬底识别信息 在哪 将执行第二工作操作，以及第二工作步骤，其基于与衬底识别信息相关的存储的特定信息执行第二工作操作。 还公开了适用于实施该方法的电路制造系统和控制程序。

公开(公告)号：US20040188642A1

公开(公告)日：2004-09-30

申请号：US10705974

申请日：2003-11-13

Applicant: Fuji Machine Mfg. Co., Ltd.

Inventor： Seigo Kodama ,  Shinsuke Suhara ,  Mizuho Nozawa

IPC: G01V008/00 ,  G01N021/86

CPC classification number: H05K13/0452 ,  H05K13/0812 ,  H05K13/0815 ,  Y10T29/49131

Abstract: In an electronic component mounting apparatus capable of replacing a component placing device with any of plural other component placing devices different in performance, the distance between the center line of a component pick-up portion of a replaced component placing device and the optical axis of a board recognizing camera is calibrated easily and precisely. A movable table is positioned so that a reference mark provided on a base frame to reside in the visual field of a component recognizing camera comes in the visual field of a board recognizing camera and that at the same time, the end of the component pick-up portion of the replaced component placing device comes in the visual filed of the component recognizing camera. The board recognizing camera is used to detect the positional relation of the optical axis thereof relative to the reference mark, while the component recognizing camera is used to detect the positional relations of the optical axis thereof relative to the reference mark and relative to the center line of the component pick-up portion. These detected positional relations are used to calculate the positional relation between the optical axis of the board recognizing camera and the center line of the component pick-up portion.

Abstract translation: 在能够以不同性能的多个其他元件放置装置中的任何一个替代元件放置装置的电子元件安装装置中，替换元件放置装置的元件拾取部分的中心线与a的光轴之间的距离 电路板识别摄像头可以轻松精确校准。 可移动台被定位成使得设置在基架上的参考标记驻留在部件识别照相机的视野中，进入电路板识别照相机的视野，并且同时， 更换部件放置装置的上升部分进入部件识别照相机的视觉区域。 板识别摄像机用于检测其相对于参考标记的光轴的位置关系，而组件识别摄像机用于检测其相对于参考标记的光轴的位置关系并且相对于中心线 的部件拾取部分。 这些检测的位置关系用于计算板识别照相机的光轴与部件拾取部分的中心线之间的位置关系。

公开(公告)号：US20030059961A1

公开(公告)日：2003-03-27

申请号：US10245365

申请日：2002-09-18

Applicant: Fuji Machine Mfg. Co., Ltd.

Inventor： Seigo Kodama ,  Takayoshi Kawai ,  Kazuo Mitsui

IPC: H01L021/00

CPC classification number: H01L21/67294 ,  H01L21/67276 ,  H05K1/0266 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/09918 ,  H05K2201/09927

Abstract: An electric-circuit fabricating system for fabricating an electric circuit, by performing a working operation on a circuit substrate, including a substrate holding device to hold the substrate, an imaging device to image a surface of the substrate on which the working operation is to be performed, an imaging control device to control the imaging device to take an image of a substrate-position fiducial mark provided on the substrate, and obtaining substrate-position information on the basis of the image, and a working device to perform the working operation on the substrate, on the basis of the substrate-position information, and wherein the imaging control device is operable to control the imaging device to take an image of a substrate ID mark provided on the substrate as held by the substrate holding device, for obtaining substrate identifying information identifying the substrate, on the basis of the image of the substrate ID mark. Also disclosed are a method and a control program for fabricating an electric circuit by performing the working operation on the substrate.

Abstract translation: 一种用于制造电路的电路制造系统，通过对包括用于保持基板的基板保持装置的电路基板执行工作操作，成像装置对要进行工作操作的基板的表面进行成像 执行成像控制装置，用于控制成像装置拍摄设置在基板上的基板位置基准标记的图像，并且基于图像获得基板位置信息;以及工作装置，用于对 所述基板基于所述基板位置信息，并且其中所述成像控制装置可操作以控制所述成像装置拍摄由所述基板保持装置保持在所述基板上的基板ID标记的图像，以获得基板 基于基板ID标记的图像识别识别基板的信息。 还公开了一种通过在基板上进行加工操作来制造电路的方法和控制程序。

公开(公告)号：US20040080897A1

公开(公告)日：2004-04-29

申请号：US10388704

申请日：2003-03-17

Applicant: Fuji Machine Mfg. Co., Ltd.

Inventor： Seigo Kodama ,  Masayuki Tashiro

IPC: H02H001/00

CPC classification number: H05K13/08 ,  H05K13/0452

Abstract: Techniques for easy utilization of a plurality of mutually substitutable kinds of electronic circuit components. A mounting program preparing computer arranged to prepare mounting-program-related data, so as to correlate each component mounting position on a printed-circuit board with an electronic circuit component or a group of different electronic circuit components, on the basis of CAD data wherein the mounting position is correlated with part ID data, and group data indicative of the group of the different electronic circuit components. The computer is further arranged to prepare a mounting program indicative of an order of mounting of the components, and mounting data relating to positioning of the electronic circuit components on a table of a component supply table, and supply electronic circuit component mounting machines with the prepared mounting-program-related data, mounting program and mounting data. For each mounting position correlated to any group of different components, the operator loads the table with any desired one of the different components of the group, at the corresponding position on the table. The mounting program permits this loading of the table with the desired one of the components of the group, and mounting of that component on the printed-circuit board.

Abstract translation: 用于容易地利用多个可相互替代的电子电路部件的技术。 一种安装程序，准备计算机，其布置成准备安装程序相关数据，以便基于CAD数据将印刷电路板上的每个部件安装位置与电子电路部件或一组不同的电子电路部件相关联，其中 安装位置与部件ID数据和表示不同电子电路部件的组的组数据相关。 计算机还被布置成准备指示部件安装顺序的安装程序，以及将与电子电路部件的定位有关的数据安装在部件供应台的工作台上，并且向已经准备的电子电路部件安装机器 安装程序相关数据，安装程序和安装数据。 对于与任何一组不同组件相关的每个安装位置，操作员在表的相应位置上加载具有该组的不同组件中任何所需的一个的表。 安装程序允许使用组中所需的一个部件装载工作台，并将该部件安装在印刷电路板上。

公开(公告)号：US20010025413A1

公开(公告)日：2001-10-04

申请号：US09873392

申请日：2001-06-05

Applicant: Fuji Machine Mfg. Co. Ltd.

Inventor： Koichi Asai ,  Seigo Kodama ,  Shinsuke Suhara

IPC: H05K003/30 ,  G01R001/00

CPC classification number: H05K13/08 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53178 ,  Y10T29/53261

Abstract: A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.

Abstract translation: 一种用于将多个电路部件安装在电路基板上的系统，包括支撑电路基板的基板支撑装置，将由基板支撑装置支撑的电路基板上的每个电路部件安装的部件安装装置， 其通过部件安装装置测试每个电路部件安装在电路基板上的实际状态，以及控制装置，其控制部件安装装置将每个电路部件安装在电路基板上并控制测试装置 为了测试，每当通过部​​件安装装置将电路部件中的一个安装在电路基板上时，将一个电路部件安装在电路基板上的实际状态进行测试。

公开(公告)号：US20030209679A1

公开(公告)日：2003-11-13

申请号：US10421882

申请日：2003-04-24

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Seigo Kodama

IPC: G01V008/00

CPC classification number: H05K13/0069 ,  H05K3/0008 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53178

Abstract: An electronic-circuit-component mounting system including at least two component mounting units concurrently operated to mount electronic circuit components on a printed-wiring board, wherein a relative position of the two units is obtained from positions of a common calibration mark fixed provided on machine base commonly for the two units, which positions are detected by fiducial-mark cameras of the two units, or obtained from positions of fiducial marks provided on a fiducial board, which positions are detected by the cameras while the fiducial board is located in alignment with component mounting areas of the two units, and wherein positioning errors of the printed-wiring board relative to the two units are calculated on the basis of the obtained relative position of the two units, and positions of at least two fiducial marks provided on the printed-wiring board, which positions are detected by the cameras of the two units.

Abstract translation: 一种电子电路部件安装系统，包括同时操作以将电子电路部件安装在印刷电路板上的至少两个部件安装单元，其中从机器上固定的公共校准标记的位置获得两个单元的相对位置 这两个单元的基座通常是由两个单元的基准标记照相机检测到的，或者是从基准板上提供的基准标记的位置获得的，这些位置由照相机检测到，而基准板位于与基准位置对准的位置 基于所获得的两个单元的相对位置以及设置在印刷电路板上的至少两个基准标记的位置来计算印刷电路板相对于两个单元的定位误差， 接线板，两个单元的摄像机检测哪些位置。

公开(公告)号：US20030027363A1

公开(公告)日：2003-02-06

申请号：US10197458

申请日：2002-07-18

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Seigo Kodama

IPC: H01L021/66

CPC classification number: G05B19/4065 ,  G05B23/0289 ,  G05B2219/37254 ,  G05B2219/45031

Abstract: An electronic-circuit fabricating system wherein an inspecting machine is provided for each of working machines such as a mask printing machine and an electronic-component mounting machine, to inspect a result of an operation of each working machine, and a monitoring device is arranged to receive information on monitoring-object portions of the working machines and information on the inspected result of the operation, to estimate the present state of each monitoring-object portion on the basis of these kinds of information, to obtain a tendency of change of the present state on the basis of the present state and stored past data, and to monitor the working machines so that the present state does not exceed a predetermined threshold state. When the present state of the monitoring-object portion has exceeded the thresholds state, the monitoring device estimates a cause for an abnormality of the working machine on the basis of the information on the working machine and the inspected result, and automatically compensates control data or activates a monitor or indicator to prompt the operator to implement a suitable treatment.

Abstract translation: 一种电子电路制造系统，其中为每个工作机器（例如掩模印刷机和电子部件安装机）提供检查机，以检查每个工作机器的操作结果，并且监视装置被布置成 接收关于作业机的监视对象部分的信息和检查结果的信息，根据这些种类的信息来估计每个监视对象部分的当前状态，以获得当前的变化趋势 状态，并存储过去的数据，并且监视工作机器，使得当前状态不超过预定的阈值状态。 当监视对象部分的当前状态超过阈值状态时，监视装置根据关于作业机器的信息和被检查结果来估计作业机器异常的原因，并自动补偿控制数据或 激活监视器或指示器以提示操作者实施适当的处理。

公开(公告)号：US20020166225A1

公开(公告)日：2002-11-14

申请号：US10134604

申请日：2002-04-30

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Seigo Kodama

IPC: H01S004/00

CPC classification number: H05K13/08 ,  Y10T29/49002

Abstract: An electric-circuit board assembling line, including a plurality of electric-circuit-board-assembling-related apparatuses which include respective control devices independent of each other and which perform respective electric-circuit-board-assembling-related operations that are related to assembling of an electric-circuit board including a substrate board and at least one electric component mounted thereon, the respective control devices of the electric-circuit-board-assembling-related apparatuses including a master control device, and at least one slave control device subject to the master control device, at least one communication device which connects the master control device and the slave control device, to each other, and at least one of the master control device being operable to control the electric-circuit-board-assembling-related apparatus including the slave control device, the master control device supplying, to the slave control device, information about the electric-circuit board to be assembled, and the slave control device supplying, to the master control device, information about a state of the electric-circuit-board-assembling-related apparatus including the slave control device, so that the master control device recognizes the state.

Abstract translation: 一种电路板组装线，包括多个电路板组装相关装置，其包括彼此独立的各个控制装置，并且执行与组装相关的各个电路板组装相关操作 包括基板和安装在其上的至少一个电气部件的电路板的电路板组装相关设备的各个控制装置包括主控制装置，以及至少一个从属控制装置， 所述主控制装置，连接所述主控制装置和所述从属控制装置的至少一个通信装置相互连接，所述主控制装置中的至少一个可操作以控制所述电路板组装相关装置 包括从控制装置，主控装置向从控制装置提供关于电动循环的信息 以及从控制装置向主控装置提供关于包括从控制装置的电路板组装相关装置的状态的信息，使得主控装置识别状态 。