公开(公告)号：US20240234193A9

公开(公告)日：2024-07-11

申请号：US18242388

申请日：2023-09-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngho Hwang ,  Sanghyun Lim ,  Jaehong Lim

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6875

Abstract: Provided is a wafer processing apparatus including a plate having a plurality of support pins configured such that a wafer is mounted on the plurality of support pins and a plurality of vacuum ports positioned between the plurality of support pins, a heater configured to heat the plate, a flow regulator configured to provide a vacuum pressure for fixing the wafer to the plurality of vacuum ports, and configured to adjust a flow rate of a fluid flowing into the plurality of vacuum ports to be a target flow rate, and a chuck controller configured to control the target flow of the fluid set in the flow regulator, wherein the chuck controller is configured to generate a flow control signal for reducing the target flow rate of the fluid and send the flow control signal to the flow regulator during a heating process of the wafer.

公开(公告)号：US20230411155A1

公开(公告)日：2023-12-21

申请号：US18210374

申请日：2023-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho HWANG ,  Sanghyun Lim ,  Jaehong Lim ,  Seok Heo

IPC: H01L21/027 ,  H01L21/324 ,  H01L21/67

CPC classification number: H01L21/0274 ,  H01L21/3245 ,  H01L21/67103 ,  H01L21/67248

Abstract: A manufacturing method of a semiconductor element includes: providing a photoresist on a wafer; supplying a first gas, containing oxygen, at a first flow rate to a bake chamber such that oxygen solubility of the photoresist becomes saturated, and supplying a second gas, which is oxygen-free, at a second flow rate to the bake chamber; and performing a bake process on the wafer in the bake chamber.

公开(公告)号：US20250155814A1

公开(公告)日：2025-05-15

申请号：US18751464

申请日：2024-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chulmin Cho ,  Youngho Hwang ,  Juno Park ,  Kyoungwhan Oh ,  Sunyoung Yun ,  Youngkyun Im ,  Jaehong Lim ,  Seok Heo

IPC: G03F7/16 ,  B05C11/08

Abstract: A spin coating apparatus according to an embodiment includes a substrate supporter supporting a substrate, a substrate supporter driver rotating the substrate supporter, a laser supply unit disposed on the substrate supporter and providing a laser, and a laser driver of driving the laser supply unit, wherein the laser supply unit may move along a first direction, which is horizontal to the substrate surface on the substrate supporter.

公开(公告)号：US20240136216A1

公开(公告)日：2024-04-25

申请号：US18242388

申请日：2023-09-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngho Hwang ,  Sanghyun Lim ,  Jaehong Lim

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6875

Abstract: Provided is a wafer processing apparatus including a plate having a plurality of support pins configured such that a wafer is mounted on the plurality of support pins and a plurality of vacuum ports positioned between the plurality of support pins, a heater configured to heat the plate, a flow regulator configured to provide a vacuum pressure for fixing the wafer to the plurality of vacuum ports, and configured to adjust a flow rate of a fluid flowing into the plurality of vacuum ports to be a target flow rate, and a chuck controller configured to control the target flow of the fluid set in the flow regulator, wherein the chuck controller is configured to generate a flow control signal for reducing the target flow rate of the fluid and send the flow control signal to the flow regulator during a heating process of the wafer.