公开(公告)号：US10418259B2

公开(公告)日：2019-09-17

申请号：US15335988

申请日：2016-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngmin Kim ,  JaeYong Park ,  Kunho Song ,  Byung-Joo Jo

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  B28D5/02 ,  B28D5/00 ,  B32B37/10 ,  B32B38/00

Abstract: A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.