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    Camera module having baffle between two glass substrates
    11.
    发明授权
    Camera module having baffle between two glass substrates 有权

    公开(公告)号：US10469718B2

    公开(公告)日：2019-11-05

    申请号：US15585483

    申请日：2017-05-03

    Applicant: OmniVision Technologies, Inc.

    Inventor： Tsung-Wei Wan ,  Wei-Ping Chen

    IPC: H04N5/225 ,  G03B17/08 ,  G02B23/24 ,  G02B13/00 ,  A61B1/00

    Abstract: A camera module comprises an image sensor and a lens module disposed on the image sensor. The lens module comprises a top glass structure at top of the lens module. The top glass structure includes a first glass substrate, a second glass substrate, and a baffle disposed immediately between the first and the second glass substrates. The top glass structure is an outermost layer of the camera module. The lens module also comprises a bottom glass substrate at bottom of the lens module. The bottom glass substrate is disposed on the image sensor.

    Wafer-level hybrid compound lens and method for fabricating same
    13.
    发明授权
    Wafer-level hybrid compound lens and method for fabricating same 有权

    公开(公告)号：US09804367B2

    公开(公告)日：2017-10-31

    申请号：US14932368

    申请日：2015-11-04

    Applicant: OmniVision Technologies, Inc.

    Inventor： Tsung-Wei Wan ,  Wei-Ping Chen

    IPC: G02B9/00 ,  G02B27/10 ,  G02B13/00 ,  B29D11/00 ,  G02B1/04

    CPC classification number: G02B13/0085 ,  B29D11/00307 ,  B29D11/00403 ,  B29K2995/0029 ,  G02B1/041 ,  G02B13/005

    Abstract: A hybrid compound lens includes a substrate lens and a resin lens. The substrate lens has a non-planar substrate surface surrounded by a flange having a flange surface bordering the non-planar substrate surface and forming an obtuse angle therewith. The resin lens has a non-planar resin surface adjoining the substrate lens along the non-planar substrate surface. A lens wafer includes a substrate wafer and resin lenses. The substrate wafer has a top surface having non-planar surface features each bordered by a planar region of the top surface and forming an obtuse angle therewith. Each resin lens has a non-planar resin surface adjoining the substrate wafer along a non-planar surface feature. A method for fabricating a wafer-level hybrid compound lens includes depositing a resin portion on a non-planar feature of a side of a substrate. The method also includes forming the resin portion into a lens on the non-planar feature.

    PCB-mountable lens adapter for a PCB-mountable camera module
    15.
    发明授权
    PCB-mountable lens adapter for a PCB-mountable camera module 有权
    用于PCB安装的相机模块的PCB可安装镜头适配器

    公开(公告)号：US09451137B2

    公开(公告)日：2016-09-20

    申请号：US14465292

    申请日：2014-08-21

    Applicant: OmniVision Technologies, Inc.

    Inventor： Wei-Ping Chen ,  Tsung-Wei Wan

    IPC: H04N5/225

    CPC classification number: H04N5/2254

    Abstract: A PCB-mountable lens adapter includes an adapter lens for being a component of an imaging system that has a second field of view different from the first field of view, the imaging system comprising the adapter lens and the camera lens; and an adapter housing for holding the adapter lens and for attaching to a PCB. A method for modifying the field of view of an camera module includes attaching a PCB-mountable lens adapter to a PCB, the PCB-mountable lens adapter including an adapter lens mounted in an adapter housing, the PCB being configured for surface-mounting of the camera module thereto.

    Abstract translation: 一种可安装PCB的透镜适配器，包括：适配器透镜，用于成像系统的部件，该成像系统具有与第一视野不同的第二视野，该成像系统包括适配器透镜和照相机镜头; 以及用于保持适配器透镜并用于附接到PCB的适配器壳体。 一种用于修改相机模块的视野的方法包括将PCB可安装的镜头适配器附接到PCB，所述PCB可安装的镜头适配器包括安装在适配器壳体中的适配器镜头，所述PCB被配置为用于表面安装 相机模块。

    Wafer-Level Methods For Packing Camera Modules, And Associated Camera Modules
    16.
    发明申请
    Wafer-Level Methods For Packing Camera Modules, And Associated Camera Modules 审中-公开
    用于包装相机模块和相关相机模块的晶片级方法

    公开(公告)号：US20160219203A1

    公开(公告)日：2016-07-28

    申请号：US14932075

    申请日：2015-11-04

    Applicant: OmniVision Technologies, Inc.

    Inventor： Tsung-Wei Wan ,  Wei-Ping Chen

    IPC: H04N5/225 ,  B29C45/14 ,  B29D11/00 ,  G02B13/00

    CPC classification number: H04N5/2257 ,  B29C45/14336 ,  B29C45/14467 ,  B29C45/1671 ,  B29C2045/1454 ,  B29C2045/1673 ,  B29D11/00807 ,  B29K2995/0025 ,  B29L2011/0016 ,  B29L2031/3481 ,  G02B13/0085

    Abstract: A wafer-level method for packaging a plurality of camera modules includes (a) overmolding a first housing material around a plurality of image sensors to produce a first wafer of packaged image sensors, (b) seating a plurality of lens units in the first wafer above the plurality of image sensors, respectively, and (d) overmolding a second housing material over the first wafer and around the lens units to form a second wafer of packaged camera modules, wherein each of the packaged camera modules includes one of the image sensors and one of the lens units, and the second housing material cooperates with the first housing material to secure the lens units in the second wafer.

    Abstract translation: 用于封装多个相机模块的晶片级方法包括（a）围绕多个图像传感器包覆模制第一外壳材料以产生封装的图像传感器的第一晶片，（b）将多个透镜单元放置在第一晶片中 分别在多个图像传感器之上，以及（d）在第一晶片上并围绕透镜单元包覆模制第二壳体材料以形成封装相机模块的第二晶片，其中每个封装的相机模块包括图像传感器之一 并且所述透镜单元中的一个，并且所述第二壳体材料与所述第一壳体材料协作以将所述透镜单元固定在所述第二晶片中。

    WAFER-LEVEL LENS PACKAGING METHODS, AND ASSOCIATED LENS ASSEMBLIES AND CAMERA MODULES
    17.
    发明申请
    WAFER-LEVEL LENS PACKAGING METHODS, AND ASSOCIATED LENS ASSEMBLIES AND CAMERA MODULES 审中-公开
    水平镜头包装方法和相关镜头组件和相机模块

    公开(公告)号：US20160216493A1

    公开(公告)日：2016-07-28

    申请号：US14605298

    申请日：2015-01-26

    Applicant: OmniVision Technologies, Inc.

    Inventor： Tsung-Wei Wan ,  Wei-Ping Chen ,  Jui-Yi Chiu ,  Jau-Jan Deng

    IPC: G02B13/00 ,  B29C45/00 ,  B29C45/14 ,  B29D11/00

    CPC classification number: G02B13/0085 ,  B29C45/0053 ,  B29C45/14336 ,  B29C45/14778 ,  B29C2045/14868 ,  B29D11/00307 ,  B29D11/00807 ,  B29L2011/0016

    Abstract: A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.

    Abstract translation: 包装方法适用于包装多个晶片级透镜。 每个晶片级透镜包括（a）具有相对的第一和第二表面的衬底和（b）在第一和第二表面中的至少一个上的相应透镜元件。 每个透镜元件具有背离基板的透镜表面。 该方法包括使用壳体材料部分地包围多个晶片级透镜以产生封装的晶片级透镜的晶片。 在封装的晶片级透镜的晶片中，壳体材料通过接触相应的基板来支撑多个晶片级透镜中的每一个，并且壳体被成形为分别为多个晶片级透镜形成多个壳体 。

    Suspended Lens Systems And Wafer-Level Methods For Manufacturing The Same
    18.
    发明申请
    Suspended Lens Systems And Wafer-Level Methods For Manufacturing The Same 有权
    悬挂透镜系统和晶圆级方法制造相同

    公开(公告)号：US20150333094A1

    公开(公告)日：2015-11-19

    申请号：US14276527

    申请日：2014-05-13

    Applicant: OmniVision Technologies, Inc.

    Inventor： Tsung Wei Wan ,  Wei-Ping Chen

    IPC: H01L27/146 ,  G02B13/00 ,  B32B38/00 ,  G02B7/02

    CPC classification number: H01L27/14627 ,  B32B38/0004 ,  G02B7/02 ,  G02B7/021 ,  G02B13/0085 ,  G03B17/12 ,  H01L27/14632 ,  H04N5/2254

    Abstract: A suspended lens system, for imaging a scene, includes (a) a single-piece lens for receiving light from the scene, wherein the single-piece lens includes a concave surface, and (b) a substrate including a side that faces the concave surface, for holding the single-piece lens, wherein the substrate has non-zero optical transmission and contacts only portions of the single-piece lens that are away from the concave surface. A wafer-level method for manufacturing a suspended lens system includes molding a lens array, wherein each lens of the lens array includes a concave surface, and bonding the lens array to a surface of a substrate that has non-zero optical transmission, such that the concave surfaces face the substrate, to form a suspended lens wafer.

    Abstract translation: 一种用于对场景成像的悬挂透镜系统包括（a）用于接收来自场景的光的单片透镜，其中所述单片透镜包括凹面，以及（b）基板，其包括面向所述凹面的一侧 表面，用于保持单片透镜，其中基板具有非零光学透射并且仅接触远离凹面的单片透镜的部分。 用于制造悬挂透镜系统的晶片级方法包括模制透镜阵列，其中透镜阵列的每个透镜包括凹面，并且将透镜阵列粘合到具有非零光透射的基板的表面，使得 凹面朝向基板，以形成悬挂的透镜晶片。

    Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes
    19.
    发明授权
    Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes 有权

    公开(公告)号：US12251081B2

    公开(公告)日：2025-03-18

    申请号：US17747803

    申请日：2022-05-18

    Applicant: OmniVision Technologies, Inc.

    Inventor： Teng-Sheng Chen ,  Wei-Ping Chen ,  Wei-Feng Lin ,  Jau-Jan Deng

    IPC: A61B1/00 ,  A61B1/05 ,  A61B1/06

    Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

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