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    Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurement
    11.
    发明授权
    Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurement 有权

    公开(公告)号：US10188015B2

    公开(公告)日：2019-01-22

    申请号：US15270305

    申请日：2016-09-20

    Applicant: QUALCOMM Incorporated

    Inventor： Mehdi Saeidi ,  Rajat Mittal ,  Ryan Coutts

    IPC: H05K7/20 ,  G01K7/18 ,  G06F1/20

    Abstract: The disclosure generally relates to a hybrid design whereby a heat spreader arranged to reduce an external skin temperature on a handheld device may further enable the external skin temperature to be directly measured. For example, the heat spreader may be thermally coupled to at least one external surface and include at least one region in which a plurality of recesses are formed such that an electrical resistance is produced in the at least one region when a current is applied thereto. The heat spreader may be formed from a material having a substantially linear resistance-to-temperature correlation, whereby the electrical resistance produced in the at least one region may be measured and correlated to a temperature on the at least one external surface.

    Evaporative cooling solution for handheld electronic devices
    12.
    发明授权
    Evaporative cooling solution for handheld electronic devices 有权

    公开(公告)号：US10159165B2

    公开(公告)日：2018-12-18

    申请号：US15423474

    申请日：2017-02-02

    Applicant: QUALCOMM Incorporated

    Inventor： Mehdi Saeidi ,  Ali Akbar Merrikh ,  Melika Roshandell

    IPC: H05K7/20 ,  H01L23/427 ,  G06F1/20 ,  H01L23/473 ,  H05K1/02

    Abstract: An apparatus and method of the disclosure provides a cooling mechanism for a handheld electronic device. The cooling mechanism includes a heat sink and an evaporative cooling mechanism. The evaporative cooling mechanism includes liquid retaining structures. The liquid retaining structures are located in proximity to the at least one IC of the handheld electronic device. Each liquid retaining structure is coated with a temperature sensitive polymer that act as hydrophilic when the temperature of the surface of the handheld electronic device is below a threshold temperature. To maintain the temperature of the surface of the handheld electronic device below the threshold temperature, the temperature sensitive polymer act as hydrophobic and evaporates the liquid stored in the liquid retaining structures to the atmosphere surrounding the handheld electronic device when the temperature of the surface of the electronic device is above the threshold temperature.

    CIRCUITS AND METHODS PROVIDING TEMPERATURE MITIGATION FOR COMPUTING DEVICES
    14.
    发明申请
    CIRCUITS AND METHODS PROVIDING TEMPERATURE MITIGATION FOR COMPUTING DEVICES 审中-公开
    为计算设备提供温度降低的电路和方法

    公开(公告)号：US20170075397A1

    公开(公告)日：2017-03-16

    申请号：US14852941

    申请日：2015-09-14

    Applicant: QUALCOMM Incorporated

    Inventor： Mehdi Saeidi ,  Arpit Mittal ,  Farsheed Mahmoudi ,  Rajat Mittal

    IPC: G06F1/20 ,  G06F1/32

    CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/3234 ,  G06F1/3237 ,  G06F1/324 ,  Y02D10/126 ,  Y02D10/128 ,  Y02D10/16

    Abstract: A method includes: generating a power consumption reading indicative of power consumption of a device, comparing the power consumption reading to a power threshold, wherein the power threshold represents a level of power consumption corresponding to a rise in temperature of an exterior surface of the device; in response to determining that the power consumption reading exceeds the power threshold, measuring cumulative power consumption over time from the power consumption reading; comparing the cumulative power consumption over time to an energy threshold, wherein the energy threshold corresponds to a temperature threshold for the exterior surface of the device; and in response to determining that the cumulative power consumption over time exceeds the energy threshold, reducing an operating parameter of the device to reduce power consumption.

    Abstract translation: 一种方法包括：产生指示设备的功耗的功率消耗读数，将功耗读取与功率阈值进行比较，其中功率阈值表示与设备的外表面的温度升高相对应的功耗水平 ; 响应于确定所述功耗读数超过所述功率阈值，从所述功耗读数测量随时间的累积功耗; 将随时间的累积功耗与能量阈值进行比较，其中所述能量阈值对应于所述装置的外表面的温度阈值; 并且响应于确定随着时间的累积功率消耗超过能量阈值，减少设备的操作参数以降低功耗。

    THERMAL SIMULATIONS USING CONVOLUTION AND ITERATIVE METHODS
    15.
    发明申请
    THERMAL SIMULATIONS USING CONVOLUTION AND ITERATIVE METHODS 审中-公开
    使用变换和迭代方法的热模拟

    公开(公告)号：US20160092616A1

    公开(公告)日：2016-03-31

    申请号：US14502752

    申请日：2014-09-30

    Applicant: QUALCOMM Incorporated

    Inventor： Ryan Michael Coutts ,  Arpit Mittal ,  Rajat Mittal ,  Mohamed Waleed Allam ,  Mehdi Saeidi

    IPC: G06F17/50 ,  G06F17/15

    CPC classification number: G06F17/5009 ,  G06F17/15 ,  G06F17/5068 ,  G06F2217/78 ,  G06F2217/80

    Abstract: Systems and methods for performing thermal simulations of a system are disclosed herein in. In one embodiment, a computer-implemented method for thermal simulation comprises determining a leakage power profile for a circuit in the system, adding the leakage power profile to a dynamic power profile of the circuit to obtain a combined power profile, and convolving the combined power profile with an impulse response to obtain a thermal response at a location on the system.

    Abstract translation: 用于执行系统的热仿真的系统和方法在本文中公开。在一个实施例中，用于热仿真的计算机实现的方法包括确定系统中的电路的泄漏功率分布，将泄漏功率分布添加到动态功率分布 以获得组合的功率曲线，以及将组合的功率曲线与脉冲响应进行卷积以在系统上的位置处获得热响应。

    THERMAL METAL GROUND FOR INTEGRATED CIRCUIT RESISTORS
    16.
    发明申请
    THERMAL METAL GROUND FOR INTEGRATED CIRCUIT RESISTORS 有权
    用于集成电路电阻的热金属接地

    公开(公告)号：US20150237709A1

    公开(公告)日：2015-08-20

    申请号：US14181187

    申请日：2014-02-14

    Applicant: QUALCOMM Incorporated

    Inventor： Arpit Mittal ,  Alvin Leng Sun Loke ,  Mehdi Saeidi ,  Patrick Drennan

    IPC: H05K1/02 ,  H01C1/01 ,  H01C1/08

    CPC classification number: H05K1/0204 ,  H01C1/01 ,  H01C1/08 ,  H01C1/084 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/5228 ,  H01L28/20 ,  H01L28/24 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.

    Abstract translation: 金属热源用于散热集成电路电阻。 可以使用线路层的前端，例如氮化钛层来形成电阻器。 金属区域（例如，在第一金属层中）位于电阻器上方以形成散热器。 连接到金属区域的热柱的区域也位于电阻器上方。 金属区域可以连接到集成电路的基板，以提供出集成电路外的低阻抗热路径。

    High performance evaporation-condensation thermal spreading chamber for compute packages
    17.
    发明授权
    High performance evaporation-condensation thermal spreading chamber for compute packages 有权

    公开(公告)号：US10224264B1

    公开(公告)日：2019-03-05

    申请号：US15724283

    申请日：2017-10-04

    Applicant: QUALCOMM Incorporated

    Inventor： Ali Akbar Merrikh ,  Mehdi Saeidi ,  Guoping Xu ,  Damion Gastelum ,  Luis Eduardo De Los Heros Beunza ,  Ajay Vadakkepatt ,  Rama Rao Goruganthu

    IPC: H01L23/427 ,  H01L23/04

    Abstract: Aspects of the disclosure are directed to a package including a substrate, die coupled to the substrate, wick deposited on the die, and an evaporation-condensation chamber having a hollowed bottom and two bottom lips, wherein the wick mates into the hollowed enclosure and substantially merges with the two bottom lips forming a sealed chamber. Other aspects are directed to a method of forming a package including coupling a die to a substrate, depositing a wick on the die, and mating the wick with an evaporation-condensation chamber having a hollowed enclosure and two bottom lips, wherein the mating attaches the wick into the hollowed enclosure and substantially merges the wick with the two bottom lips forming a sealed chamber. By directly depositing the wick over the die and integrating the wick with the encapsulation-condensation chamber, this integrated solution provides significant improvement in package thermal resistance especially for high-power and high-performance applications.

    Adaptive thermal control and power budget
    19.
    发明授权
    Adaptive thermal control and power budget 有权

    公开(公告)号：US09983557B2

    公开(公告)日：2018-05-29

    申请号：US14882158

    申请日：2015-10-13

    Applicant: QUALCOMM Incorporated

    Inventor： Hee Jun Park ,  Rajat Mittal ,  Mehdi Saeidi

    IPC: G05D23/00 ,  G05B15/02 ,  G06F1/20

    CPC classification number: G05B15/02 ,  G06F1/1616 ,  G06F1/206

    Abstract: A method, an apparatus, and a computer program product for performance management are provided. The apparatus may be an electronic device. The electronic device detects a change of form factor mode or ambient wind using a detection circuit or at least one sensor. The change of form factor mode may include at least one of folding the electronic device, unfolding the electronic device, rolling the electronic device, changing a flexible shape of the electronic device, or equipping a cover on the electronic device. A set of thermal control parameters may be determined based on the detected change. The set of thermal control parameters may be retrieved from a lookup table or calculated using a mathematical model. The electronic device adjusts the performance based on the set of thermal control parameters.

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