公开(公告)号：US11927890B1

公开(公告)日：2024-03-12

申请号：US17892379

申请日：2022-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seok Heo ,  Cha Won Koh ,  Sang Joon Hong ,  Hyun Woo Kim ,  Kyung-Won Kang ,  Dong-Wook Kim ,  Kyung Won Seo ,  Young Il Jang ,  Yong Suk Choi

IPC: G03F7/00 ,  G03F7/16 ,  H01L21/677 ,  H01L21/687

CPC classification number: G03F7/70875 ,  G03F7/168 ,  G03F7/70033 ,  H01L21/67703 ,  H01L21/68707

Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.

公开(公告)号：US09640417B2

公开(公告)日：2017-05-02

申请号：US14494669

申请日：2014-09-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam-Su Yuk ,  Kyung-Won Kang ,  Tae-Hun Kim ,  Se-Ho Park ,  Juno Park ,  Yong-Won Lee

IPC: H01L21/673 ,  H01L21/687 ,  H01L21/677

CPC classification number: H01L21/67379 ,  H01L21/6773 ,  H01L21/67775 ,  H01L21/67781 ,  H01L21/68707

Abstract: A cassette transfer apparatus includes a holding unit configured to hold a cassette having a wafer loaded therein, the cassette having at least one stepped part, and the holding unit including at least one holding part configured to have the at least one stepped part placed thereon. The at least one stepped part includes a pair of stepped parts provided at opposite surfaces of the cassette, and the at least one holding part includes a pair of holding parts that extends back and forth and is configured to have the pair of stepped parts placed thereon.

公开(公告)号：US20240379386A1

公开(公告)日：2024-11-14

申请号：US18402844

申请日：2024-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YONGSUK CHOI ,  Ilkyu Jeong ,  Hyunwoong Hwang ,  Kyung-Won Kang ,  Dong-Wook Kim ,  Seok Heo

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate processing system includes a cluster module having substrate processing devices, a load port through which a substrate is loaded, and a substrate cleaning device between the cluster module and the load port, the substrate cleaning device being configured to clean the substrate processed in the substrate processing devices, and the substrate cleaning device including a substrate cleaner having a cleaning chuck to support the substrate, and a cleaning nozzle configured to spray a fluid toward the cleaning chuck.