Apparatus for High-Speed Imaging Sensor Data Transfer

    公开(公告)号:US20180059033A1

    公开(公告)日:2018-03-01

    申请号:US15671729

    申请日:2017-08-08

    摘要: An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.

    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS
    7.
    发明申请
    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS 审中-公开
    固态成像装置和成像装置

    公开(公告)号:US20170013238A1

    公开(公告)日:2017-01-12

    申请号:US15273289

    申请日:2016-09-22

    申请人: Sony Corporation

    发明人: Tetsuji Yamaguchi

    摘要: The present technique relates to a solid-state imaging device and an imaging apparatus that enable provision of a solid-state imaging device having superior color separation and high sensitivity.The solid-state imaging device includes a semiconductor layer 11 in which a surface side becomes a circuit formation surface, photoelectric conversion units PD1 and PD2 of two layers or more that are stacked and formed in the semiconductor layer 11, and a longitudinal transistor Tr1 in which a gate electrode 21 is formed to be embedded in the semiconductor layer 11 from a surface 15 of the semiconductor layer 11. The photoelectric conversion unit PD1 of one layer in the photoelectric conversion units of the two layers or more is formed over a portion 21A of the gate electrode 21 of the longitudinal transistor Tr1 embedded in the semiconductor substrate 11 and is connected to a channel formed by the longitudinal transistor Tr1.

    摘要翻译: 固态成像装置包括表面侧成为电路形成面的半导体层11,层叠并形成在半导体层11中的两层以上的光电转换单元PD1和PD2,以及纵向晶体管Tr1 栅电极21形成为从半导体层11的表面15嵌入到半导体层11中。两层或更多层的光电转换单元中的一层的光电转换单元PD1形成在部分21A 位于半导体衬底11中的纵向晶体管Tr1的栅电极21,并连接到由纵向晶体管Tr1形成的沟道。

    Time delay and integration scanning using a CCD imager
    9.
    发明授权
    Time delay and integration scanning using a CCD imager 有权
    使用CCD成像仪进行延时和集成扫描

    公开(公告)号:US09402042B2

    公开(公告)日:2016-07-26

    申请号:US14052251

    申请日:2013-10-11

    申请人: Thorlabs, Inc.

    IPC分类号: H04N5/372 H04N5/353

    摘要: A method for operating a focal plane array in a Time Delay Integration (TDI) mode, the method including: shifting a number of rows during TDI integration, wherein the number of rows shifted is less than a total number of rows of the focal plane array; and reading out a number of rows equal to the total number of rows of the focal plane array minus the number of rows shifted, leaving behind the partially-integrated rows.

    摘要翻译: 一种用于在时间延迟积分(TDI)模式中操作焦平面阵列的方法,所述方法包括:在TDI积分期间移动多个行,其中移位的行数小于焦平面阵列的总行数 ; 并且读出等于焦平面阵列的总行数减去移动的行数的行数,留下部分集成的行。