SEMICONDUCTOR APPARATUS
    11.
    发明申请

    公开(公告)号:US20220173316A1

    公开(公告)日:2022-06-02

    申请号:US17330950

    申请日:2021-05-26

    Abstract: Provided is a semiconductor apparatus including a plurality of semiconductor unit devices. Each of the semiconductor unit devices may be arranged between a first insulating layer and a second insulating layer that are apart from each other in a direction normal to a substrate. Each of the semiconductor unit devices may include a selection device layer and a phase change material layer that extend side by side in a direction parallel to the substrate. The phase change material layer may have a superlattice-like structure. The phase change material layer may be arranged along a recess portion that is formed by the first insulating layer, the second insulating layer, and the selection device layer.

    SEMICONDUCTOR APPARATUS
    12.
    发明申请

    公开(公告)号:US20250113746A1

    公开(公告)日:2025-04-03

    申请号:US18980759

    申请日:2024-12-13

    Abstract: A semiconductor apparatus may include a plurality of semiconductor unit devices. Each of the semiconductor unit devices may be arranged between a first insulating layer and a second insulating layer that are apart from each other in a direction normal to a substrate. Each of the semiconductor unit devices may include a selection device layer and a phase change material layer that extend side by side in a direction parallel to the substrate. The phase change material layer may have a superlattice-like structure. The phase change material layer may be arranged along a recess portion that is formed by the first insulating layer, the second insulating layer, and the selection device layer.

    MEMORY DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS INCLUDING MEMORY DEVICE

    公开(公告)号:US20250089270A1

    公开(公告)日:2025-03-13

    申请号:US18540222

    申请日:2023-12-14

    Abstract: Provided are a memory device, a manufacturing method thereof, and an electronic apparatus including the memory device. The memory device may include a plurality of first conductors arranged apart from each other and perpendicular to a substrate, a second conductor extending perpendicular to the substrate, a chalcogenide layer extending perpendicular to the substrate between the plurality of first conductors and the second conductor, and a plurality of first diffusion barrier layers selectively arranged only on the plurality of first conductors between the plurality of first conductors and the chalcogenide layer. The plurality of first diffusion barrier layers each may include a carbon-based material.

    MEMORY DEVICE INCLUDING PHASE-CHANGE MATERIAL

    公开(公告)号:US20230380195A1

    公开(公告)日:2023-11-23

    申请号:US18150123

    申请日:2023-01-04

    CPC classification number: H10B63/845 H10B63/10 H10B63/24

    Abstract: A memory device including a phase-change material includes: a substrate; a first memory cell including a first selection layer and a first phase-change material layer, and a second memory cell including a second selection layer and a second phase-change material layer, wherein the first memory cell and the second memory cell are arranged apart from each other with an insulating layer therebetween in a normal direction of the substrate, wherein the first phase-change material layer and the second phase-change material layer include: a first layer including a thermal confinement material; and a second layer including a phase-change material, respectively, wherein the first layer and the second layer extend in a direction vertical to the substrate, and wherein the first phase-change material layer is physically isolated from the second phase-change material layer by the insulating layer.

    RESISTIVE MEMORY DEVICE
    20.
    发明申请

    公开(公告)号:US20220406844A1

    公开(公告)日:2022-12-22

    申请号:US17568866

    申请日:2022-01-05

    Abstract: A resistive memory device including a resistive memory pattern; and a selection element pattern electrically connected to the resistive memory pattern, the selection element pattern including a chalcogenide switching material and at least one metallic material, the chalcogenide switching material including germanium, arsenic, and selenium, and the at least one metallic material including aluminum, strontium, or indium, wherein the selection element pattern includes an inhomogeneous material layer in which content of the at least one metallic material in the selection element pattern is variable according to a position within the selection element pattern.

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