公开(公告)号：US11315817B2

公开(公告)日：2022-04-26

申请号：US16906820

申请日：2020-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Euijin Kim ,  Hyungjong Kim ,  Juno Park ,  Seok Heo

IPC: H01L21/67 ,  H01L21/677 ,  H01L23/544 ,  G01B11/14

Abstract: An apparatus for transferring a wafer includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.

公开(公告)号：US09640417B2

公开(公告)日：2017-05-02

申请号：US14494669

申请日：2014-09-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam-Su Yuk ,  Kyung-Won Kang ,  Tae-Hun Kim ,  Se-Ho Park ,  Juno Park ,  Yong-Won Lee

IPC: H01L21/673 ,  H01L21/687 ,  H01L21/677

CPC classification number: H01L21/67379 ,  H01L21/6773 ,  H01L21/67775 ,  H01L21/67781 ,  H01L21/68707

Abstract: A cassette transfer apparatus includes a holding unit configured to hold a cassette having a wafer loaded therein, the cassette having at least one stepped part, and the holding unit including at least one holding part configured to have the at least one stepped part placed thereon. The at least one stepped part includes a pair of stepped parts provided at opposite surfaces of the cassette, and the at least one holding part includes a pair of holding parts that extends back and forth and is configured to have the pair of stepped parts placed thereon.

公开(公告)号：US20250155814A1

公开(公告)日：2025-05-15

申请号：US18751464

申请日：2024-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chulmin Cho ,  Youngho Hwang ,  Juno Park ,  Kyoungwhan Oh ,  Sunyoung Yun ,  Youngkyun Im ,  Jaehong Lim ,  Seok Heo

IPC: G03F7/16 ,  B05C11/08

Abstract: A spin coating apparatus according to an embodiment includes a substrate supporter supporting a substrate, a substrate supporter driver rotating the substrate supporter, a laser supply unit disposed on the substrate supporter and providing a laser, and a laser driver of driving the laser supply unit, wherein the laser supply unit may move along a first direction, which is horizontal to the substrate surface on the substrate supporter.

公开(公告)号：US20210098274A1

公开(公告)日：2021-04-01

申请号：US16906820

申请日：2020-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Euijin Kim ,  Hyungjong Kim ,  Juno Park ,  Seok Heo

IPC: H01L21/677 ,  H01L21/67 ,  H01L23/544

Abstract: An apparatus for transferring a wafer according to the present disclosure includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.