公开(公告)号：US20250140579A1

公开(公告)日：2025-05-01

申请号：US18737254

申请日：2024-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunghwan Kim ,  Kyungwon Kang ,  Dongwook Kim ,  Seok Heo

IPC: H01L21/67 ,  H01L21/683

Abstract: Provided are a wafer cleaning device and a method of optimizing the same. The wafer cleaning device includes an upper nozzle configured to spray a cleaning solution onto a front surface of a wafer, a spin chuck provided below the wafer to rotate the wafer and configured to heat a central region of the wafer, and a plurality of lower nozzles provided below the wafer to spray a temperature control liquid having a higher temperature than the cleaning solution onto a rear surface of the wafer, the plurality of lower nozzles configured to heat an outer region of the wafer that surrounds the central region of the wafer. A temperature gradient formed by the spin chuck and the plurality of lower nozzles causes a cleaning solution to flow in a cleaning solution layer on the front surface of the wafer.

公开(公告)号：US11927890B1

公开(公告)日：2024-03-12

申请号：US17892379

申请日：2022-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seok Heo ,  Cha Won Koh ,  Sang Joon Hong ,  Hyun Woo Kim ,  Kyung-Won Kang ,  Dong-Wook Kim ,  Kyung Won Seo ,  Young Il Jang ,  Yong Suk Choi

IPC: G03F7/00 ,  G03F7/16 ,  H01L21/677 ,  H01L21/687

CPC classification number: G03F7/70875 ,  G03F7/168 ,  G03F7/70033 ,  H01L21/67703 ,  H01L21/68707

Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.

公开(公告)号：US11923209B2

公开(公告)日：2024-03-05

申请号：US17678233

申请日：2022-02-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunwoong Hwang ,  Chawon Koh ,  Seok Heo ,  Hyunwoo Kim

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/6715 ,  H01L21/68764

Abstract: A substrate processing apparatus includes a substrate support configured to support and rotate a substrate, at least one first lower cleaning nozzle configured to spray a first cleaning liquid on a lower surface of the substrate, at least one second lower cleaning nozzle configured to spray a second cleaning liquid on the lower surface of the substrate, a bowl assembly disposed around the substrate support, the bowl assembly including a cup body providing an annular shaped accommodating space and inner and outer collection portions sequentially arranged in a radial direction in a lower portion of the cup body, an annular shaped discharge guide plate disposed in the receiving space of the bowl assembly under the substrate and extending outwardly from a circumference of the substrate, and a discharge separation plate provided within the receiving space of the bowl assembly to be movable upward and downward.

公开(公告)号：US20230411155A1

公开(公告)日：2023-12-21

申请号：US18210374

申请日：2023-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho HWANG ,  Sanghyun Lim ,  Jaehong Lim ,  Seok Heo

IPC: H01L21/027 ,  H01L21/324 ,  H01L21/67

CPC classification number: H01L21/0274 ,  H01L21/3245 ,  H01L21/67103 ,  H01L21/67248

Abstract: A manufacturing method of a semiconductor element includes: providing a photoresist on a wafer; supplying a first gas, containing oxygen, at a first flow rate to a bake chamber such that oxygen solubility of the photoresist becomes saturated, and supplying a second gas, which is oxygen-free, at a second flow rate to the bake chamber; and performing a bake process on the wafer in the bake chamber.

公开(公告)号：US20230187236A1

公开(公告)日：2023-06-15

申请号：US17889035

申请日：2022-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonguk Seo ,  Seok Heo ,  Sungwook Kang ,  Byeongsang Kim ,  Sungkun Hwang ,  Igor Ivanov

IPC: H01L21/67 ,  H01L21/687 ,  H05B3/26 ,  F27B17/00 ,  F27D5/00 ,  B32B9/00 ,  B32B9/04 ,  B32B18/00 ,  B32B7/12 ,  B32B3/30 ,  B32B3/14

CPC classification number: H01L21/67109 ,  B32B3/14 ,  B32B3/30 ,  B32B7/12 ,  B32B9/04 ,  B32B9/007 ,  B32B9/041 ,  B32B18/00 ,  F27B17/0025 ,  F27D5/0037 ,  H01L21/6875 ,  H05B3/265 ,  B32B2255/205 ,  B32B2307/302 ,  H05B2203/005 ,  H05B2214/04

Abstract: A wafer baking apparatus includes a chamber including a processing space, and a wafer heater disposed in the processing space and configured to support a wafer. The wafer heater includes a first heating plate, a heating resistance pattern disposed on a lower surface of the first heating plate, a second heating plate disposed on the first heating plate, and a heat dispersion layer interposed between the first and second heating plates and having thermal conductivity lower than a thermal conductivity of materials of the first and second heating plates.

公开(公告)号：US11590460B2

公开(公告)日：2023-02-28

申请号：US17239644

申请日：2021-04-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonguk Seo ,  Sungyong Park ,  Hongju Kim ,  Ansook Sul ,  Seok Heo ,  Yinghu Xu

IPC: B01F23/10 ,  B01F23/231 ,  B01F101/56

Abstract: A chemical solution vaporization device includes a chemical solution tank including chemical solution vaporization rooms, a chemical solution sensing room, and a chemical solution supply room. A first internal wall separating the plurality of chemical solution vaporization rooms from each other includes a first opening at a lower portion thereof. A second internal wall separating at least one of the plurality of chemical solution vaporization rooms from the chemical solution supply room includes a second opening at a lower portion thereof. A third internal wall separating at least one of the plurality of chemical solution vaporization rooms from the chemical solution sensing room includes a third opening at a lower portion thereof. And a lower portion of a fourth internal wall separating the chemical solution sensing room from the chemical solution supply room is combined with the lower wall.

公开(公告)号：US20200260534A1

公开(公告)日：2020-08-13

申请号：US16656054

申请日：2019-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNGHO HWANG ,  Chulmin Cho ,  Seok Heo

IPC: H05B6/06 ,  H01L21/67 ,  H05B1/02 ,  H05B6/44 ,  H05B6/04

Abstract: A heating module including: a plate including heating regions; heater coils disposed in the heating regions; a power source supplying an electric power to the heater coils; a switching circuit connected to the heater coils and the power source to control the electric power; temperature sensors disposed in the heating regions to sense temperatures of the heating regions; current sensors connected to the switching circuit and the heater coils to sense currents supplied to the heater coils; and a heating controller connected to the temperature sensors and the current sensors to measure temperatures of the heating regions. The heating controller is configured to detect the currents supplied to the heater coils and provides a maximum power to the heater coils regardless of a resistance difference of the heater coils, when a measured temperature is less than a predetermined temperature.