公开(公告)号：US20240297122A1

公开(公告)日：2024-09-05

申请号：US18592829

申请日：2024-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyundong Lee ,  Youngmin Kim ,  Minji Kim ,  Joonseok Oh ,  Changbo Lee

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H10B80/00

CPC classification number: H01L23/5386 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/08 ,  H01L25/105 ,  H10B80/00 ,  H01L24/16 ,  H01L2224/08225 ,  H01L2224/16227

Abstract: Provided is a semiconductor package including a first chip, a first chip pad on an upper surface of the first chip, an upper redistribution structure above the first chip, a lowermost via pattern within the upper redistribution structure and non-overlapping with the first chip pad in a vertical direction, and a connection pattern electrically connecting the first chip pad to the lowermost via pattern, wherein the connection pattern overlaps each of the first chip pad and the lowermost via pattern in a vertical direction.

公开(公告)号：US11955997B2

公开(公告)日：2024-04-09

申请号：US17379461

申请日：2021-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Kim ,  Hongjong Park ,  Daeyoung Yoon ,  Sunwoo Lee ,  Youngki Lee ,  Dooseok Choi

IPC: H04B1/00 ,  H01L23/498 ,  H01Q21/00 ,  H05K1/02

CPC classification number: H04B1/005 ,  H01L23/49822 ,  H01Q21/0025 ,  H05K1/0243

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.

公开(公告)号：US11838835B2

公开(公告)日：2023-12-05

申请号：US16530549

申请日：2019-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jangsu Lee ,  Byungdeok Kim ,  Youngmin Kim ,  Woosuk Kim

IPC: G06N20/00 ,  H04W4/38 ,  G06N20/20 ,  H04L67/00 ,  G06N5/043 ,  G06F18/214 ,  G06V10/774 ,  G06V10/94

CPC classification number: H04W4/38 ,  G06F18/214 ,  G06N5/043 ,  G06N20/20 ,  G06V10/774 ,  G06V10/95 ,  H04L67/34

Abstract: A distributed inference system includes an end device and a server. The end device generates status information and generates an inference result corresponding to target data based on a first machine learning model. The server creates a second machine learning model based on the status information and a training dataset including the inference result, calculates an accuracy of the inference result, and provides the second machine learning model to the end device based on the accuracy.

公开(公告)号：US20230252608A1

公开(公告)日：2023-08-10

申请号：US17666166

申请日：2022-02-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yingmao Li ,  Hamid R. Sheikh ,  John Seokjun Lee ,  Youngmin Kim ,  Jun Ki Cho ,  Seung-Chul Jeon

IPC: G06T5/00

CPC classification number: G06T5/005 ,  G06T2207/20081 ,  G06T2207/10144 ,  G06T2207/20084

Abstract: A method includes obtaining, using a stationary sensor of an electronic device, multiple image frames including first and second image frames. The method also includes generating, using multiple previously generated motion vectors, a first motion-distorted image frame using the first image frame and a second motion-distorted image frame using the second image frame. The method further includes adding noise to the motion-distorted image frames to generate first and second noisy motion-distorted image frames. The method also includes performing (i) a first multi-frame processing (MFP) operation to generate a ground truth image using the motion-distorted image frames and (ii) a second MFP operation to generate an input image using the noisy motion-distorted image frames. In addition, the method includes storing the ground truth and input images as an image pair for training an artificial intelligence/machine learning (AI/ML)-based image processing operation for removing image distortions caused by handheld image capture.

公开(公告)号：US20210028797A1

公开(公告)日：2021-01-28

申请号：US16743478

申请日：2020-01-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Kim ,  Hongjong Park ,  Daeyoung Yoon ,  Sunwoo Lee ,  Youngki Lee ,  Dooseok Choi

IPC: H04B1/00 ,  H01Q21/00 ,  H01L23/498 ,  H05K1/02

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.

公开(公告)号：US10418259B2

公开(公告)日：2019-09-17

申请号：US15335988

申请日：2016-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngmin Kim ,  JaeYong Park ,  Kunho Song ,  Byung-Joo Jo

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  B28D5/02 ,  B28D5/00 ,  B32B37/10 ,  B32B38/00

Abstract: A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.

公开(公告)号：US12237252B2

公开(公告)日：2025-02-25

申请号：US17672092

申请日：2022-02-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonyoung Jeon ,  Joonseok Oh ,  Youngmin Kim ,  Dongheon Kang ,  Changbo Lee

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10

Abstract: A semiconductor package may include at least one first rewiring structure, the at least one first rewiring structure including a plurality of first insulating layers vertically stacked and a plurality of first rewiring patterns included in the plurality of first insulating layers, at least one semiconductor chip on the at least one first rewiring structure, and at least one molding layer covering the at least one semiconductor chip, wherein each of the plurality of first rewiring patterns includes, a first conductive pattern, the first conductive pattern including a curved upper surface, and a first seed pattern covering a side surface and a lower surface of the first conductive pattern, and each of the first seed patterns of the plurality of first rewiring patterns having a same shape.

公开(公告)号：US12188724B2

公开(公告)日：2025-01-07

申请号：US16686913

申请日：2019-11-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Donghyun Kim ,  Youngmin Kim ,  Yonghwa Choi ,  Jeungku Choi

IPC: F28D1/053 ,  F24F11/84 ,  F28F9/02

Abstract: A heat exchanger for an air conditioner includes a plurality of flat heat transfer tubes through which a refrigerant flows; first and second headers disposed on opposite ends of the plurality of flat heat transfer tubes; at least one baffle disposed in at least one of the first and second headers and to partition an inner space of the at least one header; and a refrigerant flow control device disposed on the at least one baffle, to allow the refrigerant to selectively pass through the at least one baffle. The refrigerant flow control device is configured to prevent refrigerant from passing through the refrigerant flow control device when the refrigerant flows in one direction in the header, and to allow the refrigerant to pass through the refrigerant flow control device when the refrigerant flows in a direction opposite to the one direction in the header.

公开(公告)号：US11955118B2

公开(公告)日：2024-04-09

申请号：US16851211

申请日：2020-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngmin Kim ,  Hwidong Na ,  Min-joong Lee ,  Hodong Lee

IPC: G10L15/183 ,  G10L15/00

CPC classification number: G10L15/183 ,  G10L15/005

Abstract: A real-time processor-implemented translation method and apparatus is provided. The real-time translation method includes receiving a content, determining a delay time for real-time translation based on a silence interval of the received content and an utterance interval of the received content, generating a translation result by translating a language used in the received content, and synthesizing the translation result and the received content.

公开(公告)号：US20240038740A1

公开(公告)日：2024-02-01

申请号：US18329530

申请日：2023-06-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyundong Lee ,  Youngmin Kim ,  Joonseok Oh ,  Sangyun Lee ,  Changbo Lee

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/105 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/3107 ,  H01L24/16 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15174

Abstract: A semiconductor package includes a first wiring structure including a plurality of first redistribution patterns having a plurality of first bottom connection pads and a plurality of first top connection pads and a plurality of first redistribution insulating layers surrounding the plurality of first redistribution patterns, a second wiring structure including a plurality of second redistribution patterns having a plurality of second bottom connection pads and a plurality of second top connection pads and a plurality of second redistribution insulating layers surrounding the plurality of second redistribution patterns, a semiconductor chip interposed between the first wiring structure and the second wiring structure, an encapsulant filling a space between the first wiring structure and the second wiring structure, and a plurality of connection structures passing through the encapsulant and connecting the plurality of first top connection pads to the plurality of second bottom connection pads and arranged around the semiconductor chip.