SEMICONDUCTOR MEMORY DEVICE
    12.
    发明申请

    公开(公告)号:US20250056789A1

    公开(公告)日:2025-02-13

    申请号:US18620333

    申请日:2024-03-28

    Abstract: The present disclosure relates to semiconductor memory devices. An example semiconductor memory device comprises a substrate, a structure including word lines and interlayer insulating films alternately stacked on the substrate, a channel region disposed between two adjacent word lines in a vertical direction, a first source/drain region disposed on a first side of the channel region, a second source/drain region disposed on a second side of the channel region, a bit line which extends in the vertical direction on the substrate and is connected to the first source/drain region, a capping insulating film disposed between the bit line and the word lines, and a data storage connected to the second source/drain region. At least a part of the first source/drain region protrudes from a sidewall of the capping insulating film toward the bit line.

    Semiconductor device
    13.
    发明授权

    公开(公告)号:US11916123B2

    公开(公告)日:2024-02-27

    申请号:US17383022

    申请日:2021-07-22

    CPC classification number: H01L29/42392 H01L29/0847 H01L29/78696

    Abstract: An integrated circuit device includes a substrate having source and drain recesses therein that are lined with respective silicon-germanium liners and filled with doped semiconductor source and drain regions. A stacked plurality of semiconductor channel layers are provided, which are separated vertically from each other within the substrate by corresponding buried insulated gate electrode regions that extend laterally between the silicon-germanium liners. An insulated gate electrode is provided on an uppermost one of the plurality of semiconductor channel layers. The silicon-germanium liners may be doped with carbon.

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