公开(公告)号：US11315817B2

公开(公告)日：2022-04-26

申请号：US16906820

申请日：2020-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Euijin Kim ,  Hyungjong Kim ,  Juno Park ,  Seok Heo

IPC: H01L21/67 ,  H01L21/677 ,  H01L23/544 ,  G01B11/14

Abstract: An apparatus for transferring a wafer includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.

公开(公告)号：US20210098274A1

公开(公告)日：2021-04-01

申请号：US16906820

申请日：2020-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Euijin Kim ,  Hyungjong Kim ,  Juno Park ,  Seok Heo

IPC: H01L21/677 ,  H01L21/67 ,  H01L23/544

Abstract: An apparatus for transferring a wafer according to the present disclosure includes a main body, a first support installed in the main body, a sensor support fixed to the first support, a finger member slidably installed along the first support to transfer the wafer and positioned at a lower level than the sensor support, three sensors each including a light emitter installed on the first support and a light receiver installed on the sensor support, the three sensors respectively configured to detect three points of an edge of the wafer seated on the finger member, and a controller connected to the three sensors, wherein the controller is configured to determine whether any of the three points of the edge of the wafer is detected from a notch of the wafer based on signals received from the sensors.