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    Electronic device having heat-radiating structure
    11.
    发明授权
    Electronic device having heat-radiating structure 有权

    公开(公告)号：US11800632B2

    公开(公告)日：2023-10-24

    申请号：US17262973

    申请日：2019-07-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yonghwa Kim ,  Min Park ,  Dongil Son ,  Hyunwoo Sim ,  Jaedeok Lim ,  Chunghyo Jung ,  Seungbum Choi

    IPC: H05K1/02

    CPC classification number: H05K1/0207 ,  H05K1/0209 ,  H05K1/0219

    Abstract: According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.

    Transfer apparatus of an electronic component
    13.
    发明授权
    Transfer apparatus of an electronic component 有权

    公开(公告)号：US11355365B2

    公开(公告)日：2022-06-07

    申请号：US16761905

    申请日：2018-12-03

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Changjoon Lee ,  Byunghoon Lee ,  Min Park ,  Kyungwoon Jang ,  Jeonggen Yoon ,  Hyuntae Jang

    IPC: H01L21/67 ,  B65G47/90 ,  H01L25/075

    Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.

    ELECTRONIC DEVICE
    14.
    发明申请
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20180288908A1

    公开(公告)日：2018-10-04

    申请号：US15938689

    申请日：2018-03-28

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hae-Jin LEE ,  Oh-Hyuck Kwon ,  Min Park ,  Jung-Je Bang ,  Jae-Deok Lim ,  Kyung-Ha Koo ,  Jae-Heung Ye ,  Chang-Tae Kim ,  Chi-Hyun Cho

    IPC: H05K9/00 ,  H05K7/20 ,  H05K1/02 ,  H05K1/18

    Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

    Electronic device including flexible printed circuit board
    17.
    发明授权
    Electronic device including flexible printed circuit board 有权

    公开(公告)号：US11309645B2

    公开(公告)日：2022-04-19

    申请号：US17061461

    申请日：2020-10-01

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Minki Kim ,  Byunghoon Lee ,  Min Park ,  Sungtae Park ,  Jungmin Park ,  Yongjae Song ,  Hongshin Shin ,  Woosung Jang ,  Chulwoo Park ,  Chihyun Cho

    IPC: H05K5/00 ,  H01R12/62 ,  H05K1/14

    Abstract: An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.

    ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER CONNECTED TO CONDUCTIVE PLATE COVERING OPENING OF SHIELD CAN
    18.
    发明申请
    ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER CONNECTED TO CONDUCTIVE PLATE COVERING OPENING OF SHIELD CAN 审中-公开

    公开(公告)号：US20200053919A1

    公开(公告)日：2020-02-13

    申请号：US16535528

    申请日：2019-08-08

    Applicant: Samsung Electronics Co., Ltd

    Inventor： Haejin LEE ,  Min Park ,  Jungje Bang ,  Kyungha Koo ,  Yunjeong Park

    IPC: H05K9/00 ,  H05K1/02

    Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.

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