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    Monitoring Incident Beam Position in a Wafer Inspection System
    11.
    发明申请
    Monitoring Incident Beam Position in a Wafer Inspection System 有权
    监测晶圆检测系统中的入射光束位置

    公开(公告)号：US20140071437A1

    公开(公告)日：2014-03-13

    申请号：US13794030

    申请日：2013-03-11

    Applicant: KLA-Tencor Corporation

    Inventor： Juergen Reich ,  Aleksey Petrenko ,  Richard Fong ,  Bret Whiteside ,  Jien Cao ,  Christian Wolters ,  Anatoly Romanovsky ,  Daniel Kavaldjiev

    IPC: G01J1/42

    CPC classification number: G01J1/4257 ,  G01N21/9501 ,  H01L21/67259 ,  H01L21/681

    Abstract: Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.

    Abstract translation: 提供了用于监测晶片检测系统中的入射光束位置的方法，系统和结构。 一种结构包括形成在卡盘中的特征，其构造成在晶片检查系统检查期间支撑晶片。 卡盘在θ方向旋转晶片，同时在检查期间沿径向方向平移晶片。 穿过特征中心的轴与卡盘的半径对准，使得轴相对于晶片检查系统的入射光束的位置指示在θ方向上的入射光束位置的变化。

    Illumination energy management in surface inspection
    15.
    发明授权
    Illumination energy management in surface inspection 有权
    表面检查中的照明能量管理

    公开(公告)号：US09194812B2

    公开(公告)日：2015-11-24

    申请号：US14336810

    申请日：2014-07-21

    Applicant: KLA-Tencor Corporation

    Inventor： Christian Wolters ,  Aleksey Petrenko ,  Kurt L. Haller ,  Juergen Reich ,  Zhiwei Xu ,  Stephen Biellak ,  George Kren

    IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95 ,  F21V23/00

    CPC classification number: G01N21/8806 ,  F21V23/003 ,  G01N21/9501 ,  G01N2021/8835

    Abstract: The disclosure is directed to a system and method of managing illumination energy applied to illuminated portions of a scanned wafer to mitigate illumination-induced damage without unnecessarily compromising SNR of an inspection system. The wafer may be rotated at a selected spin frequency for scanning wafer defects utilizing the inspection system. Illumination energy may be varied over at least one scanned region of the wafer as a function of radial distance of an illuminated portion from the center of the wafer and the selected spin frequency of the wafer. Illumination energy may be further applied constantly over one or more scanned regions of the wafer beyond a selected distance from the center of the wafer.

    Abstract translation: 本公开涉及一种管理照射能量的系统和方法，所述照明能量施加到被扫描的晶片的照明部分，以减轻照射诱发的损伤，而不会不必要地损害检查系统的信噪比。 可以以选定的旋转频率旋转晶片，以利用检查系统扫描晶片缺陷。 照射能量可以在晶片的至少一个扫描区域上作为照射部分离晶片中心的径向距离和晶片的选定旋转频率的函数而变化。 照明能量可以进一步在晶片的一个或多个扫描区域上恒定地超过距离晶片中心的选定距离。

    Surface scanning inspection system with independently adjustable scan pitch
    16.
    发明授权
    Surface scanning inspection system with independently adjustable scan pitch 有权
    表面扫描检测系统具有独立可调的扫描间距

    公开(公告)号：US09116132B2

    公开(公告)日：2015-08-25

    申请号：US14532989

    申请日：2014-11-04

    Applicant: KLA-Tencor Corporation

    Inventor： Christian Wolters ,  Juergen Reich

    IPC: G01N21/95 ,  G01N21/956

    CPC classification number: G01N21/9501 ,  G01N21/956 ,  G01N2201/06113 ,  G01N2201/103

    Abstract: A surface scanning wafer inspection system with independently adjustable scan pitch and associated methods of operation are presented. The scan pitch may be adjusted independently from an illumination area on the surface of a wafer. In some embodiments, scan pitch is adjusted while the illumination area remains constant. For example, defect sensitivity is adjusted by adjusting the rate of translation of a wafer relative to the rate of rotation of the wafer without additional optical adjustments. In some examples, the scan pitch is adjusted to achieve a desired defect sensitivity over an entire wafer. In other examples, the scan pitch is adjusted during wafer inspection to optimize defect sensitivity and throughput. In other examples, the scan pitch is adjusted to maximize defect sensitivity within the damage limit of a wafer under inspection.

    Abstract translation: 提出了具有独立可调的扫描间距和相关操作方法的表面扫描晶片检查系统。 可以独立于晶片表面上的照明区域来调整扫描间距。 在一些实施例中，在照明区域保持恒定的同时调整扫描间距。 例如，通过调整晶片相对于晶片的旋转速率的平移速率来调整缺陷灵敏度，而无需额外的光学调整。 在一些示例中，调整扫描间距以在整个晶片上实现期望的缺陷灵敏度。 在其他示例中，在晶片检查期间调整扫描间距以优化缺陷灵敏度和产量。 在其他示例中，调整扫描间距以使在检查的晶片的损伤极限内的缺陷灵敏度最大化。

    Monitoring incident beam position in a wafer inspection system
    17.
    发明授权
    Monitoring incident beam position in a wafer inspection system 有权
    监测晶圆检测系统中的入射光束位置

    公开(公告)号：US08934091B2

    公开(公告)日：2015-01-13

    申请号：US13794030

    申请日：2013-03-11

    Applicant: KLA-Tencor Corporation

    Inventor： Juergen Reich ,  Aleksey Petrenko ,  Richard Fong ,  Bret Whiteside ,  Jien Cao ,  Christian Wolters ,  Anatoly Romanovsky ,  Daniel Kavaldjiev

    IPC: G01J1/00 ,  H01L21/67 ,  G01J1/42

    CPC classification number: G01J1/4257 ,  G01N21/9501 ,  H01L21/67259 ,  H01L21/681

    Abstract: Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.

    Abstract translation: 提供了用于监测晶片检测系统中的入射光束位置的方法，系统和结构。 一种结构包括形成在卡盘中的特征，其构造成在晶片检查系统检查期间支撑晶片。 卡盘在θ方向旋转晶片，同时在检查期间沿径向方向平移晶片。 穿过特征中心的轴与卡盘的半径对准，使得轴相对于晶片检查系统的入射光束的位置指示在θ方向上的入射光束位置的变化。

    System and method for reducing radiation-induced false counts in an inspection system
    20.
    发明授权
    System and method for reducing radiation-induced false counts in an inspection system 有权

    公开(公告)号：US09841512B2

    公开(公告)日：2017-12-12

    申请号：US14946563

    申请日：2015-11-19

    Applicant: KLA-Tencor Corporation

    Inventor： Ximan Jiang ,  Anatoly Romanovsky ,  Christian Wolters ,  Stephen Biellak ,  Mous Tatarkhanov

    IPC: G01T1/24 ,  G01N21/95

    CPC classification number: G01T1/24 ,  G01N21/9501

    Abstract: An inspection system with radiation-induced false count mitigation includes an illumination source configured to illuminate a sample, a detector assembly comprising an illumination sensor configured to detect illumination from the sample, and one or more radiation sensors configured to detect particle radiation, and control circuitry communicatively coupled to the detector. The control circuitry is configured to perform the steps of determining a set of radiation detection events based on one or more radiation signals received from the radiation sensors, determining a set of imaging events based on the illumination signal received from the illumination sensor, comparing the set of radiation detection events to the set of imaging events to generate a set of coincidence events, wherein the set of coincidence events comprises simultaneous imaging and radiation detection events, and excluding the set of coincidence events from the set of imaging events to generate a set of identified defect sites.

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