摘要:
A method of cleaning an evaporator that includes at least one heat transfer element for the evaporation of water, comprising forming a sacrificial layer of a first material on a surface of the heat transfer element (1); evaporating water that includes a second material to deposit the second material on top of the sacrificial layer (2, 3); and cleaning the evaporator by removing both the sacrificial layer formed on the heat transfer element and the second layer formed on top of the sacrificial layer; wherein the first material is more easily removed from the heat transfer element than the second material (4).
摘要:
A substrate cleaning method includes: steps (a) to (d). In step (a), a liquid is supplied onto a nanoimprint template substrate that has a patterned surface with foreign particles to form a liquid film on the patterned surface. In step (b), the liquid film is solidified to form a solidified film including the foreign particles. In step (c), the substrate is reversed. In step (d), the solidified film is melted to remove the foreign particles.
摘要:
A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.
摘要:
Processes and devices are disclosed for removing sand from a surface, such as skin, using a spray device containing a formula comprising moisture-absorbing powder, propellant, and solvent. The formula is sprayed on a sandy surface using the spray device, and the sandy surface is then wiped to remove sand therefrom.
摘要:
A solidified body forming step includes: a first step of landing a processing surface of a cooling member on a liquid film to solidify the liquid to be solidified located in an area sandwiched between an upper surface and the processing surface; and a second step of releasing the processing surface from the solidified area solidified in the first step. The processing surface has a lower temperature than a freezing point of the liquid to be solidified. Adhesion between the solidified area and the processing surface is smaller than that between the solidified area and the upper surface.
摘要:
Apparatus and methods for removing particle contaminants from a solid surface includes providing a layer of a viscoelastic material on the solid surface. The viscoelastic material is applied as a thin film and exhibits substantial liquid-like characteristics. The viscoelastic material at least partially binds with the particle contaminants. A high velocity liquid is applied to the viscoelastic material, such that the viscoelastic material exhibits solid-like behavior. The viscoelastic material is thus dislodged from the solid surface along with the particle contaminants, thereby cleaning the solid surface of the particle contaminants.
摘要:
A method for cleaning a substrate, includes supplying to a substrate having a hydrophilic surface a film-forming processing liquid which includes a volatile component and forms a film on the substrate, vaporizing the volatile component in the film-forming processing liquid such that the film-forming processing liquid solidifies or cures on the substrate and forms a processing film on the hydrophilic surface of the substrate, and supplying to the substrate having the processing film a strip-processing liquid for stripping the processing film from the substrate.
摘要:
A substrate processing apparatus comprises: an air flow generator which generates a down flow by gas flowing from top to bottom around a substrate W held horizontally; a liquid film former which forms a liquid film by supplying a liquid on an upper surface of the substrate; a cooling gas discharge nozzle which discharges cooling gas of a temperature lower than a freezing point of the liquid to the liquid film and thereby freezes the liquid film; and a remover which removes a frozen film formed by freezing the liquid film from the substrate. The air flow generator reduces a flow velocity of the down flow when the cooling gas is discharged to the liquid film from the cooling gas discharge nozzle than when the liquid is supplied to the substrate from the liquid film former.
摘要:
A means is suggested for cleaning domestic animal paws, by means of which solid particles can be removed from the domestic animal paws. This consists of a highly viscous modelling mass with a viscosity of 50 000-150 000 mPa·s, preferably of 80-120 mPa·s. This compound is formed from natural polygalactomannans and also 75-95% by weight of bound water and contains a disinfecting solution from the group of saturated monovalent alcohols. Preferably, the compound additionally contains lubricating, anti-inflammatory, disinfecting, antiseptic and regenerative agents. The compound is created such that contaminations can be kneaded into the compound by means of a few kneading movements. For use, the compound (3) is introduced into a container (1) which has a flat recess for accommodating the domestic animal paw cleaning means. The compound is protected from drying out by means of a lid (4), preferably made of a soft plastic, which covers the recess in a positive-fitting manner.
摘要:
A rinsing liquid supplier includes a temperature adjuster. The temperature adjuster cools DIW to a temperature lower than room temperature. This temperature adjuster cools down DIW to a temperature not more than 10 degrees centigrade for instance, and cooling down to an even lower temperature of 5 degrees centigrade or below is more preferable. Meanwhile, the temperature adjuster maintains DIW at not less than 0 degrees centigrade, which prevents freezing of the DIW. The cooled DIW supplied to a rinsing liquid pipe is discharged from the rinsing liquid discharge nozzle toward the top surface of the substrate, to thereby form a liquid film. Further, the cooled DIW is discharged toward the rear surface of the substrate from the liquid discharge nozzle via the liquid supply pipe, to thereby form the liquid film on the rear surface. Since the liquid films are already cooled, they are frozen in a short time when the cooling gas is discharged toward the top surface and the rear surface of the substrate.