公开(公告)号：US10548240B1

公开(公告)日：2020-01-28

申请号：US16246013

申请日：2019-01-11

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

IPC: H05K7/20 ,  F28F3/02 ,  H01L23/473

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member that includes a first number of inlet ports and a second number of outlet ports that are in fluid communication with a cooling liquid flow path defined through the heat transfer member, the first number of inlet ports being different that the second number of outlet ports.

公开(公告)号：US10548239B1

公开(公告)日：2020-01-28

申请号：US16167905

申请日：2018-10-23

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Gregory Sizikov ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  Teckgyu Kang

IPC: H05K7/20 ,  H05K7/14

Abstract: A cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.

公开(公告)号：US20210366807A1

公开(公告)日：2021-11-25

申请号：US16880417

申请日：2020-05-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

公开(公告)号：US20210064107A1

公开(公告)日：2021-03-04

申请号：US17082953

申请日：2020-10-28

Applicant: Google LLC

Inventor： Shawn Emory Bender ,  Jorge Padilla

IPC: G06F1/20 ,  H05K7/20

Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.

公开(公告)号：US10852789B1

公开(公告)日：2020-12-01

申请号：US16936254

申请日：2020-07-22

Applicant: Google LLC

Inventor： Shawn Emory Bender ,  Jorge Padilla

IPC: H05K7/20 ,  G06F1/20

Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.

公开(公告)号：US10761577B1

公开(公告)日：2020-09-01

申请号：US16555831

申请日：2019-08-29

Applicant: Google LLC

Inventor： Shawn Emory Bender ,  Jorge Padilla

IPC: H05K7/20 ,  G06F1/20

Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.

公开(公告)号：US20190327859A1

公开(公告)日：2019-10-24

申请号：US15957161

申请日：2018-04-19

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

IPC: H05K7/20

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

公开(公告)号：US12272619B2

公开(公告)日：2025-04-08

申请号：US17971087

申请日：2022-10-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

公开(公告)号：US20240057297A1

公开(公告)日：2024-02-15

申请号：US18047207

申请日：2022-10-17

Applicant: Google LLC

Inventor： Jorge Padilla ,  Reza Khiabani ,  Madhusudan Krishnan Iyengar

IPC: H05K7/20

CPC classification number: H05K7/2079

Abstract: Methods, systems, and apparatus for liquid coolant replacement in a cooling distribution unit during operation of the cooling distribution unit. Active liquid coolant to be replaced is removed from the flow cycle of the cooling distribution unit while the coolant distribution unit is operational and providing cooling to an electronic system. Additionally, replacement liquid coolant is provided to the flow cycle while the coolant distribution unit is operational and providing cooling to an electronic system.

公开(公告)号：US11042200B2

公开(公告)日：2021-06-22

申请号：US17082953

申请日：2020-10-28

Applicant: Google LLC

Inventor： Shawn Emory Bender ,  Jorge Padilla

IPC: H05K7/20 ,  G06F1/20

Abstract: An apparatus that first and second volumes are fluidly separated by a combination of a first second and a second sections, where the first section is insoluble to a cooling liquid and the second section is soluble to the cooling liquid. In the event of a leak of coolant liquid, the second sections dissolve, forming a fluid path from the first volume to the second volume. The coolant liquid may then escape the first volume in spaces that result from the dissolution of the second sections.