Display device and method of manufacturing the same

    公开(公告)号:US09671633B2

    公开(公告)日:2017-06-06

    申请号:US14848144

    申请日:2015-09-08

    CPC classification number: G02F1/133345 G02F1/133377 G02F1/133512 G02F1/1341

    Abstract: There is provided a display device including a substrate, a black matrix disposed on one side of the substrate, a thin film transistor disposed on the other side of the substrate, a common electrode and a pixel electrode disposed on the thin film transistor and overlapping with each other with an insulating layer disposed therebetween, a roof layer formed to be spaced apart from the pixel electrode and the common electrode with a microcavity disposed therebetween, including a supporting member, and having an injection hole through which a portion of the microcavity is exposed, a liquid crystal layer filling the microcavity, and an overcoat formed on the roof layer so as to cover the injection hole and sealing the microcavity.

    Liquid crystal display and method for manufacturing the same

    公开(公告)号:US10095069B2

    公开(公告)日:2018-10-09

    申请号:US14792241

    申请日:2015-07-06

    Abstract: An exemplary embodiment provides a liquid crystal display including: a substrate; a thin film transistor disposed on the substrate; a pixel electrode connected to the thin film transistor; a roof layer disposed to face the pixel electrode; and a capping layer disposed on the roof layer, wherein a plurality of microcavities are disposed between the pixel electrode and the roof layer, the microcavities form a liquid crystal layer including a liquid crystal material, a liquid crystal injection portion is formed between the microcavities, the capping layer is disposed to cover the liquid crystal injection portion, and the capping layer includes a light-blocking material and a water-soluble polymer material.

    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    14.
    发明申请
    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    显示装置及其制造方法

    公开(公告)号:US20140176893A1

    公开(公告)日:2014-06-26

    申请号:US13870503

    申请日:2013-04-25

    CPC classification number: G02F1/133377 G02F1/133305 G02F2001/133368

    Abstract: A display device according to an exemplary embodiment of the present invention includes a substrate including a plurality of pixel regions, a thin film transistor disposed on the substrate, and a pixel electrode connected to the thin film transistor and disposed in a first pixel region. A roof layer is disposed on the pixel electrode and spaced apart from the pixel electrode with a microcavity interposed therebetween. The plurality of pixel regions is disposed in a matrix form including a plurality of pixel rows and a plurality of pixel columns, the roof layer is disposed along the plurality of pixel rows, and the roof layer includes a bridge portion connecting the roof layers disposed in different pixel rows.

    Abstract translation: 根据本发明的示例性实施例的显示装置包括:包括多个像素区域的衬底;设置在衬底上的薄膜晶体管;以及连接到薄膜晶体管并设置在第一像素区域中的像素电极。 屋顶层设置在像素电极上并与像素电极间隔开,其间插入有微腔。 所述多个像素区域以包括多个像素行和多个像素列的矩阵形式设置,所述屋顶层沿着所述多个像素列布置,所述屋顶层包括桥接部分,所述桥接部分将设置在 不同的像素行。

    Display device
    17.
    发明授权
    Display device 有权
    显示设备

    公开(公告)号:US09459479B2

    公开(公告)日:2016-10-04

    申请号:US14271047

    申请日:2014-05-06

    CPC classification number: G02F1/133377 G02F1/1341

    Abstract: A display device includes: a substrate; a thin film transistor; a pixel electrode; a common electrode; a liquid crystal layer; and an encapsulation layer. The thin film transistor is disposed on the substrate. The pixel electrode is disposed on the thin film transistor. The common electrode is disposed on the pixel electrode and is separated from the pixel electrode via a microcavity therebetween. The liquid crystal layer fills the microcavity. The encapsulation layer is configured to seal the microcavity, wherein the encapsulation layer has an opening positioned at a portion overlapping the microcavity.

    Abstract translation: 显示装置包括:基板; 薄膜晶体管; 像素电极; 公共电极; 液晶层; 和封装层。 薄膜晶体管设置在基板上。 像素电极设置在薄膜晶体管上。 公共电极设置在像素电极上,并通过其间的微腔与像素电极分离。 液晶层填充微腔。 封装层被配置为密封微腔,其中封装层具有位于与微腔重叠的部分处的开口。

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