公开(公告)号：US11832389B2

公开(公告)日：2023-11-28

申请号：US17431900

申请日：2021-08-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taewon Sun ,  Jichul Kim ,  Kicheol Bae ,  Jinyong Park ,  Jungje Bang ,  Yongjae Song

IPC: H05K1/18 ,  H05K1/14 ,  H04M1/02 ,  H05K1/02 ,  H05K7/14

CPC classification number: H05K1/14 ,  H04M1/0249 ,  H05K1/0216 ,  H05K1/181 ,  H05K7/1427 ,  H05K2201/10378

Abstract: An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second region of the first circuit board, the second second circuit board including a first second portion bonded to the second interposer and spaced apart from the first second circuit board by a specified gap.

公开(公告)号：US20240321774A1

公开(公告)日：2024-09-26

申请号：US18399519

申请日：2023-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kitae Park ,  Chiwan Song ,  Seonkyu Kim ,  Hyunna Bae ,  Seungmin Baek ,  Yongjae Song ,  Joonseok Oh ,  Jaewook Jung ,  Seokil Hong

IPC: H01L23/00 ,  H01L21/02 ,  H01L21/3205 ,  H01L23/31 ,  H01L23/492 ,  H01L25/065 ,  H10B80/00

CPC classification number: H01L23/562 ,  H01L21/0214 ,  H01L21/02249 ,  H01L21/02252 ,  H01L21/32055 ,  H01L23/3135 ,  H01L23/4926 ,  H01L24/48 ,  H01L25/0657 ,  H10B80/00 ,  H01L2224/48149 ,  H01L2224/48227 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/3511 ,  H01L2924/3512

Abstract: The present disclosure relates to semiconductor devices and semiconductor packages. One example semiconductor device includes a crystalline silicon layer, an amorphous silicon layer on the crystalline silicon layer and extending along a first surface of the crystalline silicon layer, and a dielectric layer on the amorphous silicon layer and extending along a surface of the amorphous silicon layer. The dielectric layer includes silicon oxynitride and has compressive stress.

公开(公告)号：US11923709B2

公开(公告)日：2024-03-05

申请号：US17551793

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungtae Park ,  Minki Kim ,  Kicheol Bae ,  Yongjae Song ,  Hyelim Yun ,  Woosung Jang

IPC: H05K1/11 ,  H01Q7/00 ,  H02J7/00 ,  H02J50/10 ,  H05K1/14 ,  H05K1/18 ,  H05K5/00

CPC classification number: H02J7/0042 ,  H01Q7/00 ,  H02J50/10 ,  H05K1/11 ,  H05K1/144 ,  H05K1/181 ,  H05K5/0086 ,  H05K2201/10734

Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.

公开(公告)号：US11309645B2

公开(公告)日：2022-04-19

申请号：US17061461

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki Kim ,  Byunghoon Lee ,  Min Park ,  Sungtae Park ,  Jungmin Park ,  Yongjae Song ,  Hongshin Shin ,  Woosung Jang ,  Chulwoo Park ,  Chihyun Cho

IPC: H05K5/00 ,  H01R12/62 ,  H05K1/14

Abstract: An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.

公开(公告)号：US12279371B2

公开(公告)日：2025-04-15

申请号：US17886327

申请日：2022-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyeongmin Jin ,  Jichul Kim ,  Yongjae Song ,  Jaeyeon Ra ,  Chagyu Song

IPC: H05K1/14 ,  H05K1/02

Abstract: Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part extending in a first direction from a part of the first part and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length in the second direction of the first part, and wherein the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other.

公开(公告)号：US20240008232A1

公开(公告)日：2024-01-04

申请号：US18370143

申请日：2023-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hajoong YUN ,  Yoonsun Park ,  Seunghoon Kang ,  Kyungha Koo ,  Hongki Moon ,  Jongkil Park ,  Yongjae Song

IPC: H05K7/20 ,  H05K5/02 ,  H04M1/02

CPC classification number: H05K7/20972 ,  H05K5/0217 ,  H04M1/0268

Abstract: An electronic device includes a first housing; a second housing slidable into and out of the first housing; a sliding plate configured to be at least partially slid within the second housing; a flexible display including a display area that is variable as the second housing slides into and out of the first housing; a printed circuit board in an inner space of the first housing; a first shaft; and a thermal diffusion member including a first end, disposed on the at least one electronic component and partially wound, and a second end coupled to the first shaft, and the thermal diffusion member is configured such that at least a portion of the thermal diffusion member spreads out in an inner space of the second housing as a sliding-out operation is performed by the second housing with respect to the first housing.