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公开(公告)号:US11940160B2
公开(公告)日:2024-03-26
申请号:US17007627
申请日:2020-08-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyunho Kim , Jihong Kim , Hongyeol Moon , Wooyoung Park , Byungyul So , Mingu Jeon , Changwoo Jung
IPC: F24F1/0076 , F24F1/0047 , F24F1/0073 , F24F11/88 , F24F13/20 , F24F13/28
CPC classification number: F24F1/0076 , F24F1/0073 , F24F11/88 , F24F13/20 , F24F13/28 , F24F1/0047 , F24F2221/14
Abstract: An air conditioner includes a housing including an outlet, a panel attachable to or detachable from a lower side of the housing and including an inlet to introduce air therethrough, a first filter installable to the panel to filter the introduced air, a second filter installable to the panel and configured to further filter the introduced air using an electrostatic force, and a lifter configured to detach the panel from the lower side of the housing by lowering the panel from an initial position, and to attach the panel to the lower side of the housing by lifting the panel from a maintenance position. When the panel is lowered to the maintenance position, one or more of the first filter and the second filter are accessible for maintenance thereon.
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公开(公告)号:US11792921B2
公开(公告)日:2023-10-17
申请号:US17898907
申请日:2022-08-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sunki Yun , Kwangkyu Bang , Jihong Kim , Eunji Yu , Kyungjae Kim , Yusuf Cinar
CPC classification number: H05K1/0268 , H05K1/112 , H05K1/141 , H05K1/184 , H05K2201/10159
Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.
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公开(公告)号:US20230197116A1
公开(公告)日:2023-06-22
申请号:US17958940
申请日:2022-10-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byungwoo Nam , Jooyoung Kim , Jihong Kim
CPC classification number: G11C5/04 , G11C14/0018
Abstract: A storage device includes a module substrate extending in one direction, a non-volatile memory device mounted on the module substrate, a controller mounted on the module substrate, a first connector disposed at a first end of the module substrate and through which data stored in the non-volatile memory device is input/output, and a power management integrated circuit configured to control supplying of power to the controller and the non-volatile memory device. The controller is configured such that in response to a first level signal received from the first connector, the controller connects the non-volatile memory device to the first connector, and then control, after connecting the non-volatile memory device to the first connector, the power management integrated circuit to cut off supplying of the power to the controller.
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公开(公告)号:US11503748B2
公开(公告)日:2022-11-15
申请号:US17166248
申请日:2021-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Haejin Lee , Dongku Kang , Jihong Kim , Min Park , Yunjeong Park , Kyuhwan Lee , Jinhwan Jung , Ahreum Hwang , Kyungha Koo
Abstract: A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.
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公开(公告)号:US10938239B2
公开(公告)日:2021-03-02
申请号:US16371690
申请日:2019-04-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kihyun Kim , Kyungha Koo , Wooram Lee , Changhyung Lee , Jihye Kim , Jihong Kim , Yunjeong Noh , Seho Park , Kumjong Sun , Ju-Hyang Lee , Mincheol Ha , Sangmoo Hwangbo
Abstract: An electronic device is provided. The electronic device includes a housing, a wireless charging coil disposed inside the housing, a fan disposed inside the housing and in proximity to the coil, a temperature sensor disposed inside the housing and in proximity to the coil, a wireless charging circuit having the coil and configured to transmit power wirelessly to an external device via the coil, and a control circuit electrically connected to the fan, the temperature sensor, and the wireless charging circuit. The control circuit may be configured to receive a signal from the external device, receive data related to a temperature of the coil from the temperature sensor, and control the fan at least partially on the basis of at least one of the signal and the data.
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公开(公告)号:USD761824S1
公开(公告)日:2016-07-19
申请号:US29475384
申请日:2013-12-03
Applicant: Samsung Electronics Co., Ltd.
Designer: Hyeryung Kim , Yong Hwan Kwon , Jieun Kim , Jihong Kim , Jangwon Seo , Seran Jeon , Woo-Seok Hwang
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公开(公告)号:USD760269S1
公开(公告)日:2016-06-28
申请号:US29475551
申请日:2013-12-04
Applicant: Samsung Electronics Co., Ltd.
Designer: Jieun Kim , Yong Hwan Kwon , Jihong Kim , Hyeryung Kim , Jangwon Seo , Seran Jeon , Woo-Seok Hwang
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公开(公告)号:USD755818S1
公开(公告)日:2016-05-10
申请号:US29475556
申请日:2013-12-04
Applicant: Samsung Electronics Co., Ltd.
Designer: Jangwon Seo , Yong Hwan Kwon , Jieun Kim , Jihong Kim , Hyeryung Kim , Seran Jeon , Woo-Seok Hwang
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公开(公告)号:USD742399S1
公开(公告)日:2015-11-03
申请号:US29459401
申请日:2013-06-28
Applicant: Samsung Electronics Co., Ltd.
Designer: Danny Hwang , Yong-Hwan Kwon , Jieun Kim , Jihong Kim , Hyeryung Kim , Jangwon Seo , Seran Jeon
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公开(公告)号:USD735753S1
公开(公告)日:2015-08-04
申请号:US29459603
申请日:2013-07-02
Applicant: Samsung Electronics Co., Ltd.
Designer: Danny Hwang , Yong-Hwan Kwon , Jieun Kim , Jihong Kim , Hyeryung Kim , Jangwon Seo , Seran Jeon
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