公开(公告)号：US11794278B2

公开(公告)日：2023-10-24

申请号：US17289011

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi Sakamoto ,  Junji Okuma

IPC: B23K26/08 ,  B23K26/351 ,  B23K26/06 ,  B23K101/40

CPC classification number: B23K26/0823 ,  B23K26/0604 ,  B23K26/0853 ,  B23K26/0884 ,  B23K26/351 ,  B23K2101/40

Abstract: A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

公开(公告)号：US11465235B2

公开(公告)日：2022-10-11

申请号：US16343034

申请日：2017-10-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji Okuma

IPC: B23K26/064 ,  H01L21/67 ,  B23K26/067 ,  B23K26/352 ,  G02B1/00 ,  G02B1/04 ,  G02B27/14 ,  G02F1/1335 ,  G02F1/1337 ,  G02F1/1343

Abstract: There is provided a laser light irradiating device that includes a spatial light modulator configured to modulate laser light output from a laser light source according to a phase pattern and emit the modulated laser light, an objective lens configured to converge the laser light emitted from the spatial light modulator onto the object, a focusing lens arranged between the spatial light modulator and the objective lens in an optical path of the laser light and configured to focus the laser light, and a slit member arranged at a focal position on a rear side of the focusing lens in the optical path of the laser light and configured to block a part of the laser light.

公开(公告)号：USD920398S1

公开(公告)日：2021-05-25

申请号：US29689279

申请日：2019-04-29

Applicant: HAMAMATSU PHOTONICS K.K.

Designer： Junji Okuma ,  Takeshi Sakamoto

公开(公告)号：US10309836B2

公开(公告)日：2019-06-04

申请号：US15331036

申请日：2016-10-21

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji Okuma ,  Yasunori Igasaki ,  Yasunaga Nara

IPC: G01B9/02 ,  G01J9/02

Abstract: A collimation evaluation device includes a first reflection member, a second reflection member, a screen, and a housing. A first reflection surface of the first reflection member and a first reflection surface of the second reflection member face each other and are parallel to each other. Further, interference fringes are formed on the screen by light L12 reflected on the first reflection surface of the first reflection member and a second reflection surface of the second reflection member and light L21 reflected on a second reflection surface of the first reflection member and the first reflection surface of the second reflection member, and collimation of incident light is evaluated on the basis of a direction of the interference fringes.

公开(公告)号：US12157187B2

公开(公告)日：2024-12-03

申请号：US17288620

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi Sakamoto ,  Junji Okuma

IPC: B23K26/53 ,  B23K26/04 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/08 ,  B23K103/00

Abstract: A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points.

公开(公告)号：USD1013746S1

公开(公告)日：2024-02-06

申请号：US29760852

申请日：2020-12-04

Applicant: HAMAMATSU PHOTONICS K.K.

Designer： Junji Okuma ,  Takeshi Sakamoto

Abstract: FIG. 1 is a front view of a laser processing machine of the present invention;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a front, top and left side perspective view thereof;
FIG. 8 is a rear, bottom and right side perspective view thereof;
FIG. 9 is a sectional view thereof with inner mechanism is omitted taken along the line 9-9 in FIG. 3;
FIG. 10 is an enlarged sectional view thereof with inner mechanism is omitted taken along the line 10-10 in FIG. 3 of the portion defined by the lines 1001-1001 in FIGS. 3 and 1002-1002 in FIG. 6; and,
FIG. 11 is an enlarged view thereof defined by the lines 1101-1101 and 1102-1102 in FIG. 6.
The dash dot dash broken lines define the bounds of the claimed design and form no part thereof.
The broken lines depict portions of a laser processing machine that form no part of the claimed design.

公开(公告)号：US11484968B2

公开(公告)日：2022-11-01

申请号：US16078220

申请日：2017-01-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji Okuma

IPC: B23K26/06 ,  B23K26/53 ,  B23K26/00 ,  B23K26/064

Abstract: A laser light irradiation device includes: a laser light source; a spatial light modulator including a display unit, the spatial light modulator modulating the laser light in accordance with a phase pattern displayed on the display unit; a beam diameter conversion mechanism arranged on an optical path of the laser light between the laser light source and the spatial light modulator, the beam diameter conversion mechanism enlarging or reducing the beam diameter of the laser light; a lens insertion and removal mechanism including a lens configured to vary the beam diameter of the laser light, the lens insertion and removal mechanism being enabled to insert/remove the lens in/from the optical path; and a controller configured to control the phase pattern to be displayed. The controller displays the phase pattern configured to correct a wavefront aberration caused by insertion or removal of the lens.

公开(公告)号：US11428520B2

公开(公告)日：2022-08-30

申请号：US17040800

申请日：2018-12-21

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji Okuma

IPC: G01B11/02 ,  G01B11/14 ,  G02B7/10 ,  G01B11/06 ,  B23K26/03

Abstract: A distance measurement unit includes: a distance measurement light source that outputs distance measurement light; an objective lens through which the distance measurement light and reflected light are transmitted; an imaging lens through which the reflected light is transmitted and which forms an image at an imaging position; an optical path adjustment unit that adjusts an optical path of the reflected light; and a light detection unit that detects the reflected light. The objective lens allows the distance measurement light to be transmitted therethrough in a state in which an optical path of the distance measurement light is spaced apart from a central axis of the objective lens. The optical path adjustment unit adjusts the optical path so that the imaging position of the reflected light approaches a predetermined plane. A light reception surface of the light detection unit is located to follow along the predetermined plane.

公开(公告)号：USD921068S1

公开(公告)日：2021-06-01

申请号：US29689310

申请日：2019-04-29

Applicant: HAMAMATSU PHOTONICS K.K.

Designer： Junji Okuma ,  Takeshi Sakamoto

公开(公告)号：US10758999B2

公开(公告)日：2020-09-01

申请号：US15752685

申请日：2016-08-08

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji Okuma ,  Yo Sugimoto

IPC: B23K26/03 ,  B23K26/53 ,  B23K26/06 ,  B23K26/08 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/00 ,  B23K101/40 ,  B23K103/00

Abstract: The object to be processed cutting method includes: a crystal orientation identifying step of identifying a crystal orientation of the substrate; a line to cut setting step of setting, for the object to be processed, a line to cut passing through a street region formed between adjacent functional devices, after the crystal orientation identifying step; and a cutting step of cutting the object to be processed along the line to cut, after the line to cut setting step. In the line to cut setting step, in a case where an extending direction of the street region does not match the crystal orientation, the line to cut parallel to the crystal orientation and inclined with respect to the extending direction of the street region, is set for the object to be processed.