Invention Application
- Patent Title: Circuit-component mounting mehtod and circuit-component mounting system
- Patent Title (中): 电路元件安装和电路元件安装系统
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Application No.: US09873392Application Date: 2001-06-05
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Publication No.: US20010025413A1Publication Date: 2001-10-04
- Inventor: Koichi Asai , Seigo Kodama , Shinsuke Suhara
- Applicant: Fuji Machine Mfg. Co. Ltd.
- Applicant Address: null
- Assignee: Fuji Machine Mfg. Co. Ltd.
- Current Assignee: Fuji Machine Mfg. Co. Ltd.
- Current Assignee Address: null
- Priority: JP9-21674 19970204
- Main IPC: H05K003/30
- IPC: H05K003/30 ; G01R001/00

Abstract:
A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.
Public/Granted literature
- US06643921B2 Circuit-component mounting method and circuit-component mounting system Public/Granted day:2003-11-11
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