公开(公告)号：US10224264B1

公开(公告)日：2019-03-05

申请号：US15724283

申请日：2017-10-04

Applicant: QUALCOMM Incorporated

Inventor： Ali Akbar Merrikh ,  Mehdi Saeidi ,  Guoping Xu ,  Damion Gastelum ,  Luis Eduardo De Los Heros Beunza ,  Ajay Vadakkepatt ,  Rama Rao Goruganthu

IPC: H01L23/427 ,  H01L23/04

Abstract: Aspects of the disclosure are directed to a package including a substrate, die coupled to the substrate, wick deposited on the die, and an evaporation-condensation chamber having a hollowed bottom and two bottom lips, wherein the wick mates into the hollowed enclosure and substantially merges with the two bottom lips forming a sealed chamber. Other aspects are directed to a method of forming a package including coupling a die to a substrate, depositing a wick on the die, and mating the wick with an evaporation-condensation chamber having a hollowed enclosure and two bottom lips, wherein the mating attaches the wick into the hollowed enclosure and substantially merges the wick with the two bottom lips forming a sealed chamber. By directly depositing the wick over the die and integrating the wick with the encapsulation-condensation chamber, this integrated solution provides significant improvement in package thermal resistance especially for high-power and high-performance applications.