公开(公告)号：US11330702B2

公开(公告)日：2022-05-10

申请号：US17079970

申请日：2020-10-26

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

公开(公告)号：US20210337657A1

公开(公告)日：2021-10-28

申请号：US17079970

申请日：2020-10-26

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

公开(公告)号：US10735039B1

公开(公告)日：2020-08-04

申请号：US16593239

申请日：2019-10-04

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Joel Richard Goergen ,  Mike Sapozhnikov ,  David Nozadze ,  Amendra Koul ,  Upendranadh Reddy Kareti

IPC: H04B1/12 ,  H04L25/03 ,  H04B1/04

Abstract: In one embodiment, a transmission system includes a transmitter, a receiver, and a filter operable at one of the transmitter and the receiver to remove channel impairments. The filter is operable according to a sum of a Gaussian function and a reciprocal of cosine function, wherein the Gaussian and reciprocal of cosine functions comprise tunable parameters to account for skew and channel asymmetry.

公开(公告)号：US20250063658A1

公开(公告)日：2025-02-20

申请号：US18449817

申请日：2023-08-15

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  David Nozadze ,  Joel Richard Goergen ,  Wenbin Ma ,  Upen Reddy Kareti ,  Weiying Ding

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

Abstract: In some embodiments, an apparatus, includes a pad of a printed circuit board (PCB) configured to couple to an electrical component separate from the PCB and a via formed through the pad. The via is offset from a center of the pad such that a distance between the via and a most adjacent trace electrically separate from the via is above a threshold distance.

公开(公告)号：US20250031300A1

公开(公告)日：2025-01-23

申请号：US18451477

申请日：2023-08-17

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Amendra Koul ,  David Nozadze ,  Joel Richard Goergen ,  Upen Reddy Kareti ,  Sayed Ashraf Mamun

IPC: H05K1/02

Abstract: Provide for herein is an apparatus that includes multiple printed circuit board (PCB) layers and a via assembly. The via assembly includes a signal via extending through the multiple layers, and the signal via is configured to transmit a signal between the layers. The via assembly also includes a capacitive structure connected to the signal via to adjust an impedance of the via assembly along the via assembly. The capacitive structure is physically and electrically separate from other components of the PCB.

公开(公告)号：US20250029931A1

公开(公告)日：2025-01-23

申请号：US18453720

申请日：2023-08-22

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Amendra Koul ,  David Nozadze ,  Joel Richard Goergen ,  Sayed Ashraf Mamun ,  Srinath Penugonda

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/522 ,  H01L25/00 ,  H01L25/10

Abstract: In some embodiments, an integrated circuit (IC) includes multiple packages that are separate from one another. Each package includes a pad, and a core via is electrically coupled to the pads of the separate packages to electrically couple the packages to one another. At least one of the pads includes an oblong shape to match its impedance with the impedance of the core via.

公开(公告)号：US20240356251A1

公开(公告)日：2024-10-24

申请号：US18455803

申请日：2023-08-25

Applicant: Cisco Technology, Inc.

Inventor： David Nozadze ,  Mike Sapozhnikov ,  Amendra Koul ,  Sayed Ashraf Mamun ,  Upen Reddy Kareti

IPC: H01R12/53 ,  H01R12/55 ,  H05K1/14

CPC classification number: H01R12/53 ,  H01R12/55 ,  H05K1/144 ,  H01R43/007 ,  H05K1/0219 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/10356

Abstract: In some aspects, the techniques described herein relate to an apparatus for connecting cables to Input Output (IO) connector pins, including: a first Printed Circuit Board (PCB) configured to receive terminal ends of a plurality of cables, wherein the terminal ends of the plurality of cables are electrically isolated from one another in the first PCB; a second PCB configured to receive a plurality of IO connector pins, wherein the plurality of IO connector pins are electrically isolated from one another in the second PCB; and wherein the first PCB is configured to join to the second PCB to connect each of the terminal ends of the plurality of cables to corresponding pins of the plurality of IO connector pins.

公开(公告)号：US11706870B2

公开(公告)日：2023-07-18

申请号：US17503690

申请日：2021-10-18

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K3/46 ,  H05K1/09

CPC classification number: H05K1/09 ,  H05K3/4644 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2203/1545

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

公开(公告)号：US20210337666A1

公开(公告)日：2021-10-28

申请号：US17006016

申请日：2020-08-28

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K1/09 ,  H05K3/46

Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.

公开(公告)号：US10674598B1

公开(公告)日：2020-06-02

申请号：US16596623

申请日：2019-10-08

Applicant: CISCO TECHNOLOGY, INC.

Inventor： David Nozadze ,  Amendra Koul ,  Joel Richard Goergen ,  Mike Sapozhnikov

IPC: H05K1/02 ,  H05K1/11 ,  H01P3/08 ,  H05K3/40 ,  H01P11/00 ,  H01P7/08 ,  H05K3/00

Abstract: In one embodiment, an apparatus includes a printed circuit board, a via-stub resonator formed in the printed circuit board, a plurality of vias surrounding the via-stub resonator, and a microstrip connected to the via-stub resonator for use in measuring an insertion loss to provide a resonance frequency. The via-stub resonator is designed to reproduce a dielectric constant value of a known material in a simulation. A via dielectric constant in an x and y plane is calculated based on the resonance frequency. A method for measuring the via dielectric constant using the via-stub resonator is also disclosed herein.