公开(公告)号：US20180143862A1

公开(公告)日：2018-05-24

申请号：US15373067

申请日：2016-12-08

Applicant: QUALCOMM INCORPORATED

Inventor： Mehdi Saeidi ,  Vivek Sahu ,  Taravat Khadivi ,  Ryan Coutts ,  Ronald Alton ,  Palkesh Jain ,  Rajat Mittal

IPC: G06F9/50 ,  G06F1/20

CPC classification number: G06F9/5044 ,  G06F1/206 ,  G06F9/5094 ,  Y02D10/22

Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device, wherein a first one of the temperature sensors is physically located at a first processing unit of the computing device; processing the temperature information to identify that the first temperature sensor is associated with temperature that is at or above a threshold; and assigning a processing thread to a first core of a plurality of cores of a second processing unit in response to identifying that the first temperature sensor is associated with temperature that is at or above the threshold and based at least in part on a physical distance between the first core and the first temperature sensor.