DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
    11.
    发明申请
    DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME 有权
    显示面板和显示装置,包括它们

    公开(公告)号:US20160267827A1

    公开(公告)日:2016-09-15

    申请号:US15007856

    申请日:2016-01-27

    Abstract: A display panel includes pixels connected to each of gate lines and data lines. Each of the pixels includes a first transistor connected between a corresponding data line among the data lines and a first node and configured to deliver a data signal of the corresponding data line to the first node in response to an input signal received through a corresponding gate line among the gate lines, a reflective element circuit connected to the first node, and configured to implement the reflective mode in response to a signal of the first node when a first mode selection signal indicates a reflective mode, an emissive element circuit connected to a second node, and configured to implement the emissive mode in response to the signal of the first node when the mode selection mode indicates an emissive mode.

    Abstract translation: 显示面板包括连接到每条栅极线和数据线的像素。 每个像素包括连接在数据线中的对应数据线和第一节点之间的第一晶体管,并且被配置为响应于通过对应的栅极线接收的输入信号将对应的数据线的数据信号传送到第一节点 在所述栅极线之间,连接到所述第一节点的反射元件电路,并且被配置为当第一模式选择信号指示反射模式时,响应于所述第一节点的信号来实现所述反射模式;连接到第二节点的发射元件电路 并且被配置为当模式选择模式指示发射模式时响应于第一节点的信号来实现发射模式。

    ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
    14.
    发明申请
    ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    电子设备及其制造方法

    公开(公告)号:US20150348800A1

    公开(公告)日:2015-12-03

    申请号:US14610410

    申请日:2015-01-30

    Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

    Abstract translation: 本发明提供一种电子器件的制造方法,该方法包括:制备包括元件区域和布线区域的载体衬底; 在载体基板上形成牺牲层; 在元件区域的牺牲层上形成电子元件; 在布线区域的第一弹性层上形成具有波纹状表面的第一弹性层; 在布线区域的第一弹性层上形成电连接电子元件的金属配线; 在所述第一弹性层上形成覆盖所述金属布线的第二弹性层; 在所述电子元件上方的所述第二弹性层的凹部中形成高刚性图案,以与所述电子元件重叠,并具有波纹状表面; 在第二弹性层上形成第三弹性层和高刚性图案; 并分离载体衬底。

Patent Agency Ranking