公开(公告)号：US20250107055A1

公开(公告)日：2025-03-27

申请号：US18390757

申请日：2023-12-20

Applicant: Cisco Technology, Inc.

Inventor： Wenbin Ma ,  Shiqing He ,  Yong Wu ,  Joel Richard Goergen ,  Mike Sapozhnikov ,  Xinghai Tang ,  Dewen Xu ,  Haiying Zhu

IPC: H05K9/00 ,  H05K1/02

Abstract: Presented herein is a printed circuit board (PCB) assembly with an absorber having a perforated structure. The absorber is positioned between a trace of a PCB and a connector that couples the PCB to an enclosure. The absorber includes a perforated structure to maintain an integrity of a signal propagated along the trace, while improving electromagnetic interference and/or electromagnetic compatibility properties.

公开(公告)号：US20250133652A1

公开(公告)日：2025-04-24

申请号：US18532182

申请日：2023-12-07

Applicant: Cisco Technology, Inc.

Inventor： Yuqing Zhu ,  Wenbin Ma ,  Mike Sapozhnikov ,  Weiying Ding ,  Mingjian Gao ,  Mingtong Zuo ,  David Nozadze ,  Joel Richard Goergen

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K3/40

Abstract: In some embodiments, an apparatus includes a layer of a printed circuit board (PCB), a pair of signal vias formed on the layer of the PCB and including a first signal via a second signal via each configured to propagate a respective signal, a first plurality of ground vias formed on the layer and at least partially circumferentially surrounding the first signal via of the pair of signal vias, and a second plurality of ground vias formed on the layer and at least partially circumferentially surrounding the second signal via of the pair of signal vias. The first plurality of ground vias and the second plurality of ground vias include a shared ground via.

公开(公告)号：US20240355737A1

公开(公告)日：2024-10-24

申请号：US18304001

申请日：2023-04-20

Applicant: Cisco Technology, Inc.

Inventor： Wenbin Ma ,  Mike Sapozhnikov ,  Weiying Ding ,  David Nozadze ,  Yinxin Yang

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/48

CPC classification number: H01L23/5286 ,  H01L21/76898 ,  H01L23/481

Abstract: In some aspects, the techniques described herein relate to an apparatus including: a semiconductor device substrate material; a first signal conductor incorporated into the semiconductor device substrate material; a second signal conductor incorporated into the semiconductor device substrate material; and a ground conductor incorporated into the semiconductor device substrate material between the first signal conductor and the second signal conductor, wherein the ground conductor includes a first elongated portion and a second elongated portion arranged at an angle relative to the first elongated portion.

公开(公告)号：US20250063658A1

公开(公告)日：2025-02-20

申请号：US18449817

申请日：2023-08-15

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  David Nozadze ,  Joel Richard Goergen ,  Wenbin Ma ,  Upen Reddy Kareti ,  Weiying Ding

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

Abstract: In some embodiments, an apparatus, includes a pad of a printed circuit board (PCB) configured to couple to an electrical component separate from the PCB and a via formed through the pad. The via is offset from a center of the pad such that a distance between the via and a most adjacent trace electrically separate from the via is above a threshold distance.