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    Simultaneous multi-directional laser wafer inspection
    11.
    发明授权
    Simultaneous multi-directional laser wafer inspection 有权

    公开(公告)号：US10739275B2

    公开(公告)日：2020-08-11

    申请号：US15697386

    申请日：2017-09-06

    Applicant: KLA-Tencor Corporation

    Inventor： Guoheng Zhao ,  Sheng Liu ,  Ben-ming Benjamin Tsai

    IPC: G01N21/95 ,  G06T7/00 ,  G01N21/956 ,  G01N21/88 ,  H04N5/225 ,  H04N5/232 ,  H04N5/235

    Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample.

    METHODS AND APPARATUS FOR POLARIZED WAFER INSPECTION
    12.
    发明申请
    METHODS AND APPARATUS FOR POLARIZED WAFER INSPECTION 审中-公开

    公开(公告)号：US20180364177A1

    公开(公告)日：2018-12-20

    申请号：US15847249

    申请日：2017-12-19

    Applicant: KLA-Tencor Corporation

    Inventor： Sheng Liu ,  Guoheng Zhao

    IPC: G01N21/88 ,  G01N21/95 ,  G01N21/21

    CPC classification number: G01N21/8806 ,  G01N21/21 ,  G01N21/9501 ,  G01N2021/8848 ,  G01N2201/0683

    Abstract: This system comprises an illumination optics subsystem for generating and directing an incident beam towards a defect on a surface of a wafer. The illumination optics subsystem includes a light source for generating the incident beam and one or more polarization components for adjusting a ratio and/or a phase difference for the incident beam's electric field components. The system includes a collection optics subsystem for collecting scattered light from the defect and/or surface in response to the incident beam, and the collection optics subsystem comprises an adjustable aperture at the pupil plane, a rotatable waveplate for adjusting a phase difference of electric field components of the collected scattered light, and a rotatable analyzer. The system includes a controller for selecting a polarization of the incident beam, obtaining a defect scattering map from the defect, obtaining a surface scattering map from the background surface, and determining a configuration of the polarization components, aperture mask, rotatable waveplate, and analyzer based on analysis of the defect and surface scattering map to maximize a defect signal to noise ratio.

    Dark-Field Inspection Using A Low-Noise Sensor
    17.
    发明申请
    Dark-Field Inspection Using A Low-Noise Sensor 审中-公开
    使用低噪声传感器进行暗场检测

    公开(公告)号：US20170048467A1

    公开(公告)日：2017-02-16

    申请号：US15210056

    申请日：2016-07-14

    Applicant: KLA-Tencor Corporation

    Inventor： Yung-Ho Alex Chuang ,  David L. Brown ,  Devis Contarato ,  John Fielden ,  Daniel I. Kavaldjiev ,  Guoheng Zhao ,  Jehn-Huar Chern ,  Guowu Zheng ,  Donald W. Pettibone ,  Stephen Biellak

    IPC: H04N5/335 ,  G01N21/95 ,  G06T7/00

    CPC classification number: H04N5/335 ,  G01N21/9501 ,  G01N2021/95676 ,  H04N5/2256 ,  H04N5/347 ,  H04N5/3745 ,  H04N5/3765 ,  H04N5/378

    Abstract: An inspection system and methods in which analog image data values (charges) captured by an image sensor are binned (combined) before or while being transmitted as output signals on the image sensor's output sensing nodes (floating diffusions), and in which an ADC is controlled to sequentially generate multiple corresponding digital image data values between each reset of the output sensing nodes. According to an output binning method, the image sensor is driven to sequentially transfer multiple charges onto the output sensing nodes between each reset, and the ADC is controlled to convert the incrementally increasing output signal after each charge is transferred onto the output sensing node. According to a multi-sampling method, multiple charges are vertically or horizontally binned (summed/combined) before being transferred onto the output sensing node, and the ADC samples each corresponding output signal multiple times. The output binning and multi-sampling methods may be combined.

    Abstract translation: 一种检查系统和方法，其中由图像传感器捕获的模拟图像数据值（电荷）在作为图像传感器的输出感测节点（浮动扩散）之间的输出信号被发送之前或同时被分组（组合），并且其中ADC是 被控制以在输出感测节点的每个复位之间顺序地生成多个对应的数字图像数据值。 根据输出合并方法，驱动图像传感器以在每个复位之间顺序地将多个电荷传送到输出感测节点上，并且在每个电荷被传送到输出感测节点之后，控制ADC转换递增增加的输出信号。 根据多采样方法，在转移到输出感测节点之前，将多个电荷垂直或水平分类（相加/组合），并且ADC对每个对应的输出信号进行多次采样。 可以组合输出合并和多采样方法。

    Wafer Inspection
    19.
    发明申请
    Wafer Inspection 有权
    晶圆检验

    公开(公告)号：US20150369753A1

    公开(公告)日：2015-12-24

    申请号：US14838194

    申请日：2015-08-27

    Applicant: KLA-Tencor Corporation

    Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

    IPC: G01N21/88 ,  G01N21/95

    CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

    Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

    Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括被配置为将光脉冲引导到晶片上的区域的照明子系统; 扫描子系统，被配置为扫描穿过所述晶片的光脉冲; 配置为将从晶片上的区域散射的光脉冲成像到传感器的集合子系统，其中，所述传感器被配置为将少数散射光的脉冲的数量积分成散射光的脉冲数， 在传感器的整个区域成像，并且其中传感器被配置为响应于散射光的积分脉冲产生输出; 以及计算机子系统，被配置为使用由所述传感器产生的输出来检测所述晶片上的缺陷。

    Sample inspection system detector
    20.
    发明授权
    Sample inspection system detector 有权
    样品检测系统检测器

    公开(公告)号：US09086389B2

    公开(公告)日：2015-07-21

    申请号：US14062832

    申请日：2013-10-24

    Applicant: KLA-Tencor Corporation

    Inventor： Daniel Ivanov Kavaldjiev ,  Stephen Biellak ,  Guoheng Zhao ,  Mehdi Vaez-Iravani

    IPC: G01N21/00 ,  G01N21/95 ,  H01L27/144

    CPC classification number: G01N21/9501 ,  H01L27/1446

    Abstract: Methods and systems for enhancing the dynamic range of a high sensitivity inspection system are presented. The dynamic range of a high sensitivity inspection system is increased by directing a portion of the light collected from each pixel of the wafer inspection area toward an array of avalanche photodiodes (APDs) operating in Geiger mode and directing another portion of the light collected from each pixel of the wafer inspection area toward another array of photodetectors having a larger range. The array of APDs operating in Geiger mode is useful for inspection of surfaces that generate extremely low photon counts, while other photodetectors are useful for inspection of larger defects that generate larger numbers of scattered photons. In some embodiments, the detected optical field is split between two different detectors. In some other embodiments, a single detector includes both APDs operating in Geiger mode and other photodetectors having a larger range.

    Abstract translation: 介绍了提高高灵敏度检测系统动态范围的方法和系统。 高灵敏度检测系统的动态范围通过将从晶片检查区域的每个像素收集的光的一部分引导到以盖革模式操作的雪崩光电二极管（APD）阵列并且引导从每个 晶片检查区域的像素朝向具有较大范围的另一个光电检测器阵列。 以Geiger模式操作的APD阵列对于检查产生极低光子数的表面是有用的，而其他光电探测器可用于检查产生更大数量的散射光子的较大缺陷。 在一些实施例中，检测到的光场在两个不同的检测器之间被分开。 在一些其他实施例中，单个检测器包括以盖革模式操作的APD和具有较大范围的其它光电探测器。

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