公开(公告)号：US6165813A

公开(公告)日：2000-12-26

申请号：US416127

申请日：1995-04-03

Applicant: Kraig A. Quinn ,  Brian T. Ormond ,  Josef E. Jedlicka

Inventor： Kraig A. Quinn ,  Brian T. Ormond ,  Josef E. Jedlicka

IPC: G02B27/00 ,  B41J2/155 ,  B41J2/16 ,  H01L21/98 ,  H01L27/14 ,  H01L29/06 ,  H01L33/00 ,  H04N1/028 ,  H01L21/00 ,  H01L21/30 ,  H01L21/46

CPC classification number: H01L25/50 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1635 ,  B41J2202/19 ,  B41J2202/20 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips.

Abstract translation: 用于全页幅扫描器的光传感器阵列或全页宽喷墨打印机的半导体芯片安装在基板上，以保持相邻芯片之间的合理一致的间隔。 为了从阵列中除去有缺陷的芯片，衬底被均匀地推向限定凸弓的工作表面。 或者，沿着芯片的邻接边缘提供背切，并且围绕这些背切切割的硅可被锯掉以将有缺陷的芯片与邻近的好的芯片隔开。

公开(公告)号：US5604362A

公开(公告)日：1997-02-18

申请号：US603513

申请日：1996-02-20

Applicant: Josef E. Jedlicka ,  Brian T. Ormond ,  Debra S. Vent

Inventor： Josef E. Jedlicka ,  Brian T. Ormond ,  Debra S. Vent

IPC: G02B5/20 ,  H01L21/02 ,  H01L27/14 ,  H01L31/0216 ,  H01L27/148

CPC classification number: H01L31/02162

Abstract: In a photosensitive chip suitable for full-color imaging, separate photosites on the chip correspond to different primary colors in an original image. Each primary-color photosite is filtered with a polyimide doped to a particular primary color. The red-filtering layer and the blue-filtering layer are left on the non-photosensitive portions of the main surface of the chip, and together serve as a non-reflective area which prevents stray reflections from the chip. The chip is further provided with a base layer of infrared-filtering polyimide.

Abstract translation: 在适用于全彩色成像的感光芯片中，芯片上的独立照片对应于原始图像中的不同原色。 用掺杂到特定原色的聚酰亚胺过滤每个原色的光亮度。 红色滤光层和蓝色滤色层留在芯片的主表面的非感光部分上，并且一起用作防止来自芯片的杂散反射的非反射区域。 芯片还设置有红外滤光聚酰亚胺的基层。

公开(公告)号：US5219796A

公开(公告)日：1993-06-15

申请号：US787444

申请日：1991-11-04

Applicant: Kraig A. Quinn ,  Brian T. Ormond ,  Josef E. Jedlicka

Inventor： Kraig A. Quinn ,  Brian T. Ormond ,  Josef E. Jedlicka

IPC: H01L21/304 ,  H01L21/78 ,  H01L31/18

CPC classification number: H01L21/78 ,  H01L21/304 ,  H01L31/1804 ,  Y02E10/547 ,  Y10S148/028

Abstract: An improved process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays with minimal chipping and fracturing wherein the active side of a wafer is etched to form separation grooves with the wall of the grooves adjoining the die presenting a relatively wide surface to facilitate sawing, wide grooves are cut in the inactive side of the wafer opposite each separation grooves, and the wafer cut by sawing along the separation grooves, the saw being located so that the side of the saw blade facing the die is aligned with the midpoint of the wide wall so that on sawing the bottom half of the wall and the remainder of the grooves are obliterated leaving the top half of the wall to prevent cracking and chipping during sawing.

Abstract translation: 用于形成具有允许模具与其它类似模具组装的面的单个模具的改进方法，以形成具有最小碎裂和断裂的一个和/或二维扫描阵列，其中晶片的活性侧被蚀刻以形成具有 与模具相邻的槽的壁具有相对宽的表面以便于锯切，在与每个分隔槽相对的晶片的不活动侧中切割宽槽，并且通过沿着分隔槽锯切切割晶片，锯定位成使得 面对模具的锯片的侧面与宽壁的中点对准，从而在锯切壁的下半部分时，其余的凹槽被消除，留下壁的上半部分以防止锯切过程中的开裂和碎裂。

公开(公告)号：US06927381B2

公开(公告)日：2005-08-09

申请号：US10656622

申请日：2003-09-05

Applicant: Paul A. Hosier ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Gaurav Sharma ,  Alain E. Perregaux ,  Robert P. Herloski

Inventor： Paul A. Hosier ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Gaurav Sharma ,  Alain E. Perregaux ,  Robert P. Herloski

IPC: G06T1/00 ,  H01L27/146 ,  H04N1/028 ,  H04N1/191 ,  H04N5/369 ,  H04N9/083 ,  H01L27/00

CPC classification number: H01L27/14645 ,  H01L27/14621

Abstract: A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.

Abstract translation: 用于在整个可见光谱上记录图像的光敏成像装置包括一组光敏元件，其在约600nm处具有围绕光谱的橙色部分的峰值响应。 峰响应通过组合响应，在一种情况下，与允许红色或红外波长的滤波器相关联的光电传感器以及与允许橙色波长和更长的滤波器相关联的光电传感器的响应。 在另一种情况下，光电传感器被构造为衰减更长的波长，其与允许橙色和较长波长的滤波器组合可以模拟在光谱的橙色部分周围的峰值行为。

公开(公告)号：US08368002B2

公开(公告)日：2013-02-05

申请号：US12580028

申请日：2009-10-15

Applicant: Paul A. Hosier ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Paul S. Bonino

Inventor： Paul A. Hosier ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Paul S. Bonino

IPC: G01J3/50 ,  G01J3/42

CPC classification number: G01J3/2803 ,  G01J3/12 ,  G01J3/26 ,  G01J3/51 ,  G01J3/513 ,  G01J2003/1234

Abstract: A photosensitive apparatus including a full width array of photosensors and a first photosensor chip. The first photosensor chip including a linear array of photosensors having a plurality of pixels arranged in a long direction and a linear variable filter adapted to transmit at least ten unique bandwidths of wavelengths of light along a length of the linear variable filter where the linear variable filter is fixedly secured to the linear array. Each respective pixel receives a unique bandwidth of wavelengths of light as a light passes through the linear variable filter and the length is aligned with the long direction. The full width array of photosensors is arranged perpendicular to a process direction of a printing device.

Abstract translation: 一种感光装置，包括全光束传感器阵列和第一光电传感器芯片。 第一光传感器芯片包括具有沿长方向布置的多个像素的光电传感器的线性阵列和适于沿着线性可变滤波器的长度传输至少十个唯一的波长波长的线性可变滤波器，其中线性可变滤波器 固定地固定在线性阵列上。 当光线通过线性可变滤波器并且长度与长方向对准时，每个像素接收光的波长的唯一带宽。 光传感器的全宽阵列垂直于打印装置的处理方向布置。

公开(公告)号：US06998595B2

公开(公告)日：2006-02-14

申请号：US09802792

申请日：2001-03-08

Applicant: Paul A. Hosier ,  Thomas Grimsley ,  Josef E. Jedlicka

Inventor： Paul A. Hosier ,  Thomas Grimsley ,  Josef E. Jedlicka

IPC: H01L27/00

CPC classification number: H01L27/14687 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14632 ,  H01L27/14685

Abstract: An architecture and manufacturing method for photosensitive chips, such as used in office equipment and digital cameras, involves creating grooves between chip areas in a wafer, and then placing a light-transmissive planar layer over the main surface of the wafer. The planar layer, which may be acrylic-based, creates a substantially planar surface over both the photosites in the chip areas and the grooves. The planar layer in turn supports one or more light-transmissive filtering layers. The arrangement avoids damage to the filtering layers when the wafer is diced along the grooves.

公开(公告)号：US06316284B1

公开(公告)日：2001-11-13

申请号：US09656879

申请日：2000-09-07

Applicant: Alain E. Perregaux ,  Josef E. Jedlicka

Inventor： Alain E. Perregaux ,  Josef E. Jedlicka

IPC: H01L2100

CPC classification number: H01L27/14643 ,  H01L27/14685

Abstract: The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.

Abstract translation: 本发明一般涉及用于扫描图像的数字扫描仪。 更具体地，本发明涉及一种用于增强通过滤出数字数据的红外分量而获得的扫描图像的质量以提供增强的数字图像的方法和装置。

公开(公告)号：US06266438B1

公开(公告)日：2001-07-24

申请号：US09162097

申请日：1998-09-28

Applicant: David J. Metcalfe ,  Dawn M. Williams-Fuller ,  Joseph P. Taillie ,  Josef E. Jedlicka

Inventor： David J. Metcalfe ,  Dawn M. Williams-Fuller ,  Joseph P. Taillie ,  Josef E. Jedlicka

IPC: G06K900

CPC classification number: H04N1/56 ,  H01L27/14601 ,  H04N1/603

Abstract: A color space transformation device includes a sensor bar. The sensor bar includes a plurality of sensor chips. Each sensor chip scans a unique section of an original image to produce first data in a first color space. A memory means stores groups of coefficients. Each group of coefficients corresponds to one of the sensor chips. A processor independently transforms each of the sections of the first data to a respective section of a second data. The transformation is performed as a function of one of the groups of coefficients corresponding to the sensor chip which produced the first data.

Abstract translation: 色空间变换装置包括传感器条。 传感器棒包括多个传感器芯片。 每个传感器芯片扫描原始图像的唯一部分以在第一颜色空间中产生第一数据。 存储器装置存储系数组。 每组系数对应于传感器芯片之一。 处理器将第一数据的每个部分独立地变换为第二数据的相应部分。 作为与产生第一数据的传感器芯片对应的系数组之一的函数执行变换。

公开(公告)号：US4954197A

公开(公告)日：1990-09-04

申请号：US330664

申请日：1989-03-30

Applicant: Josef E. Jedlicka ,  Ewart O. LeBlanc ,  Judith A. Masseth

Inventor： Josef E. Jedlicka ,  Ewart O. LeBlanc ,  Judith A. Masseth

IPC: H04N1/028 ,  B41J3/28 ,  B41J3/44 ,  H01L21/58 ,  H01L27/146

CPC classification number: B41J2/155 ,  H01L24/29 ,  H01L24/83 ,  B41J2002/14362 ,  B41J2202/20 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T156/1759 ,  Y10T29/49901 ,  Y10T29/53178 ,  Y10T29/53552

Abstract: A process for fabricating a full width array in which plural smaller chips are bonded end-to-end onto the metallic covering of an elongated substrate by an electrically conductive heat activated adhesive, in which a photocurable adhesive is used to temporarily retain the smaller chips in position while the heat activated adhesive is cured, the process accommodating the inability to cure the photocurable adhesive through the opaque chips and substrate covering by locating the photocurable adhesive so that it extends outside of the boundary of the smaller chips and forms an adhesive fillet or bridge between one side of the smaller chips and the substrate when cured by ultraviolet light.In an alternate embodiment, the photocurable adhesive is located within the boundary of the smaller chips initially but is squeezed out from below the smaller chips to form the exposed adhesive bridge when the smaller chips are placed on the substrate.

公开(公告)号：US06646248B2

公开(公告)日：2003-11-11

申请号：US09841279

申请日：2001-04-24

Applicant: Paul A. Hosier ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Gaurav Sharma ,  Alain E. Perregaux ,  Robert P. Herloski

Inventor： Paul A. Hosier ,  Jagdish C. Tandon ,  Josef E. Jedlicka ,  Gaurav Sharma ,  Alain E. Perregaux ,  Robert P. Herloski

IPC: H01L2700

CPC classification number: H01L27/14645 ,  H01L27/14621

Abstract: A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.